The Physical Realities of Cascading S-Parameters … Physical Realities of Cascading S-Parameters...

Post on 21-Mar-2018

230 views 3 download

Transcript of The Physical Realities of Cascading S-Parameters … Physical Realities of Cascading S-Parameters...

11:25 a.m.Feb. 4, 2008

5th NORTHAMERICAN

USER’S FORUM

CSTCOMPUTER SIMULATION

TECHNOLOGY

The Physical Realities of Cascading

S-Parameters for Full-Path Simulations

Heidi Barnes

8 February 2008

1

Verigy / Semiconductor Test Systems

heidi.barnes@verigy.com

1. Why do we use S-Parameters (A little bit of History)

� Phase matters

� Accurate methods of measuring them

� Easily converted to the T-Matrix for cascading

2. 3D-EM Simulations for Analyzing Cascaded S-Parameters

� When 50 ohms connected to 50 ohms is not a perfect match

� The importance of transitions

� Where to put the reference planes

Outline

2

8 February 2008

� Where to put the reference planes

3. Design for Measurement Based Modeling

� Effects of reducing the size of the interconnect

� Added Capacitance vs Added Inductance

� ATE High Speed Digital Application

Telegrapher’s Equations

Voltages and Currents are changing with Time and Distance

(Magnitude and Phase)

• Create a simple model of a

transmission line.

• Utilize calculus to analyze the model

when summing a series of incremental

length sections.

3

8 February 2008

Oliver Heaviside1850-1925

length sections.

For small R and GSinusoidal Input Resulting Relationships

2-Port Network Scattering Parameters

Measuring S-Parameters

a1 a2

bbbb1 bbbb2

Scattering

Parameters

Matrix FormRelation of Incident and Reflected Power Waves

Port 1 Port 2

4

8 February 2008

Maximum Power Transfer Theorem – Termination in Zo Results in 0 Reflections

a2=0

Port 2 Terminated in Zo

a1=0

Port 1 Terminated in Zo

Cascading Two 2-Port Networks

Cascading S-Parameters

aA1 aB2

bbbbA1bbbbB2

A

NetworkPort 1 Port 2

B

Network

Multiplying S-Parameter Matrices Doesn’t Work

ST

= SAS

B

Total Network T

5

8 February 2008

Convert to Normalized Incident and Reflected Wave T-Matrix

TT

= TAT

B

From S to T From T to S

S-Parameter Data Sets – Zo=50ohms

Low Loss, Reflections <-70dB

Coaxial Cable Small 50 mil ID

S2

1 S11

Modeled S-Parameters

E-Field Plot

6

8 February 2008

Coaxial Cable Larger 140 mil ID

S2

1 S11

Low Loss Reflections <-90dB

Modeled S-Parameters

Cascading the 2 Separate Simulations

Separate Simulations Cascaded Together

S2

1

S11

Cascaded S-Parameters are Not a Physical Reality

+

7

8 February 2008

Fields do not Match

S2

1

S11

Wrong Answer

Simulating the 2 Cables Together

Re-Simulate Together

Modeled S-Parameters

S2

1

S11

8

8 February 2008

E-Field Plot

Fields Changed by the Physical Mismatch

Physical Mismatch Increased Loss Reflections >-20dB

Optimizing a Topology Transition

Optimize the Transition Modeled S-Parameters

S2

1

S11

9

8 February 2008

Impedance Matching Transition

E-Field Plot

Match is improved to <-20dB by Tapering the Transition

Placement of Reference Planes

Test FixtureReference Plane

DUT BGA

ATE Test Fixture

DUT Socket

DUT BGAReference Plane

Pogo Pin Connector

ATE Pin ElectronicsReference Plane

Typical Reference Planes

DUT DUT BGA

Reference Planes for Cascading

10

8 February 2008

ATE Pin Electronics

Test FixtureReference Plane

DUT BGA

ATE Test Fixture

DUT Socket

DUT BGAReference Plane

Pogo Pin Connector

ATE Pin Electronics

ATE Pin ElectronicsReference Plane

DUT Socket ?Reference Plane

Designing for ModelingLarge PCB Via Design – 100 mil Small PCB Via Design – 40 mil

11

8 February 2008

TOP SIDEof PCBPogo Pin Cable

Pogo Pins

Large Via Small Via

Reduce the Size of a Model by Containing the Fields

High Speed Pogo Via Ultra-High Speed Pogo Via

Ground Vias 100 mils from Signal Via Ground Vias 40 mils from Signal Via

12

8 February 2008

Ground Vias 100 mils from Signal Via Ground Vias 40 mils from Signal Via

Ming Tsai

From IMS/MTT 2007

Conclusions

� Models only work if they can connect to the real world

� 3D-EM simulations are the only way to see what is happening at the transition of one structure to another.

13

8 February 2008

another.

� Design modifications to improve simulation and measurement of sub-components in a system.

Acknowledgements

Antonio Ciccomancini Scogna, CSTJose Moreira, VerigyMing Tsai, Amalfi SemiconductorKosuke Miyao, Verigy

SPECIAL THANKS TO:

14

8 February 2008