1 Quality Assurance - industrial.panasonic.com · ensure the stable operation of manufacturing...

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1 Quality Assurance

Transcript of 1 Quality Assurance - industrial.panasonic.com · ensure the stable operation of manufacturing...

1 Quality Assurance

Contents

1.1 Quality Assurance Philosophy 1- 1

1.1.1 Panasonic corporate ideology 1- 1

1.1.2 Panasonic quality management 1- 1

1.1.3 Quality policy for Semiconductor Business Group,

Industrial Devices Company 1- 2

1.2 Product Groups and Organization of

Industrial Devices Company

the Semiconductor Business Group,

1- 4

1.3 Quality System for Semiconductor Devices 1- 6

1.3.1 Role of quality assurance section for

Semiconductor Business Group,

Industrial Devices Company 1- 6

1.3.2 Quality assurance system 1- 7

1.3.3 Quality assurance contract 1- 9

1.3.4 Design control 1-10

1.3.5 Documentation control 1-12

1.3.6 Quality assurance system for parts and

materials 1-13

1.3.7 Ensuring traceability 1-14

1.3.8 Process control 1-14

1.3.9 Inspection process 1-16

1.3.10 Control of equipment and measuring

instruments 1-17

1.3.11 Corrective actions and preventive measures 1-18

1.3.12 Handling of problems at customer side 1-19

1.3.13 Quality assurance system for packaging 1-20

1.3.14 Distribution quality 1-20

1.3.15 Quality auditing 1-20

1.3.16 Quality education 1-21

1.3.17 Small group activities 1-22

1.3.18 ISO 9000s and ISO/TS16949 certification status

in the Semiconductor Business Group,

Industrial Devices Company 1-22

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1. Quality Assurance

1.1 Quality Assurance Philosophy

1.1.1 Panasonic corporate ideologySince our founding in 1918, all corporate bodies in the Panasonic Group advocate the corporate

ideology of the general plan: “We will fulfill our true position as an industry and work for the change and

improvement of society, and will anticipate opportunities to contribute to the advancement of world

culture.” Specifically, we have promoted carrying out our activities as a single entity based on the slogan

“To provide products of infinitely high quality to society, and offer a rich electric lifestyle to people.”

Based on this philosophy, we believe in truly serving customers by constantly conforming to the desires

of customers and society and offering products and services that provide satisfaction, and we have

evolved numerous yearly, medium-term, and long-term management guidelines in this regard.

1.1.2 Panasonic quality managementTo make this general plan a reality, all Panasonic business locations work to provide true CS (customer

satisfaction) by rapidly grasping global standards and needs and quickly responding to them, and aiming to

offer products with not only convenience and comfort, but also assuring product safety, assuring reliabil-

ity, and achieving good productivity. Further, through cooperation with parts and materials suppliers, we

are working hard to realize quality management with the aim of contributing to our stockholders.

Since 1993, the Panasonic Group has developed the Q-MAP (currently called P-QMS) evaluation

system, and has been promoting involvement in the improvement of quality. This P-QMS is a system for

performing internal auditing of Panasonic Group business locations from the viewpoint of both the quality

assurance system and the quality results of all business locations of the entire Panasonic Group, and

assigns rank to each location. For the system, there are of course some contributions from ISO 9000s, but a

major evaluation viewpoint is the Panasonic quality philosophy − whether it fits the Panasonic brand in

both name and reality, and whether it will be accepted by customers.

In 1996, the “New QIG” (New Quality Independence Guarantee) was introduced to improve the quality

of items purchased by the Panasonic Group. This system is a system for increasing the quality assurance

level of parts and materials suppliers by performing an overall evaluation from the viewpoint of both the

quality assurance system and the quality results.

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1.1.3 Quality policy for Semiconductor Business Group, Industrial Devices Company We have received the Panasonic Group quality policy of “truly serving customers by constantly

conforming to the desires of customers and society and offering products and services that provide

satisfaction”, and in order to secure quality closer to the origin with the aim of customer satisfaction or in

other words achieving the satisfaction of society, have published and are implementing the following three

policies:

1) Thorough focus on customer as the first priority.

Offer 100% good products.

Achieve quality and reliability that satisfies a wide range of usage conditions.

Provide comprehensive quality service.

Be kind to the earth.

2) Thorough focus on quality at origin.

Weave quality in from the planning and design stages.

Thoroughly grasp performance limits and analysis of quality and reliability characteristics.

3) Ensuring global quality.

Create a comprehensive overall quality assurance system and management system.

Perform comprehensive standardization throughout the world.

These policies require the promotion of activities that can respond to the demands of customers for Q

(functions/quality), C (cost), D (delivery), and S (service) as well as S (safety) and E (environmental

characteristics) in all stages from product planning through design/development, production, sales,

marketing, etc. A variety of educational and training opportunities have been prepared for carrying out

these activities in reality in order to improve the specialized knowledge, skills, morale, and work efficiency

of all members of the Semiconductor Business Group, Industrial Devices Company.

1) Thorough focus on customer as the first priority.

For our group, “customer” includes not just the set makers that directly use our semiconductor

devices, but also encompasses the customers who use those sets (general consumers), parts and materials

manufacturers, collaborating companies, etc. or in other words everyone that supports our group. This

follows the general plan of Panasonic.

