VTI CMR3000 3-Axis MEMS Gyroscope - systemplus.frC_RM061... · VTI CMR3000 –3-Axis MEMS Gyroscope...

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© 2011 by SYSTEM PLUS CONSULTING , all rights reserved. VTI CMR3000 3-Axis MEMS Gyroscope 1 9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr July 2011 - Version 1 Written by: Romain FRAUX DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

Transcript of VTI CMR3000 3-Axis MEMS Gyroscope - systemplus.frC_RM061... · VTI CMR3000 –3-Axis MEMS Gyroscope...

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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. VTI CMR3000 – 3-Axis MEMS Gyroscope 1

9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France

Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr

July 2011 - Version 1

Written by: Romain FRAUX

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.

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Table of ContentsGlossary

1. Overview / Introduction……….……….…………….…........…4– Executive Summary

– Reverse Costing Methodology

2. VTI Company Profile………………………..….……....…….....6– VTI Profile

– MEMS Portfolio

– CMR3000 Characteristics

– CMR3000 Block Diagram

– VTI Business Model

3. Physical Analysis………………………...……….............…...13– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package Characteristics & Markings

– Package Pin-Out

– Package X-Ray

– Package Cross-Section

– Device Structure

– ASIC Dimensions

– ASIC Markings

– ASIC Cross-Section

– ASIC Delayering

– ASIC Process Characteristics

– MEMS Dimensions

– MEMS Vias

– MEMS Opening

– MEMS Sensor

– MEMS Sensor (Buried Cavities)

– MEMS Cap

– MEMS Cross-Section

– MEMS Process Characteristics

– Physical Data Summary

4. Manufacturing Process Flow…….………………………..….57– Global Overview

– ASIC Process Flow

– Description of the ASIC Wafer Fabrication Unit

– MEMS Process Overview

– MEMS Process Flow (c-SOI wafer)

– MEMS Process Flow (Sensor wafer)

– MEMS Process Flow (Cap wafer)

– MEMS Process Flow (Wafer Bonding)

– Packaging Process Flow

– Description of the MEMS /Packaging Wafer Fabrication Unit

6. Cost Analysis………………………….……………………..…..78– Synthesis of the Cost Analysis

– Main Steps of Economic Analysis

– Supply Chain Analysis

– Yields Explanation

– Yields Hypotheses

– Die per wafer & Probe Test

– ASIC Front-End : Hypotheses

– ASIC Front-End Cost

– ASIC Back-End 0 : Probe Test, Backgrinding & Dicing

– ASIC Die Cost

– MEMS Front-End : Hypotheses

– MEMS Front-End Cost

– MEMS Front-End Cost per Process Steps

– MEMS Front-End : Equipment Cost per Family

– MEMS Front-End : Material Cost per Family

– Back-End 0: Packaging, Probe Test & Dicing Cost

– Back-End 0 Cost per Process Steps

– Back-End 0: Die Cost

– Back-End 1: Final test & Calibration Cost

– CMR3000 Component Cost (FE + BE 0 + BE 1)

7. Estimated Price Analysis….………………….………………...107– Definition of Prices

– Manufacturer Financial Ratios

– CMR3000 Estimated Manufacturer Price

– CMR3000 Estimated Selling Price

Contact…….………………………………………...……………….113

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Executive Summary

• This full reverse costing study has been conducted to provide insight on technology

data, manufacturing cost and selling price of the VTI CMR3000 component.

• The CMR3000 is a triple-axis MEMS gyroscope manufactured using a SOI bulk

micromachining process.

• The component is suitable for further applications requiring battery operation

(Gaming input devices, Computer peripherals and remote controllers, Mobile

Phones)

• Compatible with SMD process, the CMR3000 is provided in a 4.1x3.1x0.83mm WLP

10-pin package.

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Package Characteristics & Markings

• Package type: 10-pin WLP

• Dimensions: 4.10mm x 3.10mm x 0.83mm

• Pin pitch: 0.50mm

• Marking:

CMR3000

00345

26-28Package Top view

Package back viewPackage side view

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Package Pin-Out

CMR3000 Pin Descriptions (from datasheet)

CMR3000 sensing directions (from datasheet) CMR3000 pin number (from datasheet)

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ASIC Dimensions

2.48mm

1.6

8m

m

Die area: 4.16mm² Total Pads nb : 22

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MEMS Cap

MEMS Cap Overview

MEMS cap details – SEM View

MEMS cap details – SEM View

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MEMS Cross-Section

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MEMS Process Flow (c-SOI Wafer)

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ASIC Front-End Cost

Probe Test Cost

Backgrinding & Dicing Cost

• We perform the economic analysis of the ASIC with the IC Price+ software.

• We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software.

Final Test & Calibration Cost

Component Cost

MEMS Front-End Cost

Packaging Cost

Probe Test & Dicing Cost

Main steps of economic analysis

CMR3000

Back-End 0

Back-End 1

Front-End

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ASIC Die Cost (Front-End + Back-End 0)

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MEMS Front-End Cost

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CMR3000 Component Cost (FE + BE 0 + BE 1)