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www.we-online.com

New Possibilities with ECT Solder

www.we-online.com

Webinar

Embedded Component Technology – ECT

Motivation

Existing Solutions to Embed Components

Introduction – ECT Solder

Components, Design Rules and EDA

New Possibilities with ECT Solder

Jürgen Wolf

Würth Elektronik GmbH & Co. KG

Product Manager

Embedded Component Technology

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 2

Embedded Component Technology – ECT

Motivation

Existing Solutions to Embed Components

Introduction – ECT Solder

Components, Design Rules and EDA

New Possibilities with ECT Solder

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 3

Embedded Component Technology – ECTAdvantages of „buried“ components?

Miniaturization

Performance/Function

Reliability

• Integrated shielding

• Short signal paths

• Protection against plagiarism

• Protected against influences

• Secure fixing

• Thermal management

• Package replacement

• Space savings of assembly

area on the outer layers

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 4

Embedded Component Technology – ECT

Motivation

Existing Solutions to Embed Components

Introduction – ECT Solder

Components, Design Rules and EDA

New Possibilities with ECT Solder

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 5

Embedded Component Technology – ECTExisting Solutions – ECT Microvia & ECT Flip-Chip

ECT Flip-Chip

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 6

ECT Microvia

HOWEVER

components

often not

available

in needed

configuration

Embedded Component Technology – ECT

Motivation

Existing Solutions to Embed Components

Introduction – ECT Solder

Components, Design Rules and EDA

New Possibilities with ECT Solder

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 7

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

inner layer

core

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 8

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 9

solder resist

frames

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 10

combined solder

surface and

adhesion promoter

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 11

thin core

assembly

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 12

bottom copper foil

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 13

prepreg

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 14

assembled core

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 15

cut prepregs

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 16

cut prepregs

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 17

cut prepregs

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 18

2nd core

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 19

prepreg

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 20

top copper foil

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

Remaining PCB

processes

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 21

outer layer

structuring

Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

Remaining PCB

processes

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 22

solder resist

and

solder surface

Embedded Component Technology – ECTECT Solder: Embedded SMD components

Embedding of

standard SMD

components

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 23

Embedded Component Technology – ECT

Motivation

Existing Solutions to Embed Components

Introduction – ECT Solder

Components, Design Rules and EDA

New Possibilities with ECT Solder

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 24

ECT Solder

Embedded Component Technology – ECTAvailability of Components – ECT Solder

No-Goes

•Liquids / electrolytes in components

•Air inclusion (e.g.. Quartz Crystals

with metal lids)

•In principle each

solid SMD-

component

possible

•Max. thickness

depends on

layer stack

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 25

EDA-Tools for ECT:

The latest versions of these tools:

Embedded Component Technology – ECTDesign and layout?

Allegro® PCB Designer

Miniaturization Option

Further tools

possible,

but with limitations

with limitations

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 26

Embedded Component Technology – ECTECT Solder: Design Rules

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 27

Design Rules

comparable to

outer layer assembly

Solder resist

not fully

covering

the surface

Only frames

surrounding

the

solder pads

Solder resist bridges:

75 µm – 100 µm

Solder resist clearance:

≥ 50 µm

New possibilities with ECT Solder

Summary

Existing technologies:

ECT Microvia and ECT Flip-Chip

Complementing technology:

ECT Solder

ECT Solder – Solid SMD components usable

Embedded Component Technology – ECTWebinar

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 28

Thank you for your attention!

Contact details:

Product Management

Embedded Component Technology

Würth Elektronik GmbH & Co. KG

Circuit Board Technology

Rudolf-Diesel-Straße 10

74585 Rot am See

Germany

Tel.: +49 79 55 38 88 07 - 222

embedding@we-online.com

¡Gracias por su

atención!Děkuji vám

za pozornost!

Köszönöm a

figyelmüket! Tak for deres

opmærksomhed!

Merci de

votre attention!

Tack för er

uppmärksamhet!

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1 Page 29