As the first step from set makers for satisfying the final customers who use the product, it is necessary

to start by offering 100% excellent products that can be manufactured at high yield. In order to ensure

these “excellent products”, it is essential to sufficiently understand the wide range of usage conditions of

the customer and to ensure the quality (basic functions, performance, reliability, safety, price/performance,

environmental characteristics, etc.) that can satisfy those conditions. In addition, we feel that it is our

responsibility as the manufacturer to prepare various types of quality data that can help the customer to

use the product and obtain 100% of the provided quality.

2) Thorough focus on quality at origin.

Not only for higher-level products with advanced functionality and vertical startup of mass production

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but also to create a more robust quality structure from various aspects such as more economical quality,

reliability, and safety, etc., we aim to improve the design completeness of our semiconductor devices by

performing thorough and comprehensive design review and weaving quality into our design rules by

evaluating the reliability of fundamental technology during the initial stages of planning and design. For

mass production, it is essential to not only perform source control of parts and materials but also to

ensure the stable operation of manufacturing equipment.

 In addition, we perform thorough evaluation and analysis of the reliability of semiconductor devices,

and by clearly understanding the product limits (life, performance, etc.) and further, the end-of-life

product safety, we can provide customers with high-level quality service as well as helping to improve the

quality and reliability of not only semiconductor devices but also higher-level products in upstream chain

before completing sets. In order to achieve this ensuring and thorough focus on quality at origin, we

promote cooperation with customers and sharing of establishment of proprietary technology and quality

technology and estimation forecasting technology.

3) Ensuring global quality.

 For customers and parts and materials manufacturers, and furthermore, to cope with the global

expansion of manufacturing and sales bases, it is necessary to construct a global quality management

system for effective utilization of information. In this way, it becomes possible to handle the

diversification of demanded quality and cope with product liability. In addition, by obtaining certification

under the ISO 9000s international standards for quality assurance systems and maintaining and improving

the system, establishment of a comprehensive quality assurance system and management system can be

performed, which can respond to the trust of customers.

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OverseasAffiliate Companies

System LSI Business Unit

Industrial Devices Company

Semiconductor Business Group

DomesticAffiliate Companies

ASSP Business Unit

Power & Optical Devices Business Unit

Manufacturing Division

Solution Promotion Division

PT. Panasonic Industrial Devices Indonesia: PIDID

Panasonic Semiconductor Asia Pte. Ltd.: PSCA

Panasonic Industrial Devices (Shanghai) Co., Ltd.: PIDSH

Panasonic Semiconductor (Suzhou) Co., Ltd.: PSCSZ

Panasonic Industrial Devices Discrete SemiconductorCo., Ltd.: PIDDSC

Panasonic Industrial Devices Optical SemiconductorCo., Ltd.: PIDOSC

Image Sensor Business Unit

Panasonic Corporation

1.2 Product Groups and Organization of the

a) Semiconductor devices researched, developed, manufactured, and sold by the

System LSIs

Bipolar ICs

Image Sensor

Compound Devices

Discrete Devices (Transistors, Diodes)

b) Semiconductor organization

The that handles semiconductor business in

is comprised of four business units and two promote divisions plus various

overseas affiliate companies and domestic affiliate companies. The organization of the Semiconductor

Business Group, Industrial Devices Company is shown in Figure 1.1

Figure 1.1 Organization of Semiconductor

Semiconductor Business Group,

Business Group, Industrial Devices Company

Industrial Devices Company

Semiconductor

Business Group, Industrial Devices Company:

Business Group, Industrial Devices Company

Semiconductor Business Group Industrial Devices Company,

Panasonic Corporation

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: Production factory

: Manufacturing-related company

Arai Factory

Uozu Factory

Tonami Factory

Global Manufacturing Center

Okayama Factory

Panasonic Industrial Devices (Shanghai) Co., Ltd.: PIDSH

Panasonic Semiconductor (Suzhou) Co., Ltd.: PSCSZ

Panasonic SemiconductorAsia Pte. Ltd.: PSCA

PT. Panasonic Industrial DevicesIndonesia: PIDID

Japan

Other Countries

Panasonic Industrial Devices DiscreteSemiconductor Co., Ltd.: PIDDSC

Panasonic Industrial Devices OpticalSemiconductor Co., Ltd.: PIDOSC

The manufacturing bases of Semiconductor Business Group in Japan and in other countries are shown in

Figure 1.2. There are 6 bases in Japan (Tonami, Uozu, Arai, Okayama, Kagoshima, and Shirakawa) and 4

bases in other countries (Singapore, Indonesia, Shanghai, and Suzhou).

Figure 1.2 Manufacturing Bases in Japan and Other Countries

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1.3 Quality System for Semiconductor Devices

Industrial Devices Company

Industrial DevicesCompany

1.3.1 Role of quality assurance section for Semiconductor Business Group,

SemiconductorBusiness Group

In order to make the aforementioned quality policy a reality, Semiconductor Business Group,

Industrial Devices Company possesses the quality assurance system shown in Figure 1.3.

Figure 1.3 Quality Assurance System

At Semiconductor Business Group, for direct control we have established the Global Quality Control

Center as well as factory quality sections in each manufacturing factory as part of our efforts to make the

quality policy a reality.

The Global Quality Control Center carries out identification of process quality and reliability, development

of evaluation and analysis technology, measurement control including calibration of measuring devices,

handling of product complaints from users, adjustments and solutions for quality themes both within and

outside of the Semiconductor Business Group, Industrial Devices Company, and quality education and training.

The factory quality sections carry out process quality control on the manufacturing lines, product quality

control, and verification of the quality and reliability of each product to promote quality stabilization as well

as promote and develop various improvement activities.

