© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes MEMS Devices The...

© Pearson & GNU Su-Jin Kim© Pearson & GNU Su-Jin Kim

MEMSMEMSManufacturing ProcessesManufacturing Processes

MEMS Devices

• The MEMS(Microelectromechanical systems) devices can be made through the IC Process:

• Bulk micromachining: Pressure sensor• Surface micromachining: Accelerometer

http://www.youtube.com/watch?v=ZuE4oVrtEQY



Bulk micromachining

• Mask pattern by SiO2 or Si3N4 • Etching silicon substrate



Acceleration and Pressure sensor

Acceleration and Pressure sensor



Pressure

Fabrication steps for pressure sensor



Thermal Ink-jet printer



Surface micromachining

Micro-cantilever1. Silicon substrate, Si2. Deposit silicon nitride, Si3N4

3. Grow silicon oxide, SiO2

4. Pattern by Lithography5. Deposit polysilicon6. Remove SiO2 by Etching



Accelerometer for airbags

• Acceleration Displacement of beam Capacitive change Turn on the airbag



Micromirror Device



Comb Drive / Capacitive

• Parallel Plate CapacitorC = ε A/d

• Electrostatic ForceFe = ½ ε (A/d2)V2



Nanoscale Manufacturing

• Parts are produced at nanometer(10-9) length scales.• Integrated circuits are at this length scale.

• Carbon nanotubes have high strength and electrical current-carrying capability.

Carbon nanotubes: http://www.youtube.com/watch?v=zQAK4xxPGfM

Nano tech: http://www.youtube.com/watch?v=sITy14zCvI8 (10min)

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes MEMS Devices The...

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