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Thermaltronics

Why Thermaltronics?

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Overview Introduction

Company Introduction Our customers & Industries we service Certifications

Our Products Product Comparison Conclusion

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Mission Statement To research, develop and manufacture

products related to power and thermal demand requirements.

Our goals: Quality Increased Productivity Cost Reduction

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Company Introduction Production and manufacturing of

soldering devices and related products Extensive knowledge in Curie Heat

Technology Manufacturing Facility in Beijing, China

Capacity: 2000 systems 80,000 cartridges per month

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Industries We Supply Avionics Disk Drive Manufacturing Contract Electronic Manufacturing (CEM’S) Medical Electronics Power Supply Manufacturers Solar Cell Production Telecommunications

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Customers

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NRTL - Safety TUV / GS - Safety CE - Safety

Certifications

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ISO9000 - Quality ISO14000 - Environment SGS – Lead-Free

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TMT-2000S Soldering Station (450KHz)

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K Series

P Series

S Series

Part Number Description WarrantyTMT-2000PS Power Supply 1 YearsSHP-K Handpiece 30 DaysSHH-3 Workstand 30 Days

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TMT-5000S Soldering Station (13.56MHz)

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T Series

Part Number Description WarrantyTMT-5000PS-1 Power Supply 1 YearsTMT-5000PS-2 Power Supply 1 YearsSHP-T Handpiece 30 DaysSHH-2 Workstand 30 Days

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TMT-9000S Soldering Station (13.56MHz)

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Part Number Description WarrantyTMT-9000PS-1 Power Supply 4 YearsTMT-9000PS-2 Power Supply 4 YearsSHP-1 Handpiece 90 DaysSHH-1 Workstand 90 Days

M Series

Power Plus

Micro Fine

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Why Thermaltronics?

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No Calibration Required Thermaltronics soldering irons do not need

calibration. (EOS)

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ESD Safe Verified by third parties in hard drive industry to be

completely ESD Safe.

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Point 1Point 2

Point 3

Point 4

Point 5 Point 6

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Electrical Overstress Thermaltronics soldering irons conform

to international standards of Electrical Overstress (EOS)

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Data Point Tip to Ground AC Leakage (<20mv)

Tip to Ground Resistance <2ohms

Hot Cold

1 0.3 0.2 0.32 0.2 0.1 0.23 0.2 0.2 0.44 0.2 0.2 0.35 0.3 0.2 0.36 0.2 0.2 0.2

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Grounding Scheme Comparison Thermaltronics offers an improved

grounding scheme.

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MX500 – Grounding Scheme No secured grounding connection exists. Grounding is highly dependent on the connectivity

between the front and back enclosure. (a potential grounding problem exists if oxidation occurs or there is an uneven fit between the front and back enclosure).

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TMT-9000S – Secured Grounding Scheme Secured grounding path to insure AC Filter, PCBA,

RF connectors, Front and Back enclosure are all physically securely grounded together.

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Faster Start-Up

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Sustained Power Output

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TMT-9000S – Secured Grounding Scheme Secured grounding path to insure AC Filter, PCBA,

RF connectors, Front and Back enclosure are all physically securely grounded together.

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Plating Improvements Additional plating at tip front Denser plating means longer tip life

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Gold Plated Connectors Gold Plated Connectors improve connectivity

and optimizes power transition.

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Easy Color Identification Color coded bands for easy

identification of tip temperatures

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Patented colour band for easy temperature identificationBlue = 600 series, Yellow = 700 series, Red = 800 series

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Unique Tip Profiles Unique tip profiles such as Mini Wave

tips for SMT applications

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MXWV020 MXWV031 MXWV300

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M Series - Power Plus Tips Faster Soldering Increased Performance without no increase

in temperature Thicker Plating to extend tip life

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Large Copper MassIncreases Stored Heat

Increased PlatingLong Tip Life

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Quality Control & Traceability Tracking systems allows finished products to

be traced back to the original work order, QC report and supplier batch

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Product S/N#

Work Order

AssemblyWork Order Component Component

SupplierBatch#

SupplierBatch#Component

SupplierBatch#

Unique S/N#allowsTraceability

Unique S/N# 83910108

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Why Thermaltronics? Secured Grounding Faster Start-up Sustained Power Output Increased Plating Gold Plated Connectors Easy Color Identification Unique New Tip Profiles Quality Control & Traceability

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Thermaltronics

Quality – Increase Productivity – Cost Reduction

End Presentation

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