These quality activities are intended to be shared throughout the Semiconductor Business Group, Industrial

Devices Company through quality meetings, etc. in order to make adjustments to carry out unified activities.

Corporate Engineering QualityAdministration DivisionPanasonic Corporation

Quality ControlLife End Product SafetyEnvironmental ProductManagementWafer process ReliabilityEngineeringAssembly ReliabilityEngineeringQuality Assurance

Factory QualitySection

(Manufacturingprocess

quality control)Image Sensor Business Unit

System LSI Business Unit

ASSP Business Unit

Power & Optical Devices Business Unit

Solution Promotion Division

Global Quality Control Center

DomesticFactories

DomesticAffiliateCompanies

OverseasAffiliateCompaniesManufacturing Division

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Main flow Meeting

Flow Work process

Investigation/Inspection

StageExternal

party Planning Business

Process evaluation; Design;

Development

Applicable technology Manufacturing

Quality control

Production technology

Materials; Purchasing

Production control

Measurement control; Etc.

Establishment of standard documents

Management meeting

Planning Market research

Business plan

Required specifications

Sales plan

Preliminary plan

Development plan

New product development meeting (development decision)

Determination of specifications; Product design

Design review

Development test production release meeting

Development test production

Design review

Mass production test production release meeting

Production plan

Inspection plan

Evaluation of quality/reliability

Long-term control test

Intermediate inspection

Quality inspection of long-term-

storage products

Customer complaints

Mass production test production

Mass production

Diffusion process

Assembly process

Shipping inspection

Warehousing

ShipmentShipment instructions

Receiving orders

Delivery

Reporting; Treatment

Final inspection

Creation of standards and standard documents

Mass production release meeting

Establishment of standards and standard documents

Quality investigation

Quality meeting

Treatment of quality abnormalities

Recurrence prevention committee

Approval of parts/materials

Evaluation of quality/reliability

Market

Development design

Development test production

Mass production test production

Mass production

Use

Customer

Customer

Collaborating companies

Parts/materials

manufacturers

Managem

ent and c

alib

ration o

f m

easuring e

quip

ment

(Sto

ck c

ontr

ol)

Managem

ent of sta

ndard

s a

nd s

tandard

docum

ents

Technic

al contr

ol of w

ork

ers

; sm

all

gro

up a

ctivitie

s

Ordering

Receiving inspection

Customer

Market

Parts specifications

Materials specifications

Product standards

Product specifications

New product evaluation standard

Inspection standards

Work procedures

Diffusion process control network

Assembly process control network

Receiving inspection specifications

New-QIG

Purchasing specifications

Periodic control standards

Quality report

Recurrence prevention databank

Lot control

1.3.2 Quality assurance system

 In order to ensure the quality and reliability of products that match customer needs and offer them in a

timely manner, we have established and operate quality systems that meet international standards starting

with ISO 9000s as well as conforming to industry and customer needs at all product stages from planning

through development, design, test production, evaluation, mass production, shipment, marketing, to

service. Our quality assurance system of products is shown in Figure 1.4.

Figure 1.4 Product Quality Assurance System

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1) Planning stage

 While investigating and studying customer needs and requests from a variety of aspects, we conduct

market research and furthermore clarify the technical demands and prospects, and conduct a development

planning review to verify the target quality. Based on the verified target quality, the development

specifications are decided on and a development plan is established, and the product commercialization is

decided.

2) Development stage

 Design policy to make the decided development specifications a reality is reviewed. This review is an

examination of the characteristics of the parts, materials, and process and of topics related to quality and

reliability. Then, the designed circuits are examined to verify that the expected electrical characteristics can

be obtained. After that, work on the mask design is performed. In the stages up until now, verification is

performed from a variety of aspects, with particular care and attention focused on quality and reliability.

For semiconductor devices with high-level functionality, product design, structural design, and circuit

design interact in complicated ways, so these examinations are extremely important.

3) Development test production/Mass production test production

 In the development test production stage, verification of achievement of aimed characteristics, quality

and reliability in design process is performed. In the mass production test production stage, investigations

are performed to make sure of the process quality with mass production products and verify that the

manufacturing conditions are optimal for ensuring that the target quality is achieved. After verifying that

the target levels for functional characteristics, quality, reliability, etc. have been achieved by the test

production products, the product is shifted to mass production.

4) Mass production stage

 In order to maintain uniform, stable quality, in addition to establishing process control network for

every stage from receiving of parts and materials until shipment, a computerized system for quality

information management, feedback, and feed-forward has been introduced and is being developed.

 Further, for ensuring quality, we have introduced methods for ensuring the stability and reliability of

facilities and equipment and SPC (statistical process control) methods, and are developing various

activities based on the ISO 9000s quality system for carrying out education, training, small-group

activities, measurement/weight management, quality records management, environmental activities,

revision control activities, etc. of quality of workers and engineers.

 Moreover, periodic reliability testing is performed to verify that there are no problems with long-term

reliability in mass production products.

5) Use stage

 For the rare occasion when a problem occurs at the customer side or in the market, we examine the

customer usage conditions and the product quality records, analyze the problem, investigate the cause, and

feed back countermeasures to manufacturing and technology divisions as well as activities for diffusion of

information and preventing recurrences.

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 These various activities are recognized at the organizational and individual levels of all areas included in

the quality assurance system and in addition, in each stage of the quality assurance process, the P-D-C-A

(Plan-Do-Check-Action) cycle is operated continually to provide continual advancement of the creation of

quality through maintenance and improvement. For this purpose, placing importance on contact with

customers in all aspects is essential.

