Embedded Component Technology Pioneering solutions · Embedded Component Technology – ECT...

Embedded Component TechnologyPioneering solutions

01.04.2014www.we-online.com Embedded Component Technology – ECT Webinar V2014/1

Your speakers today …

Embedded Component TechnologyPioneering solutions

Jürgen Wolf Michael MatthesResearch & Development WITTENSTEIN electronics GmbH

Arndt BärHost


[email protected]+49 7955 388807 - 152

[email protected]+49 7931 493-10384

[email protected]

With around 1800 employees worldwide and sales of € 241 million in 2012/13,WITTENSTEIN AG enjoys an impeccable reputation for innovation, precision andexcellence in the field of mechatronic drive technology – not just in Germany butinternationally.

WITTENSTEIN AG – one with the future

www.we-online.com Embedded Component Technology – ECT Webinar V2014/1 01.04.2014

The group comprises eight pacesetting Business Units with separate subsidiaries forservo gearheads, servo actuator systems, medical technology, miniature servo units,innovative gearing technology, rotary and linear actuator systems, nano-technology andelectronic and software components for drive technologies.

Through its 60 or so subsidiaries and agents in approximately 40 countries,WITTENSTEIN (www.wittenstein.de) is additionally represented in all the world's majortechnology and sales markets.

Embedded Component Technology – ECT

Motivation

ECT–µVia

ECT–Flip Chip

Components and Assembly

Active Implant with ECT

Design Requirements

Collaboration

Realization - EDA-Tools

Realization - PCB

ECT Reliability

Embedded Component Technology:Pioneering Solutions


Embedded Component Technology – ECTAdvantages of „buried“ components?

Miniaturization

Performance/Function

Reliability

• Integrated shielding• Short signal paths• Protection against plagiarism

• Protected against influences• Secure Fixing• Thermal management

• Package replacement• Space savings of assembly

area on the outer layers



Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization - PCB

ECT Reliability



Embedded Component Technology – ECTECT–µVia: Embedded active and passive devices


ECT-µVia ManufacturingECT-µVia Manufacturing

Assembly(Gluing/Sintering/

Soldering)

Assembly (NCA) onto Cu-Foil


Sample:

Top view ofassembled foil

Capacitors withCu-Termination

Resistors withCu-Termination

ASIC as bare diewith NiPd-Metallisation






Soldering)

Multilayerpressing





Soldering)

Multilayerpressing

Drilling ofvias and microvias



Non-plated microviaon embedded

Capacitor with Cu-termination

Length: 58,97 µm

Length: 21,96 µm





Soldering)

Multilayerpressing

Drilling ofvias and microvias

Plating andstructuring


50 µm

200 µm

Top view embedded IC Microvia connection on top of IC pad

Cross section: embedded IC with microvia connections prior to Cu-structuring



Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization - PCB

ECT Reliability



Embedded Component Technology – ECTECT–Flip Chip: Embedded active devices


ECT-Flip Chip ManufacturingECT-Flip Chip Manufacturing

Core with Footprintfor Flip Chip

Assembly(Flip Chip – ACA)

Multilayerpressing

Remaining PCBprocesses

Embedded Component Technology – ECTECT–Flip Chip: Embedded active devices


ECT-Flip Chip

„chip first /face down“

Embeddedbare die ASIC


Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization - PCB

ECT Reliability



Embedded Component Technology – ECTAvailability of components


Passive Components with Cu-Termination

mounting form0402

thicknessesfrom

150 µmto

300 µm

CapacitorsResistors

Bare Die Silicon ICs with process compatible pads

Generallya customerprovision

ECT–Flip Chip Pads

• Wirebond Au Stud-Bumps

• Wafer-level Au-Bumps

ECT–µVia Pads

• Cu

• NiPd

330 µm330 µm

150 µm150 µm

Embedded Component Technology – ECTPCB manufacturer and the assembly of components?


Paradigm shift

PCB manufacturerassembles

components tobe embedded

ESDStorage, stock and

logistics of components


Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization - PCB

ECT Reliability



Development of a robust, reliable and highly available prototype

Active medical implant limited physical dimensions with complex structures

Connectors need to be eliminated due to space requirements

Critical EMC, due to RF-sources (wireless energy anddata transfer) onboard

Direct connection to different actuators and sensors

Development of a suitable test structure

Active Implant with ECTDesign requirements


Functional sample based on Multilayer Standard PCB

Active Implant with ECTPreliminary studies

SMT Assembly

Packagedversions ofASIC

Packagedversions ofASIC andµController


Functional sample based on Multilayer PCB with Cavity onto first innerlayer

Active Implant with ECTPreliminary studies

Assembly of Flip Chip-Components onto first innerlayer

ASIC

µController


Advantages of Embedded Components

Reduction in volume

Increase of robustness

Improvement in thermal performance due to optimized heat conduction

Active Implant with ECTDecision to use embedded components at Wittenstein



Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization - PCB

ECT Reliability



Embedded Component Technology – ECTCollaboration in the development


Very close collaborationis needed at a very early stagein concept and design phase

for the success

product idea

concept

design

draft

development

prototypes

optimisation

Serial production

Products usingECT

Embedding of active and passive components:

Initial meeting – what are the options?

