Post on 16-Dec-2014
description
McKinney, Texas
Just like an old friend, we can do it all
Microelectronics
Medical
Glass Bonders
Conductive silvers
Optically clear
Encapsulants
Conformal coatings
Electronics
MicroCoat Technologies, LLC
Military
Environmental Environmental
Responsibility Responsibility
&&
Demonstrable Cost Demonstrable Cost SavingsSavings
MicroCoat TechnologiesMicroCoat TechnologiesMicroCoat TechnologiesMicroCoat Technologies
MicroCoat Technologies, LLC
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THE 3 MAJOR FACTORS THE 3 MAJOR FACTORS EFFECTING COSTS ARE EFFECTING COSTS ARE …….…….
THE 3 MAJOR FACTORS THE 3 MAJOR FACTORS EFFECTING COSTS ARE EFFECTING COSTS ARE …….…….
APPLICATION SPECIFIC COSTSAPPLICATION SPECIFIC COSTS
TANGIBLE COSTSTANGIBLE COSTS
INTANGIBLE COSTSINTANGIBLE COSTS
MicroCoat Technologies, LLC
µ
Likely to Increase Product Performance, Likely to Increase Product Performance, Durability, & User SafetyDurability, & User Safety
Higher Productivity, as in WIP (Cycle Higher Productivity, as in WIP (Cycle Time)Time)
Regulatory Compliant Materials per Regulatory Compliant Materials per OSHA, EPA, FDAOSHA, EPA, FDA
Lower Energy CostsLower Energy Costs
APPLICATION SPECIFIC COSTS
MicroCoat Technologies, LLC
No Solvents and VOC (Volatile Organic No Solvents and VOC (Volatile Organic Compounds) TreatmentCompounds) Treatment
Less Downtime and MaintenanceLess Downtime and Maintenance Lower Energy CostsLower Energy Costs Less ScrapLess Scrap Less Waste & Waste DisposalLess Waste & Waste Disposal Lower Tooling & Fixturing CostsLower Tooling & Fixturing Costs Lower Labor RatesLower Labor Rates Lower OverheadLower Overhead May Lower Insurance RateMay Lower Insurance Rate Lower Operating CostsLower Operating Costs
Tangible CostsTangible Costs
MicroCoat Technologies, LLC
Intangible Costs Can Be More Compelling Than Intangible Costs Can Be More Compelling Than Tangible CostsTangible Costs
Regulatory CompliantRegulatory Compliant
• -OSHA (Health)-OSHA (Health)
• -FDA (Safety)-FDA (Safety)
• -EPA (Waste Disposal)-EPA (Waste Disposal)
• -No Solvent Handling-No Solvent Handling
• -May Improve Quality-May Improve Quality
• -Higher Capacity Utilization-Higher Capacity Utilization
• -A Process Not Achieved by Another -A Process Not Achieved by Another MethodMethod
Intangible CostsIntangible Costs
MicroCoat Technologies, LLC
Maximizing a Maximizing a Plant'sPlant's
Real Estate Real Estate
• Plant managers (our customers), restructure and Plant managers (our customers), restructure and reconfigure every square inch of the "real estate" reconfigure every square inch of the "real estate" under their care to increase throughput, output under their care to increase throughput, output and quality, reducing labor and waste as much as and quality, reducing labor and waste as much as possible in the process. Capital improvements possible in the process. Capital improvements focus not so much on expanding plant size as on focus not so much on expanding plant size as on wringing as much production as is mechanically wringing as much production as is mechanically and humanly possible from existing capacity. and humanly possible from existing capacity.
• One 6-10 foot UV conveyor will replace ~100-500 One 6-10 foot UV conveyor will replace ~100-500 sq. ft. of conventional ovens and save an sq. ft. of conventional ovens and save an enormous amount of energy dollars and real enormous amount of energy dollars and real estateestate
MicroCoat Technologies, LLC
SHORTENING CYCLE SHORTENING CYCLE TIMETIME SHORTENING CYCLE SHORTENING CYCLE TIMETIME
WIP (Work in Process)WIP (Work in Process)
Labor per PartLabor per Part
Overhead per PartOverhead per Part
REDUCESREDUCES
THE RESULT! THE RESULT!