1.3.3 Quality assurance contract

 Semiconductor devices are used in an ever-widening range of applications and are built into large

numbers of electronic devices.

 During the use period of electronic devices and the equipment or systems containing such devices, not

only the functions and performance but also their safety is demanded.

 The quality, reliability, and safety of electronic devices, etc. are in fact greatly affected by the quality

and reliability of the semiconductor devices used therein and their use methods. In addition, although

ensuring the quality, reliability, and safety of electronic devices during their use period can be considered

to be the role of the electronic device makers, we ourselves as manufacturers of semiconductor devices also

have a very strong interest.

 To ensure the quality, reliability, and safety of electronic devices, etc., it is important for a partnership

to be created centered on the electronic device manufacturer and including all related businesses (such as

passive components makers, mechanical parts makers, etc.), and for each member of that partnership to

fulfill their roles.

 With this background, we conclude a “Contract/Agreement Related to Quality Assurance” as an

addendum to basic trading agreements, etc. defining the points that each party should follow and clarifying

what actions should be performed to ensure, maintain, and improve the specified quality.

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1.3.4 Design control

 In order to manufacture and offer products which match the purpose of use, thoroughly verifying the

specifications requested by the user and thoroughly investigating and understanding the use conditions,

and then feeding back that information to the design is important. Because of this, in the planning stage

after clarifying the customer requirements (requested specifications, quantity, delivery, price), a broad

investigation of product use conditions or set circuit conditions, mounting/assembly conditions, etc. is

carried out, and then a development plan for the new product is created. At this time, whether there are

any problems or omissions with the development targets and basic development principles in the planning

stage is verified and checked by conducting a development planning review.

 After that, before design starts, a design policy review is conducted in which the principles of the

design methods and test methods, parts and materials, process development specifications, reliability

examination, etc. are examined. For the reliability examination, points in the circuit, wafer process,

assembly process, etc. that are newly added in order to satisfy the customer’s required specifications are

determined, and whether or not there are issues regarding quality and reliability due to those points is

examined. Then, for the examination of any issues, what verification methods, etc. can be used is

examined, what evaluation circuits or evaluation elements are necessary for such methods is determined,

and a verification plan is established. An example of this is the reliability evaluation performed by the

TEG (Test Element Group), which is an effective method for evaluating the reliability of circuit designs

and processes for ICs and LSIs with complex functions built in. It is used at the time of implementation of

a new process, and is utilized for the estimation and investigation of the relationship between malfunction

mode and malfunction mechanism, relationship between malfunction cause and manufacturing cause, etc.

From the examinations using this TEG, we are working hard to establish detailed design rules for circuit

design, pattern design, structural design, process design, etc., and promote efficient design without

omissions.

 After the start of design, in the circuit design inspection, the validity of the target specifications and

product standards are verified, and at the time of ordering the mask, a mask design inspection is conducted

to check the completeness of development and design and extract any issues for the time of mass

production shipment. At the test production stage, the prototype product is used to verify various types

of product characteristics, function, reliability, and safety as a design inspection. At this stage, evaluation

by the customer is also performed. Prior to moving to the mass production stage, the test programs,

various work standards, etc. that are necessary for mass production are assembled, and a final product

inspection relative to mass production is conducted.

 This design quality assurance system is shown in Figure 1.5.

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Development plan review Verification of target quality

Examination of characteristics and reliability

of parts, materials, and processes

Verification of target specifications

focusing on electrical characteristics

Verification of quality and reliability

of development test production

Verification of quality and

reliability for mass production

Technical requests from market

Quality assurance activities

Decision of commercialization

Design policy review

Circuit design

Circuit design inspection

Mask design

Mask design inspection

Mask ordering

Test production

Design inspection

Creation of manufacturing

specification documents

Evaluation by customer

Approval

Decision on mass production

Decision on shipment

Start of mass production

Product inspection (New product

factory introduction meeting)

Prototype evaluation. Function characteristics evaluation. Safety. Reliability

Decision on development specifications

Development plan

Mass production

Test production

Development

Planning

Requests from customers

Standardization; Creation of

work standards

Assurance of quality and

reliability of standard product

Figure 1.5 Design Quality Assurance System

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Adoption/rejection decision

Standardization committee

Various related departments

Official in charge

Implementation Regulation documents control

Executive office of standardization

committee

4

5

2

6

18

3

9 7

7

Deliberation Draft

Registration

Application for establishment/revision/discontinuation

Establishment; Distribution

Pu

blica

tion

Ap

pro

val o

f a

do

ptio

n/re

jectio

n

Note: Numbers in figure indicate steps in workflow.

1.3.5 Documentation control

 At Panasonic, in order to grasp and act on comments from customers and to respond appropriately to

customer needs as rapidly as possible, the work from planning and design to shipment has been

standardized to enable systematic and timely advancement and improvement of work.

 For this purpose, we have created standard documents (regulations and standard forms) that clarify the

handling, storage location and period, and responsibility for all documents such as company regulations,

specification documents, contracts, laws and regulations, industry-group related documents, safety

documents, technical data, documents related to negotiations with administrative organizations, etc., and

these documents are controlled so that work always proceeds based on the newest versions. The storage

period for these documents is defined to be in conformance to the related laws and regulations.

 At Panasonic, regulation document types are classified and managed as described below and the

establishment of regulation documents is performed. In addition, through these activities, we strive to

satisfy all customers throughout the world regarding not only product functions and reliability but also

price, delivery, service characteristics, safety, environmental conservation, resource utilization, etc.