Active Implant with ECTCollaboration in the concept phase



Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization - PCB

ECT Reliability



Realization based on the example of „Cadence Allegro“

Active Implant with ECTRealization in EDA-Tools exemplified by Cadence Allegro

In the meantime, componentsmay be placed on any layer.

Special DRCs monitor andcontrol the requiredmanufacturing rules.

With old EDA-Tools it was onlypossible to place components ontop or bottom.


into opencavities

ontoflex,

or embeddedon inner layers orin cores

Layer definition

Layer defined as „embedded“

Assembly direction

– Body Down

– Body Up

Cut outs of next layers

– “Protruding”

– In adjacent layers

Contact type

– Direct

– Indirect



Placing of components

Quickplace

– Components are placedcoarsely onto predefinedlayers

– Manual fineadjustment

– Filter EmbeddedComponents

– Board Layer may be selectedif layer is marked as „embedded“


Embedded_Pla Optional



DFA Support

– Spacing rules and online DRC

– Spacing betweensingle components

• x-, y-direction

• z-direction

– S:E S:S E:E E:S

side-end

side-side

end-end

end-side




Placement Replication

– Supports groups(functional modules)of embedded andregular components


Embedded Components


Substrate Cavities

Closed Cavity

– Filled with resin

– Possible heights

• Between 2 Layers

• Across multiple layers

Open Cavity

– Open space in which componentswill be placed

– Possible depths

• Multiple layers

• Stair design at the edge



Manufacturing Output

Cross Section Chart

– Manufacturing Cross Section Chart

Drill Legend

– Support of Cavities

– Start:Stop Layer

– Number of components

Artwork Film Records

ODB++ Version 9.1

In the future: IPC 2581




Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization – PCB

ECT Reliability



Build-up of PCB

Buried Vias

ECT-µVia: embeddedresistors in two cores

40 µm isolation distanceon inner layers

ECT-Flip Chip

Microvias on topand bottom(HDI-build-up 1-2b-2b-1)

Rigid-Flex 1F-5Ri

Castellation holes

Active Implant with ECTImplementation of the design requirements


Development of a robust an reliable prototype design

Realisation by the use of embedded components(Bare die ASIC and resistors)



Active medical implant with very limited available space

Implementation: Realization only possible trough complex Outlines

Virtual, three-dimensional design of the board





Realization of rigid areas adapted to the contours

Realization of flexible areas suitable for the construction and for theflattening into a 2D-board for the assembly

3D designed board flattened for 2D assembly by the use of an assembly frame.



Used components

Bare Die ASIC with Au Stud-Bumps

Passive components



EmbeddedASIC

Embeddedresistors

Separable structures for programming, test and setting-up operation

Contact structures will be cut of after successful initial operation.

Cut-off surfaces are secured through potting in the product.



Simulated board in comparison with assembled board



Direct connection of different actuators and sensors

Realization: No further connectors by the use of castellation holes




Motivation

ECT–µVia

ECT–Flip Chip



Design Requirements

Collaboration


Realization - PCB

ECT Reliability



5x solder process lead-free+

1000 cycles - 40 °C / + 125 °C+

lamination process+

5x solder process lead-free

no resistance change in daisy chain!

40 °C at 90 % rel. humidity climate exposure 200 / 500 / 1000h

125 °C heat treatment 200 / 500 / 1000h

Embedded Component Technology – ECTReliability – ECT–Flip Chip

+ 125 °C

- 40 °Ctime / cycles

15 min no cracks

no separation


ECT-µVia temperature cycling

Embedded Component Technology – ECTReliability – ECT–µVia

0

2

4

6

8

10

12

14

16

18

20

500 1000 1500 2000 2500 3000

Cycles – End-Of-Life

Te

stp

oin

ts

Z6

Z5

Z4

Y6

Y5

Y4

X6

X5

X4


Summary / Conclusion

Technologies available to embed

– active and

– passive components

Collaboration

– Hugh importance for success and

– Already starting in planning phase

Pre-serial samples finished

Series production in planning



Thank you for your attention!


The webinar was presented by

Embedded Component Technology Pioneering solutions · Embedded Component Technology – ECT...

Documents

Transcript of Embedded Component Technology Pioneering solutions · Embedded Component Technology – ECT...