PRODUCTIVITY INCREASESPRODUCTIVITY INCREASES
MicroCoat Technologies, LLC
The Complete UV/Visible Light The Complete UV/Visible Light
Adhesive Adhesive Assembly PackageAssembly Package
The Complete UV/Visible Light The Complete UV/Visible Light
Adhesive Adhesive Assembly PackageAssembly Package Glob Tops and Underfills for COB & Flip Glob Tops and Underfills for COB & Flip
Chips (Clear & Opaque)Chips (Clear & Opaque) Wire Tacking Wire Tacking Peelable & Water Soluble Masks Peelable & Water Soluble Masks Potting & EncapsulatingPotting & Encapsulating Conformal CoatingsConformal Coatings Conductive & Resistive MaterialsConductive & Resistive Materials
MicroCoat Technologies, LLC
Conformal CoatingsConformal Coatings
UV, Dark Cure & UV, Dark Cure & Heat CureHeat Cure
Conformal CoatingsConformal Coatings
UV, Dark Cure & UV, Dark Cure & Heat CureHeat Cure
MicroCoat Technologies, LLC
UV Cured UV Cured Peelable & Peelable & Water Soluble Water Soluble
Solder MasksSolder Masks Fluorescing,Fluorescing, & Non- & Non-FluorescingFluorescing
UV Cured UV Cured Peelable & Peelable & Water Soluble Water Soluble
Solder MasksSolder Masks Fluorescing,Fluorescing, & Non- & Non-FluorescingFluorescing
MicroCoat Technologies, LLC
Wire TackersWire Tackers Wire TackersWire Tackers
MicroCoat Technologies, LLC
The Application of The Application of Conformal CoatingsConformal Coatings
The Application of The Application of Conformal CoatingsConformal Coatings
MicroCoat Technologies, LLC
Non-Outgassing UV/Multi-Cure EpoxyNon-Outgassing UV/Multi-Cure Epoxy Adhesives for the Disc Drive IndustryAdhesives for the Disc Drive Industry
MicroCoat Technologies, LLC
Inductor Encapsulants For Vacuum Pick & Place Inductor Encapsulants For Vacuum Pick & Place
Air Coil Molded Surface “Flat” Over WiresAir Coil Molded Surface “Flat” Over Wires
MicroCoat Technologies, LLC
Spray or Dip Coatings
UV Cure SMD LED Encapsulants UV Cure SMD LED Encapsulants
MicroCoat Technologies, LLC
Fully Automated, PC Controlled, Fully Automated, PC Controlled, Inductor Molding ProcessInductor Molding Process
DISPENSE BOWL FEED/PLACEMENT KNOCKOUT
UPPER SHIELD
GLASS PLATE 8mm TRACK
1 FOCUSED UV SYSTEM COMPONENT CATCH
MicroCoat Technologies MicroCoat Technologies
McKinney, TXMcKinney, TX
MicroCoat Technologies, LLC
CLASS VI* MEDICAL CLASS VI* MEDICAL ADHESIVESADHESIVES
CLASS VI* MEDICAL CLASS VI* MEDICAL ADHESIVESADHESIVES
FACE MASK BONDINGFACE MASK BONDING STYLUS & CANNULA BONDINGSTYLUS & CANNULA BONDING RESERVOIR BONDINGRESERVOIR BONDING MOLDED SHELL BONDINGMOLDED SHELL BONDING CATHETER BONDINGCATHETER BONDING TUBE SET BONDINGTUBE SET BONDING * PASSES MOLD SPORE INITIATION* PASSES MOLD SPORE INITIATION
FOR:
MicroCoat Technologies, LLC
UV Cured Hearing AidUV Cured Hearing Aid Shells & Forms Shells & Forms UV Cured Hearing AidUV Cured Hearing Aid Shells & Forms Shells & Forms
Hard or Flexible ShellsHard or Flexible Shells Opaque Glob Top Over ICOpaque Glob Top Over IC
ITC & CIC Hearing Aid ITC & CIC Hearing Aid Shells , Fill, & IC Glob TopShells , Fill, & IC Glob Top
MicroCoat Technologies, LLC
MicroCoat TechnologiesMicroCoat Technologies
Moisture Protection for Moisture Protection for SwitchesSwitches
Electrical/Electronic Equipment Automotive Machine Tools Medical Equipment and DevicesTrucks and Busses Heavy Equipment Lawn and Garden Restaurant Equipment
MicroCoat TechnologiesMicroCoat Technologies
Restriction on Hazardous Substances Restriction on Hazardous Substances (RoHS) (RoHS)
Waste Electrical and Electronic Equipment Waste Electrical and Electronic Equipment (WEEE) (WEEE)
• On July 1, 2006, the European Union will begin restricting the material content On July 1, 2006, the European Union will begin restricting the material content of electronics products being shipped within and into the EU. Several elements of electronics products being shipped within and into the EU. Several elements and compounds are involved, but the most common is lead (Pb). “Lead-Free” and compounds are involved, but the most common is lead (Pb). “Lead-Free” isn’t just about manufacturing, it is about doing business in Europe, and isn’t just about manufacturing, it is about doing business in Europe, and electronics companies cannot wait until 2006 to get started. electronics companies cannot wait until 2006 to get started.