1) Classification

 Regulation documents are classified into the following 7 types:

 1. Regulations 2. Standards 3. Technical standards 4. Specifications documents

 5. Procedure documents 6. Instructions 7. Manuals

2) Maintenance, improvement, publication

 For each regulation document, drafting (creation of a proposal and submission to an inspection

committee), maintenance, improvement, publication, and implementation are carried out under the

responsibility of 18 work functions, including development, materials, production engineering, quality, etc.

3) Establishment, revision, verification, discontinuation system

 The procedures for establishment, revision, verification, and discontinuation of regulation documents

are shown in Figure 1.6.

Figure 1.6 Procedures for Establishment, Revision, Verification, and Discontinuation

of Regulation Documents

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Contracting with cooperating company

ReceivingManufacturing Section

Technology SectionQuality Section

Cooperating company approval

Mate

rials

/Purc

hasin

g S

ection

Selection

Investigation/observation

Process change notification

Supply of various documents

Pro

ble

m

no

tifica

tio

n

Periodic meeting

1.3.6 Quality assurance system for parts and materials

 With higher levels of functionality and reliability for semiconductor devices, the importance of quality

control of the parts and materials needed in manufacturing processes, such as semiconductor substrates,

lead frames, fine wires for wire bonding, packages, various chemicals, etc., is increasing. For this purpose,

we introduced the New QIG (New Quality Independence Guarantee) system with the aim of improving

the quality of purchased items. This system is a system for working together with parts and materials

makers to increase the quality assurance level of purchased items by performing an overall evaluation from

the viewpoint of both the quality assurance system and the quality results, and clarifying the purchase

method standards (receiving inspection, etc.) according to the quality assurance level.

 Further, for some processes the processing is contracted out to cooperating companies. Even when

contracting out processing, after verifying the work details, various conditions, quality standards, and

organizational system with the person responsible for the work at the cooperating company, a product is

run through the actual line and inspected to verify whether or not it meets our quality standards, and

factory approval is then issued accordingly. Documents that accompany factory approval, such as

processing drawings, inspection standards (shipping, receiving), inspection methods, handling of

problems, prior notification of process changes, etc., are exchanged according to the internal rules. After

factory approval, quality meetings, process auditing, etc. are conducted to work for maintenance and

improvement of quality. The Panasonic standards for selecting cooperating companies are as follows:

1) The management of the cooperating company understands our management policy and is cooperative.

2) The company possesses the required level of technical expertise, and the price level is reasonable.

3) The company protects secrets thoroughly.

4) Transportation, communication, etc. are easy.

The quality assurance system for contracted processing is shown in Figure 1.7.

Figure 1.7 Quality Assurance System for Contracted Processing

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 Ex.: Date: April 3, 2007 Indication: 743      

  Date: April 23, 2007 Indication: 743

 Please note that different labeling may be used depending on the product type.

1.3.8 Process control

 The manufacturing process is where the quality and reliability intended by the design is made into an

actual product. Quality assurance in manufacturing is regulated by the strictly examined process control

network (QC process diagram), and the parts, materials, equipment, conditions, environment, and

monitoring characteristics are constantly controlled to prevent any causes of unreliability from being

overlooked. In order to maintain uniformly stable quality, the particularly important control items in the

1.3.7 Ensuring traceability All products display the manufacturing year and month, and a control number (precise number) that can

be used for verifying the manufacturing history is applied. The manufacturing history includes the

manufacturing equipment and worker as well as information on the parts and materials lot numbers. An

example of the application of the number is shown below.

For the manufacturing year and month, the following two methods are mainly used.

1) Method 1

Eight characters of alphanumeric characters are used, with the first four indicating the last digit of the

year (1 character), the week (2 characters), and the manufacturing factory (1 character) in that order,

and the remaining 4 (or fewer) characters indicating the individual date code for each Business Unit.

Definition of week 1

According to ISO 8601, the beginning of the week is Monday, and the week of that year that includes

January 4 is set as the first week.

The definition and code for the manufacturing factory is set according to each product group.

For products that cannot be labeled in this way due to the shape being small, a separate method is

used.

2) Method 2

Three characters of alphanumeric characters or symbols are used, indicating the last digit of the year (1

character), the month (1 character), and the last digit of the date (1 character) in that order.

For the month, the months up to and including September are indicated with numerals. For the

months of October and later, the first letter of the month (“O” for October, “N” for November, and

“D” for December) is used.

The period within the manufacturing month is indicated by the presence/absence of a bar (-, -) and

the position of the bar if present. A bar above the month character indicates the first period, no bar

above or below the month character indicates the middle period, and a bar below the month character

indicates the last period.

