PS Semiconductor Assembly Demo Pres

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Transcript of PS Semiconductor Assembly Demo Pres

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Oracle Production Scheduling

Semiconductor Assembly Demo

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PS Functionality Summary• Event-based bucket less design

• Generative & repair based

•Work Order or Demand Centricmulti-stage Production Pegging

• Work Order Priorities

• Configured Work Orders

• Campaign Run Optimization

• Sequence dependent changeoverminimization

• Multi-Scenario with KPI’s 

• Intuitive graphical model

• Machine, Tool, Crew and Materialconstrained

• Dynamic capacity constraints

• Resource calendars• Automatic floating bottleneck

detection

• Alternate routings, operation andresources

• Complete Routing Precedencerelationships

• Resource dependent rates

• Resource dependent lot-sizes

• Dynamic safety stock levels

• Co-products and by-products

• Optimized product cycle

• Alerts with “Root Cause” 

• Advanced analytical views (Ganttcharts, line & bar graphs)

• Upstream Operation Buffering

• Offloading

• Work Order Units Of Effort

• Incremental Scheduling

• Shop Floor backlog visualization

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Floating Bottlenecks

Materials constraints dominate early in the solve

Machine and Crewconstraints are less critical

than materialsfor this data set

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Floating Bottlenecks

Machine and Crewconstraints being

addressed

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Materials constraints fully respected (Dark Green)

Floating Bottlenecks

Machine and Crewconstraints are not

critical almost feasible

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Floating Bottlenecks

All constraints (Machine,Crew, Tool, Material,

Storage) are fullyrespected

Adaptive scheduling technology based on the current data resource constraints

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Full Demand Pegging

All constraints(Machine,

Crew, Tool, Material,Storage) are fully

respected

Alerts for late orders with root cause

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Full Demand Pegging

DemandLine ItemRouting

Routing OperationCrew, Machine, Material

Automatic drilldown from Alert to bottleneck operation (Red)

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Full Work Order Pegging and alerts

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What-if Scenarios

Orange highlight denotesoperations affected bymanual change

Alerts can be resolved by expediting order for 9011 from standard 7 day to 5 day leadtime

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What-if Scenario Analysis Direct scenariocomparisons with planKPI’s 

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What-if Scenarios Analysis

Direct scenariocomparisons with flexibledemand impact analysis

Hot Lot simulations tounderstand which ordersWill be affected to meetnew Hot Lot order

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What-if Scenarios Analysis

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Easy to maintain changeover rules

Machine and OperationGroup-based rules canenumerate thousands of

possible changeovercombinations

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Flexible calendars for all resource types

Easy creation and editing ofcalendars with recurringpatterns

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Simultaneous and alternate resources

Preferred Crew

Alternate Crew

Simultaneous requirement for machine, and crews

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Demonstration Details

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Process\Machine Flow

Wafer Mount Wafer Saw Die Bond Wire Bond

MoldLead FormElectrical TestMarking

Tape and Reel

Resource: Mounter Resource: Saw Resource: Die BonderType: Item-specificmachines

Resource: Wire BonderType: product-specificsecond step

Resource: MolderResource: FormerType: alternatemachine that runs

half as fast

Resource: TesterType: simultaneouswith handler

Resource: MarkerType: pooledresource

Resource: T&RType: crew modeled

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Inventory Flow

Wafer Mount Wafer Saw Die Bond Wire Bond

MoldLead FormElectrical TestMarking

Tape and Reel

Wafer BankAll wafers in bank are probed

Die Bank 

Finished GoodPart number includes package typeBlank = QW-222

S=C4PAK-1=QW-262

T&R Finished GoodFinished good number & -TR,TRR or TRL

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Demo Product List

FGPart Description Package Family Yield

Cycle

Time

(days) Mfg. Site Die# Die Qty

Die

Yield

Transit

Time Wafer# WaferQty

Die Per Wafer

(1/WaferQTY)

Wafer

Yield

Wafer Cycle

Time (days)

10RFQ035 10A, 35V, SR QW-222 10A 0.98 4 Toronto 5PKS717 1 1 5 5PKS717W 0.00076994 1300 0.91 8

10RFQ035 TR 10A, 35V, SR QW-222,T&R 10A 0.98 4 Toronto 5PKS717 1 1 5 5PKS717W 0.00076994 1300 0.91 8

10RFQ035S 10A, 35V, SR C4PAK 10A 0.98 4 Toronto 5PKS717 1 1 5 5PKS717W 0.00076994 1300 0.91 8

10RFQ040 10A, 40V, SR QW-222 10A 0.96 4 Toronto 5PKS717 1 1 5 5PKS717W 0.00076994 1300 0.91 8

10RFQ040-1 10A, 40V, SR C4PAK 10A 0.96 4 Toronto 5PKS717 1 1 5 5PKS717W 0.00076994 1300 0.91 8

10RFQ040S 10A, 40V, SR QW-262 10A 0.96 4 Toronto 5PKS717 1 1 5 5PKS717W 0.00076994 1300 0.91 8

12TCQ035 12A, 35V, SR QW-222 12A 0.9 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ035 TR 12A, 35V, SR QW-222, T&R 12A 0.9 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ035-1 12A, 35V, SR C4PAK 12A 0.9 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ035S 12A, 35V, SR QW-262 12A 0.9 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ040 12A, 40V, SR QW-222 12A 0.99 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ040-1 12A, 40V, SR C4PAK 12A 0.99 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ040S 12A, 40V, SR QW-262 12A 0.99 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 812TCQ045 12A, 45V, SR QW-222 12A 0.9 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ045-1 12A, 45V, SR C4PAK 12A 0.9 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

12TCQ045S 12A, 45V, SR QW-262 12A 0.9 4 Toronto 5PKS594 1 1 5 5PKS594W 0.00037144 2700 0.92 8

MBR2080TC 20A, 80V, SR QW-222 20A 0.98 4 Toronto 5PKS006 2 1 5 5PKS006W 0.00064604 1550 0.9 8

MBR2080TC TR 20A, 90V, SR QW-222 20A 0.99 4 Toronto 5PKS006 2 1 5 5PKS006W 0.00064604 1550 0.9 8

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User Scenarios

• Build schedule, service level and most utilizedresource

• Reconcile Shop Floor Backlog

• Overtime scenario

• New Order Simulation

• Emergency maintenance downtime