Microelectromechanical Systems (MEMs) Applications ... · 1-21-2005 mem_app_legs.ppt...

© Jan 21, 2005 Dr. Lynn Fuller, Motorola Professor

Rochester Institute of TechnologyMicroelectronic Engineering

MEMs Applications – Actuators, Legs & Wings

ROCHESTER INSTITUTE OF TEHNOLOGYMICROELECTRONIC ENGINEERING

1-21-2005 mem_app_legs.ppt

Microelectromechanical Systems (MEMs)Applications – Actuators, Legs and Wings

Dr. Lynn Fuller

Motorola Professor Microelectronic Engineering

Rochester Institute of Technology82 Lomb Memorial Drive

Rochester, NY 14623-5604Tel (716) 475-2035Fax (716) [email protected]

http://www.microe.rit.edu




REVIEW

Actuators

ThermalTwo beam heated cantileverHeaters on PolyimideBimetalicHeater in an Enclosed Volume

ElectrostaticCapacitor Plate DriveComb DriveRelay/SwitchDiaphragm

PeizoelectricZnO




OUTLINE

Polycrystalline Silicon Thermal Actuators Integrated with Photodetector Position Sensors

Electrostatic Impact-Drive Microactuator

A Walking Silicon Micro-Robot

MEMs Wing Technology for a Battery-Powered Ornithopter




POLYCRYSTALLINE SILICON THERMAL ACTUATORS

Polycrystalline Silicon Thermal Actuators Integrated with Photodetector

Position Sensors

Kevin Munger





No current flow





Current flow




ACTUATOR INTEGRATED WITH PHOTO DIODE





SummaryThese devices give large mechanical motion on the order of several to few 10’s of micrometers

These devices are analog

Integrated with analog photodiode position detectioncan give feedback for accurate position

Cycle fatigue seems to be infinite




ELECTROSTATIC IMPACT-DRIVE MICROACTUATOR





1. Actuator can generate high power

2. Maintain a position precisely3. Move a long distance.





Testing

Figure shows test resultsfor 1Hz actuation, each impactgives 20 nm displacement

Lifetime looks good. Testfor 1 month, 550 million collisions, no visible problems

Energy was supplied to actuator by wireless RF transmision





ConclusionA New type of actuator is describedDiven by electrostatic force~15 nm per impact at 100 VoltsSpeed of 2.7 um/sec at 200 HzLife greater than 550 million impacts




A WALKING SILICON MICRO-ROBOT





http://www.s3.kth.se/mst/staff/thorbjorne.html




MEMS WING TECHNOLOGY





INTRODUCTIONProject constraints:

1) wingspan must be less than 15 cm, definition of MAV. 2) the flyer must fly by flapping its wings, ornithopter

A MAV falls within the size range of small birds, bats, and large insects, natural flyers, They will try to mimic them. Estimated a final 7-10 grams size. Estimated unsteady-state regime of flight where wing-tip speed is greater than the wind speed. Thus the wing must be light and strong, withstand high flapping frequencywithout breaking and generate lift and thrust to fly the prototype





DESIGNThe first attempt was to mimic a bat wing and a dragonfly wing using silicon for the support and parylene for the membrane. The support structure (like the bat) was ~350 µm in diameter and the membrane thickness was 15 µm. The silicon broke easily so a new process using titanium-alloy metal for the wingframe was developed.




APPLY PARYLENE

Approximately 1 gm of Parylene C gives ~3000Å film thickness, Deposit 5 wafers per run.

See: http://www.scscookson.com/parylene/properties.cfm

Adhesion Promotor(gammamethacryloxypropyltrimethoxysilane)

spin coat 3000 rpm 1 min. Bake 110 C for 2 min. Then load into Parylene Deposition Tool.





250 µm starting titamium-alloy substrate

Etch in HF:HNO3:H2O5:2:100 by vloume, rate ~2.5 µm/min, isotropic

Clean and treat surface in dilute HF solution

KOH




Seiko Epson Corp’s “Micro Flying Robot”

NEWS RELEASE




Seiko Epson Corp’s “Micro Flying Robot”

MOVIE




REFERENCES

1. “Microsensors,” Muller, Howe, Senturia, Smith and White, IEEE Press, NY, NY 1991.

2. “Sensor Technology and Devices,” Ristic, L.J., Artech House, London, 1994.

3. IEEE Journal of Microelectromechanical Systems4. “Electrostatic Impact-Drive Microactuator”, M.Mita, et.el.,

University of Tokyo, IEEE, 20015. “A walking Silicon Micro-Robot”, Thorbjorn Ebefors, et.el.,

Department of signals, sensors and Systems, Royal Institute of technology, Stockholm, Sweden, 10th Int. conference on solid-State Sensors and Actuators, Sendai Japan, June 7-10, 1999.

6. MEMs Wing Technology for a battery-Powered Ornithopter, T. Nick Pornsin-sirirak, Caltech Micromachining Laboratory, Pasadena, CA, 91125, IEEE, 2000.




HW – APPLICATIONS MICROPHONES

1. Find another publication describing the fabrication of a MEMsactuator, robot or flying machine. Describe the fabrication sequence in your own words. Attach a copy of the paper.

Microelectromechanical Systems (MEMs) Applications ... · 1-21-2005 mem_app_legs.ppt...

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