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Receiving inspection

Oxidation

Oxidation inspection

Photolithography

Visual inspection

Ion implantation

Chip electrical characteristics inspection

Dicing

Breaking, selection

Die inspection

Die bonding

Die bonding inspection

Wire bonding

Wire bonding inspection

Sealing/molding

Stabilization baking

Lead surface finishing

Finishing inspection

Marking

Lead cutting; FormingElectrical characteristics inspection of all productsAppearance inspection of all products

Packaging

Quality assurance inspection

Shipment

Appearance; Dimensions; Warpage; Resistivity

Appearance; Membrane thickness; Surface cleanliness

Development characteristics;Etching characteristics; Line width

Main device characteristics; Electrical characteristics

Appearance

Appearance; Bonding strength

Appearance; Tensile strength

Heating; Time contaminationWire flow characteristics

Components; Temperature;StainingThickness; Uniformity (soldered characteristics);Plating composition; Plating thicknessTemperature; TimeMarking characteristicsMold cut characteristics; Mold dimensionsElectrical characteristics

Appearance

Packaging specifications; QuantityElectrical characteristics; Appearance

Improper dimensions; Scratches; Removal of products with crystal defects; Ensuring resistance values

Determining pinholes; Checking membrane thickness and surface cleanliness; Membrane thickness control

Development acceptance/rejection; Pattern checking; Line width control

Ensuring device characteristicsRemoval of products with faulty electrical characteristics

Removal of cracked or chipped products

Ensuring quality of die bonding

Ensuring quality of wire bondingEnsuring wire tensile strength

Ensuring forming characteristicsEnsuring wire shape

Ensuring finishing quality

Removal of products with faulty plating

Ensuring quality of plating

Ensuring marking quality

Abnormal stress on resin section; Breakage prevention; DimensionsRemoval of products with faulty electrical characteristics

Removal of products with faulty appearance

Verification of quality of products for shipment

Wafers

Lead frame

Wire

Sealing resin

Note:

: Materials introduction

: Processing

: Inspection process

Receiving inspection

Receiving inspection

Receiving inspection

Process Control purposeControl item

process control network are input into statistical process control (SPC) methods with the aim of their

stabilization. The quality information from the various control items indicated in this process control

network (QC process diagram) are used as data for quality improvement as well as being utilized for data

for design, and play a role in quality maintenance and improvement.

 Further, from the aspect of building the designed quality into the product, the consciousness of each

individual worker toward quality is of the utmost importance, and through small group activities such as

QC circles, etc. the quality consciousness of all workers is increased with the aim of individual work

improvements.

 An example of general process control for semiconductor devices is shown in Figure 1.8.

Figure 1.8 Example of General Process Control for Semiconductor Devices

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Shipment

(Specific products)

(All products)

(Periodic sampling)

(Lot sampling)

(Periodic sampling)

Shipment inspection

Reliability testing

Final inspection

Screening

Manufacturing

Thermal cycle; Burn in

Static characteristics testing;

Dynamic characteristics testing;

Function inspection; Appearance inspection

Appearance and electrical characteristics;

Thermal environment testing;

Mechanical environment testing;

Humidity resistance testing;

Soldering characteristics testing;

Terminal strength testing;

High-temperature storage life testing;

Operating life testing

Electrical characteristics; Appearance;

High-temperature operation testing;

High-temperature testing

Soldering characteristics testing and electrical

characteristics testing that conduct lot inspection

as necessary of warehoused products

Warehousing

1.3.9 Inspection process

 During manufacturing there are numerous inspection processes, and the data from those processes are

not used only as data for ensuring product quality, but are also used as data indicating the levels of various

types of quality in each process and are fed back to the design and development stages, equipment

control, etc.

 In the final process of manufacturing section, inspection of all products is performed. By inspecting all

products, an initial quality of 100% good products can be obtained. Further, to ensure various types of

quality and reliability, sampling for shipment inspection and periodic testing are performed for

verification, and whether or not the products satisfy the various demands of customers is verified. An

overview of the inspection process is shown in Figure 1.9.

Figure 1.9 Overview Diagram of Inspection Processes

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1.3.10 Control of equipment and measuring instruments

a) Equipment control

 In order to ensure products that have high quality and high reliability, the equipment for semiconductor

manufacturing requires high precision and high reliability. Because of this, inspection to introduce new

equipment is performed at the design stage to ensure that the required characteristics can be obtained.

Further, for mass production equipment, startup verification and periodic inspection based on standards is

performed before the start of use. In addition, for daily inspection, standards are set for items that will

affect quality and reliability characteristics in each process, and those control parameters are checked.

b) Measurement control

 The manufacturing of semiconductors is characterized by high-temperature, ultra-fine, multi-layer

processing. Because of this, Panasonic performs thorough control of the measuring equipment which is

necessary for manufacturing with high accuracy. Panasonic has been designated by the Ministry of

Economy, Trade, and Industry (METI) as a Proper Measurement Control Business Place under the

Measurement Act, recognizing that a system for performing measurement control has been established. In

addition, for calibration technology, Panasonic has been accredited as an International MRA-compatible

JCSS Accredited Organization (JCSS0135), recognizing Panasonic as an internationally trusted

organization. Calibration of measuring equipment is performed by a specialized section, recognized

calibration organization, or accredited calibration business, and is definitely traceable to an international

standard or national standard. Calibration frequency is defined for each measuring instrument and the

viewpoint of repeatable accuracy is also taken into consideration. Measuring instruments that have been

calibrated are affixed with a label specifying the expiration date and are controlled by the Measurement

Instrument Use Section. The Measurement Instrument Use Section ensures that the Calibration Section

performs calibration of the measuring instrument prior to the expiration date to ensure the accuracy of

measuring instruments. The relationship to national standards is shown in Figure 1.10.

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Figure 1.10 Semiconductor Business Group, Industrial Devices CompanyCalibration Traceability System Diagram

1.3.11 Corrective actions and preventive measuresWhen a problem occurs with a product or manufacturing process, countermeasure management of that

product or process is performed promptly. Cause investigation and analysis are performed, and the details

of measures to prevent recurrence from the root cause are determined. When the details of measures

include changes of procedures, materials, processes, or systems, problems due to the change details are

sufficiently verified and evaluated, and corrective actions and preventive measures are performed.

