OSCILLOSCOPEDesign file: MSFT DIFF CLOCK WITH TERMINATORREV2.FFS Designer: Microsoft

HyperLynx V8.0Comment: 650MHz at clk input, J10, fixture attached

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V [U3.1 (at pin)]

Wafer Probe Technology & Application Overview

Date: Wednesday Mar. 3, 2010 Time: 14:16:09

Application Overview

Ira Feldmana e d a650‐472‐1192iradave@gmail.comwww.hightechbizdev.comwww.hightechbizdev.com

1Silicon Valley Test Conference 2010© 2010 Ira Feldman

AgendaAgenda

• IntroductionIntroduction

• Application Examples

C h l i / b• Contact Technologies / Probe Types

• Top Vendors

• Hot Topics

• SummarySummary

• Resources

Silicon Valley Test Conference 2010 2

Devices & Packages –Have Evolved!

Silicon Valley Test Conference 2010 3

UV EPROM circa 1974http://www.cpushack.com/EPROM.html

Peripheral Pads ‐ LogicPeripheral Pads  Logic

SWTW 2009: MEMS Technology – Enabling Design

Silicon Valley Test Conference 2010 4

http://www.chipworks.com/uploadedImages/Blog/blogimagessq310/AKM8975_6210_cal_branded.JPG

Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe

Fine Pitch LogicFine Pitch Logic

Silicon Valley Test Conference 2010 5

Kulicke & Soffa: http://www.imaps.org/imaps2005/keynote.pdf

SWTW 2009: MEMS Technology – Enabling Design Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe

Area Array – Logic, µP, etc.Area Array  Logic, µP, etc.

Silicon Valley Test Conference 2010 6http://www.tradekorea.com/product-detail/P00032217/Solder_Bump.html

Marketing Version of a CPU…Marketing Version of a CPU…

Intel Core i7-980X Extreme 6-Core Processor (32nm Q1 ’10)

Silicon Valley Test Conference 2010 7

( )http://hothardware.com/News/Intel-Core-i7980X-Extreme-6Core-

Processor-Review/

…What Probe Really Sees…What Probe Really Sees

Silicon Valley Test Conference 2010 8

Intel Technology Journal (6/2008):45 nm process ~50 µm tall Cu bumps

No One Solution Fits AllNo One Solution Fits All10

0nt

(K)

DRAM&

050

robe

Cou

& NOR FLASH

Memory

510

xim

ate

Pr

Microprocessor&

Logic

SOC&

Logic LCD /

NAND FLASH

1App

rox

TSV

g(Area Array)

g LCD /DisplayMemory

Silicon Valley Test Conference 2010 9

150 100 6080 2040Approximate Pitch (µm)

Many Other ParametersMany Other Parameters

• “Pad” type – bond pad, BGA, column, bumpyp p , , , p

• Pad Configuration – peripheral, LOC, DLOC, array

• Die Size

• Pad Size ‐ passivation opening & keep away

• Pad Metal – Al, Cu, Au, solder, etc.

• Force Requirements

• Scrub Depth

• Frequency / Bandwidth• Frequency / Bandwidth

• Pad Density (probes / mm2)

• Active Area (size of probe array)Active Area (size of probe array)

• TemperatureSilicon Valley Test Conference 2010 10

Contact Technologies / Probe Types

• CantileverCantilever

• Blade

• VerticalVertical 

• MEMS– VerticalVertical

– Micro Cantilever

– Torsional

• Spring

• Membrane

Silicon Valley Test Conference 2010 11

CantileverCantilever

Technoprobe

K&S: http://www.imaps.org/imaps2005/keynote.pdf

Technoprobe

Silicon Valley Test Conference 2010 12

BladeBlade

Silicon Valley Test Conference 2010 13SV Probe

Vertical ‐ Buckling BeamVertical  Buckling Beam

M SWTW T t i l 2004

FormFactor: “MEMS for ProbeCard Applications” Chong Chan Pin – Semicon Singapore 2010

Mann: SWTW Tutorial 2004

Silicon Valley Test Conference 2010 14

SV Probe “Trio”JEM “VC”

Vertical ‐ Buckling BeamVertical  Buckling Beam

MicroProbe: Apollo Vertical

JEM: VC

Silicon Valley Test Conference 2010 15SV Probe: Trio

MEMS ‐ VerticalMEMS  Vertical

Microfabrica MicroProbeMicrofabrica MicroProbeFormFactor (T1)

Silicon Valley Test Conference 2010 16MicroProbe (Vx-MP)

MEMS ‐Micro CantileverMEMS  Micro Cantilever

Microfabrica

FormFactor (T3)

MJC (U P b )

Silicon Valley Test Conference 2010 17

http://www.mjc.co.jp/eng/ir/pdf/MJC070226-s.pdf

MJC (U Probe)JEM

MEMS ‐ TorsionalMEMS  Torsional

Touchdown Technologies (ACCU-TORQ)Touchdown Technologies (ACCU TORQ)

SWTW 2010: “Low-Force MEMS Probe Solution for Full Wafer Single Touch Test” Matt Losey

Silicon Valley Test Conference 2010 18

Spring PinsSpring Pins

http://www.nhkspg.co.jp/eng/mc/products/wlt.html

Silicon Valley Test Conference 2010 19

http://www.ksdk.co.jp/eng/spring-probes.htmlJEM VS

MembraneMembrane

Silicon Valley Test Conference 2010 20

Cascade Microtech Pyramid Probe

Top Vendors ‐ TechnologyTop Vendors  Technology

Revenue per VLSI Research press release

Silicon Valley Test Conference 2010 21

Revenue per VLSI Research press releasehttps://vlsiwebserver.vlsiresearch.com/public/cms_pdf_upload/458310.pdf

Based upon website and company responses to marketing inquires.

Top Vendors ‐ ApplicationsTop Vendors  Applications

Based upon website and company responses to marketing inquires

Silicon Valley Test Conference 2010 22

Based upon website and company responses to marketing inquires.

Hot Topics (1)Hot Topics (1)

B / b ll dMost

I i ti l • Bump / ball damage

• Cu probing

Inspirational

• High currentMost Inspirational

Silicon Valley Test Conference 2010 23

Hot Topics (2)Hot Topics (2)

• High Frequency / high bandwidthHigh Frequency / high bandwidth– Advanced space transformers

Modeling– Modeling

– Direct Dock

Silicon Valley Test Conference 2010 24

Hot Topics (3)Hot Topics (3)

• Operational – lower cost quicker cycle timeOperational  lower cost, quicker cycle time

Silicon Valley Test Conference 2010 25

SummarySummary

• Device product requirements drive bothDevice product requirements drive both packaging and test complexity– Essential to partner with suppliers from day one– Essential to partner with suppliers from day one

C f l l ti f b d d• Careful selection of probe card vendors– Know strengths & weaknesses for your devices

– Technology may limit performance & impact cost

– No one solution fits all

Silicon Valley Test Conference 2010 26

ResourcesResources

• IEEE Semiconductor Wafer Test WorkshopIEEE Semiconductor Wafer Test Workshopwww.swtest.org

• International Test Conferencewww.itctestweek.org

• My blogswww.hightechbizdev.com

www.ateforum.com/tothepoint

Silicon Valley Test Conference 2010 27

CreditsCredits

Thank you to the vendors who provided photos!Thank you to the vendors who provided photos!

• FormFactor

h b• Technoprobe

• MicroProbe

• JEM

• SV ProbeSV Probe

• Cascade Microtech

V i• VerigySilicon Valley Test Conference 2010 28