Post on 21-Jan-2019
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 1
9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France
Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr
July 2011 - Version 1
Written by: Romain FRAUX
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic
estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is
made of the contents of this report. The quoted trademarks are property of their owners.
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 2
Table of ContentsGlossary
1. Overview / Introduction……….……….…………….…........…4– Executive Summary
– Reverse Costing Methodology
2. VTI Company Profile………………………..….……....…….....6– VTI Profile
– MEMS Portfolio
– CMR3000 Characteristics
– CMR3000 Block Diagram
– VTI Business Model
3. Physical Analysis………………………...……….............…...13– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package Characteristics & Markings
– Package Pin-Out
– Package X-Ray
– Package Cross-Section
– Device Structure
– ASIC Dimensions
– ASIC Markings
– ASIC Cross-Section
– ASIC Delayering
– ASIC Process Characteristics
– MEMS Dimensions
– MEMS Vias
– MEMS Opening
– MEMS Sensor
– MEMS Sensor (Buried Cavities)
– MEMS Cap
– MEMS Cross-Section
– MEMS Process Characteristics
– Physical Data Summary
4. Manufacturing Process Flow…….………………………..….57– Global Overview
– ASIC Process Flow
– Description of the ASIC Wafer Fabrication Unit
– MEMS Process Overview
– MEMS Process Flow (c-SOI wafer)
– MEMS Process Flow (Sensor wafer)
– MEMS Process Flow (Cap wafer)
– MEMS Process Flow (Wafer Bonding)
– Packaging Process Flow
– Description of the MEMS /Packaging Wafer Fabrication Unit
6. Cost Analysis………………………….……………………..…..78– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Supply Chain Analysis
– Yields Explanation
– Yields Hypotheses
– Die per wafer & Probe Test
– ASIC Front-End : Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
– ASIC Die Cost
– MEMS Front-End : Hypotheses
– MEMS Front-End Cost
– MEMS Front-End Cost per Process Steps
– MEMS Front-End : Equipment Cost per Family
– MEMS Front-End : Material Cost per Family
– Back-End 0: Packaging, Probe Test & Dicing Cost
– Back-End 0 Cost per Process Steps
– Back-End 0: Die Cost
– Back-End 1: Final test & Calibration Cost
– CMR3000 Component Cost (FE + BE 0 + BE 1)
7. Estimated Price Analysis….………………….………………...107– Definition of Prices
– Manufacturer Financial Ratios
– CMR3000 Estimated Manufacturer Price
– CMR3000 Estimated Selling Price
Contact…….………………………………………...……………….113
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 3
Executive Summary
• This full reverse costing study has been conducted to provide insight on technology
data, manufacturing cost and selling price of the VTI CMR3000 component.
• The CMR3000 is a triple-axis MEMS gyroscope manufactured using a SOI bulk
micromachining process.
• The component is suitable for further applications requiring battery operation
(Gaming input devices, Computer peripherals and remote controllers, Mobile
Phones)
• Compatible with SMD process, the CMR3000 is provided in a 4.1x3.1x0.83mm WLP
10-pin package.
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 4
Package Characteristics & Markings
• Package type: 10-pin WLP
• Dimensions: 4.10mm x 3.10mm x 0.83mm
• Pin pitch: 0.50mm
• Marking:
CMR3000
00345
26-28Package Top view
Package back viewPackage side view
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 5
Package Pin-Out
CMR3000 Pin Descriptions (from datasheet)
CMR3000 sensing directions (from datasheet) CMR3000 pin number (from datasheet)
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 6
ASIC Dimensions
2.48mm
1.6
8m
m
Die area: 4.16mm² Total Pads nb : 22
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MEMS Cap
MEMS Cap Overview
MEMS cap details – SEM View
MEMS cap details – SEM View
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MEMS Cross-Section
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MEMS Process Flow (c-SOI Wafer)
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ASIC Front-End Cost
Probe Test Cost
Backgrinding & Dicing Cost
• We perform the economic analysis of the ASIC with the IC Price+ software.
• We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software.
Final Test & Calibration Cost
Component Cost
MEMS Front-End Cost
Packaging Cost
Probe Test & Dicing Cost
Main steps of economic analysis
CMR3000
Back-End 0
Back-End 1
Front-End
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 11
ASIC Die Cost (Front-End + Back-End 0)
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 12
MEMS Front-End Cost
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 13
CMR3000 Component Cost (FE + BE 0 + BE 1)