Depending on the details of the corrective actions or preventive measures, prior approval is obtained from

the customer.

After performing corrective actions and preventive measures, the results are investigated, and it is

verified that the expected effects were obtained.

The details from abnormality occurrence to countermeasures are promptly provided to related sections,

and are recorded in quality records. In addition, for recurrence prevention and horizontal development, a

quality report is created, which plays a role in preventing recurrence. This quality report is added to the

overall Panasonic Group database, and is utilized in design, development, and checking during process

change review to prevent recurrence.

Traceability Diagram for Semiconductor Business Group, Industrial Devices Company, Panasonic Corporation (PC)

National Standard

Official Standard supplyOrganizationsCalibration Organizationsspecified by minister ofeconomy, trade and industryOrganizations certified byminister of METI

Medium StandardPC Standard Semiconductor Business

Group, Industrial DevicesCompany Standard

MeasuringInstrument

National Institure ofAdvanced Industrial

Science and TechnologyAIST

Length, Luminosity,Time, Current, Mass,

Temperature, Quantity

CommunicationsResearchLaboratory

CRL(Std wave, Time)

Overseas StandardInstiture

NIST etc.Electricity,

Temperature, Illuminance

Japan Bearing Inspection Institute

(JBI)(Length)

Corporate Engineering

QualityAdministration

Division PC

LightingBusinessGroup,

Eco SolutionsCompany

Measuring

Global QualityControl Center

Semiconductor BusinessGroup, Industrial Devices

Company

ControlTeam

Site/Factory

LengthMassTime

ElectricityTemperatureIlluminance

Others

Japan Quality Assurance Organization

(JQA)(Length, Electricity)

Japan Electric Meters Inspection Corporation

(JEMIC)Electricity,

Temperature, Illuminance

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Returned product

(Lot)

Analysis request

(Single product)

Complaint report

Receipt of response

ReceivingSending of response

Malfunction analysis Report

Decision on handlingVerification of

countermeasure

Improvement countermeasure

Re-inspection Disposal Standardization

Customer

Sales section

Quality control section

Manufacturing/

Engineering sections

1.3.12 Handling of problems at customer side

 After product shipment, if a problem occurs with a product, the product may be returned by customer

request or a request from Panasonic. In such case, the sales section will investigate the usage equipment,

usage conditions, usage period, and malfunction occurrence status, and together with the quality section,

will strive to rapidly solve the problem at the customer side. The quality section will work together with

design section, manufacturing section, etc. to clarify the cause of the malfunction, feedback the information

to design or manufacturing process, and will strive their best for quality maintenance and improvement

and to prevent recurrence. In addition, in order to ensure high quality and high reliability, even for minor

problems, information on problem details, status, etc. will be requested the customer to be offered. The

handling status of such problems at the customer side is reported to the customer by sales section upon

demand. The system diagram for countermeasure treatment of problems at the customer side is shown in

Figure 1.11.

Figure 1.11 System diagram for countermeasure treatment of problems at customer side

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1.3.13 Quality assurance system for packagingA variety of packaging forms are provided, including packaging to protect products from stress during

distribution, trays, magazines, tapes, or anti-humidity packaging for them which take into consideration

the mounting process at the customer side. These packaging forms also meet industry standard

regulations. In addition, we perform packaging using environmentally-friendly materials.

Each packaging is designed and inspected by the Packaging Technology Committee according to the

packaging standards created based on industry standards, examples of countermeasures to past problems

with packaging, distributing, mounting processes, etc., environmental assessment, etc. Newly designed

packaging is subjected to a variety of tests, and it is verified that problems will not occur during

distribution with the new packaging.

1.3.14 Distribution qualityIn order to ensure distribution quality, particularly to ensure that only the requested quantity of the

specified product is delivered on the specified delivery date for incoming orders from customers,

Panasonic has introduced a direct receiving/ordering system. This system uses serial numbers to control

orders from the customer's order form to the control form at the time of production to centralize the form

information and production control information. By doing this, problems with product or quantity

differences are eliminated, and in addition, centralized control via computer from the customer form details

to production conditions is possible, so that when such information is necessary, it can be called up

promptly.

In addition, since product or packaging damage or quality deterioration during distribution can be

affected by product storage or shipping environments, various checks and audits are conducted to ensure

quality in the distribution process and maintain and improve such quality.

1.3.15 Quality auditingAt Panasonic, verification of the quality assurance system aiming to improve quality and eliminate

quality problems, and verification of the effective operation of such system are performed, and quality

auditing is performed for the purpose of creating products that match customer requests.

This auditing includes but is not limited to:

First audit: Quality system audit; Product safety audit

Devices CompanyPerformed by: Internal auditing by Semiconductor Business Group, Industrial

Second audit: Quality system audit; Product safety audit

Performed by: Customer, Panasonic

Third audit: Quality system audit, etc.

Performed by: Certification organization

After the conclusion of auditing, a report is created and a reporting meeting is held. If necessary, the

section that was the subject of the audit creates improvement plans, carries out improvement activities,

follows up regarding progress status and results, and verifies whether the expected target was achieved.

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Seminars for quality management, product liability, and various positions of responsibility

Level

Managers/

supervisors

Intermediate

employees

Quality management

Quality control activities

Product liability

ISO fundamentals

Data analysis methods (Weibull analysis)

Employment of statistical methods

(Experimental design method)

(Taguchi method)

Reliability technology (Proprietary technology)

(Analysis technology)

(FMEA/FTA)

Novice

employees

New

employees

Research/design Manufacturing Sales

Fundamentals of quality management; Fundamentals of statistical methods (7 QC tools)

Quality control activities

Product liability

ISO fundamentals

Fundamentals of statistical methods

(7 new QC tools)

(Examination, assumptions)

Fundamentals of reliability

Quality managementQuality control activitiesFundamentals of product liabilityISO fundamentalsFundamentals of statistical methods (7 QC tools) (Examination, assumptions)Reliability technology (Proprietary technology)

(Analysis technology)

Quality management

Quality control activities

Fundamentals of product liability

ISO fundamentals

Fundamentals of statistical methods

(7 new QC tools)

(Examination, assumptions)

Reliability technology

(Proprietary technology)

(Analysis technology)

PanasonicInternal

certification

S class

Quality control activitiesISO fundamentalsFundamentals of statistical methods (7 QC tools)Fundamentals of reliability

A class

B class

C class

Function

1.3.16 Quality education

 Based on the Panasonic Group policy since its founding of “Creating people before creating products”,

our employees carry out self-improvement with the proper spirit and healthy bodies through the

conducting of education aiming for broad knowledge and diligent application of the knowledge learned.

 To ensure high quality and high reliability of products, it is important for the quality assurance section

to perform quality assurance activities for personnel education in all sections, such as research, design,

manufacturing, sales, etc. At Panasonic, in order to maintain and improve the high level of quality and

reliability of our semiconductor products, we conduct various kinds of quality and reliability education for

our employees. For types of quality education, education is classified into education by level (new

employee, novice employee, intermediate employee, managers/supervisors), education by function

(research, design, manufacturing, sales), and companywide education, and appropriate education is

conducted for each classification. Further, at Panasonic our employees work hard to increase their level of

knowledge, technology, and technical skills through active participation in various types of education and

training courses and various types of seminars, such as those held by the Union of Japanese Scientists and

Engineers, Japanese Standards Association, etc. In addition, the teaching materials issued by Panasonic for

quality and reliability were originally developed and used by us with actual examples taken from daily

quality assurance activities in close contact with work areas. The system diagram for quality and

reliability education is shown in Figure 1.12.

Figure 1.12 Quality and Reliability Education System Diagram

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1.3.17 Small group activities

1.3.18 ISO 9000s and ISO/TS16949 certification status in the Semiconductor BusinessGroup, Industrial Devices Company

In the Semiconductor Business Group, Industrial Devices Company, activities to obtain ISO 9000s

certification were begun in 1992 with the aim of strengthening the overall quality control system within

the group, creating a quality assurance system for global development, and respond to customer demands.

As a result of these activities, we completed the obtaining of certification starting in October 1993. Since

then, we have continued to maintain and improve our initially established quality assurance system, and

organization.

have passed the periodic follow-up inspections conducted annually by the inspection registration

Our ISO 9000s and ISO/TS16949 certification status is shown in Table 1.1.

At Panasonic, QC circle activities were introduced in 1965, and activities were carried out centered on

the manufacturing section. In 1967, cooperation between ZD (zero defect) activities and QC circle

activities were promoted. Thereafter, in 1980 QC activities by function for 14 projects were promoted

and given the name “TQC80s strategy”. In 1986, the “CREATE-1” exercises were developed as activities

to strengthen the management constitution, and in 1987 QM (Quality Matsushita) activities were

promoted throughout the Panasonic Group. From 1994 to 1996, VQ (Vital Quality) activities were

developed to actively promote quality improvement, and currently “Vitalization of QC circle activities”

are being promoted continuously to promote quality improvement actively, with a focus on ingraining

them in work areas based on the environmental changes such as overseas deployment.

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Table 1.1 Table of ISO Certification Status

Business location Certification Date of Certification authority/standard certification Certification number

Japan Semiconductor Business ISO9001 2003.11.18 JQA/ JQA-QMA14019

Products related to integrated TS16949

TS16949

2008.5.21 JQA/ JQA-AU0211-1 to 3circuit for Automobiles Arai, Uozu, TonamiProducts related to ISO9001 1994.3.14 JQA/ JQA-QMA14036camera module TS16949 2006.6.5 JQA/ JQA-AU0213

Overseas PSCSG ISO9001 1993.12.30 SGS/ SG93/ 02645

PIDID ISO9001 1999.3.16 SGS/ ID99/ 15783

PIDSH ISO9001 1997.12.28 SGS/ CN10/ 20267

2010.3.4 SGS/ CN10/ 20261

TS16949 2009.5.29 JQA/ JQA-AU0207

PSCSZ ISO9001 2005.2.21 LRQA/ QAC6003270

Affiliated PIDDSC

PIDDSCN (Niigata)

PIDSCMY (Malaysia)

Kyoto

Semiconductor

AV module

ISO9001 2001.3.9 JQA/ JQA-QM6255companies Kameoka ISO9001 1995.6.12 JACO/ QC-99J1022

TS16949 2008.5.4 LRQA/ QAC0071035/ C

TS16949 2009.9.11 SIRIM/ AR4992

ISO9001 2001.3.9 JQA/ JQA-QM6255

ISO9001 1996.9.18 SIRIM/ AR0907

PIDOSC ISO9001 1994.12.28 JQA/ JQA-0728

JACO : Japan Audit and Certification Organization for Environment and Quality

JQA : Japan Quality Assurance Organization

SGS : SGS United Kingdom Limited

SIRIM : Standards and Industrial Research Institute of Malaysia

LRQA : Lloyd's Register Quality Assurance Limited

Group