• MicroCoat Technologies has developed both epoxy and acrylic conformal MicroCoat Technologies has developed both epoxy and acrylic conformal coatings to help alleviate fears of tin whisker contamination floating around coatings to help alleviate fears of tin whisker contamination floating around your circuitry. MCT also manufactures special harder Dual Cure (UV/Thermal) your circuitry. MCT also manufactures special harder Dual Cure (UV/Thermal) coatings for coating tight lead space IC’s for protection against tin whisker coatings for coating tight lead space IC’s for protection against tin whisker migration across very small pitch leadsmigration across very small pitch leads
• Call or E-mail us today for more information about these materialsCall or E-mail us today for more information about these materials• Tel: +1-972-678-4950 Fax: +1-214-257-8890 or E-Mail to Tel: +1-972-678-4950 Fax: +1-214-257-8890 or E-Mail to
RoHS.coatings@m-coat.comRoHS LinksRoHS Links
• Government SitesGovernment Sites http://www.dti.gov.uk/sustainability/pdfs/finalrohs.pdf http://www.dti.gov.uk/sustainability/weee/http://www.dti.gov.uk/sustainability/weee/
• Industry Sites: Industry Sites: http://www.leadfree.org/ http://www.nemi.org/• Independent Sites: Independent Sites: http://www.pb-free.info/ http://www.pb-free.com/
MicroCoat TechnologiesMicroCoat Technologies
MicroCoat TechnologiesMicroCoat Technologies
MicroCoat TechnologiesMicroCoat Technologies
Lead Coating To Reduce The Lead Coating To Reduce The Possibility Of Tin Whisker Possibility Of Tin Whisker Migration On Fine Pitch IC’sMigration On Fine Pitch IC’s
MICROELECTRONICSMICROELECTRONICS MICROELECTRONICSMICROELECTRONICS
MicroCoat Technologies, LLC
Optically Clear Glob Tops Optically Clear Glob Tops forfor IC’s, LED’s, EPROMS, Etc. IC’s, LED’s, EPROMS, Etc.
Without SiliconeWithout Silicone
Optically Clear Glob Tops Optically Clear Glob Tops forfor IC’s, LED’s, EPROMS, Etc. IC’s, LED’s, EPROMS, Etc.
Without SiliconeWithout Silicone Refractive Index 1.49 - 1.91!!!!!Refractive Index 1.49 - 1.91!!!!! Transmissivity @ 990nm 99%Transmissivity @ 990nm 99% R-I 1.9 @ 850 nmR-I 1.9 @ 850 nm Operating Temperature Range Operating Temperature Range
of -55C to +150C of -55C to +150C
UV Curable in < 20 seconds !UV Curable in < 20 seconds !MicroCoat Technologies, LLC
Optically Clear UV Cured Optically Clear UV Cured
Photo Cell Coatings Photo Cell Coatings
MicroCoat Technologies, LLC
MicroCoat TechnologiesMicroCoat Technologies
Optically Clear Coatings Optically Clear Coatings and Adhesives for;and Adhesives for;
•WADM Modules •Modulators•Attenuators•Pump Lasers•Switches•Amplifiers
Picture of Sinclair Manuf. Packages
Smart Card IC Smart Card IC CoatingsCoatings Smart Card IC Smart Card IC CoatingsCoatings
MicroCoat Technologies, LLC
MicroCoat TechnologiesMicroCoat Technologies
Epoxy Sealing of Hybrids Epoxy Sealing of Hybrids and Power Devicesand Power Devices
Epoxy Sealing of Hybrids Epoxy Sealing of Hybrids and Power Devicesand Power Devices
Non-conductive adhesives for lid sealing, die attach, etc.Non-conductive adhesives for lid sealing, die attach, etc.
Passes gross leak, temp cycle, temp shock.Passes gross leak, temp cycle, temp shock.
Withstands die attach to >340CWithstands die attach to >340C
JOE’S HYBRIDCOMPANY
MCT 3417Hi Temp Sealing
Passes 340C Die Attach 5 minutesPasses 350 Cycles -65C- +150C
Passes 85/85Passes Gross Leak
MicroCoat TechnologiesMicroCoat Technologies
MicroCoat Technologies
1316 Somerset Drive McKinney, TX 75070 www.m-coat.com +1-972-678-4950 Fax +1-214-257-8890
Unparalleled in Polymer Coatings and Adhesives Technology TM
Product Data Sheet
MicroCoat 3417-2
A Single Component, Toughened, Microelectronic Grade Package Sealant with a Service Temperature of <-100oC to Over >340°C and Meets NASA Low Outgassing Specifications
MicroCoat 3417-2 features a unique blend of performance properties including both high shear and peel strengths along with convenient handling and high/low temp properties. This is a one component system formulated to cure at elevated temperatures. 3417-2 has a number of outstanding processing advantages;
No mixing is necessary prior to use. The viscosity remains constant with time (i.e. it will not thicken over time) Working life is unlimited at room temperature, and the material is room temperature storable No cleanup required in-between shifts
MicroCoat 3417-2 forms high strength bonds for service over the remarkably wide temperature range of <-100oC to over 300°C and is used for Microelectronic Package Sealing for Kovar/Ceramic, Ceramic/Ceramic, Ceramic/Thick Film Gold, Pd/Au, Pt/Pd/Au, etc sealing. As a toughened system, 3417-2 offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking. It is 100% reactive and does not contain any diluents or solvents. 3417-2 is remarkably resistant to severe thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. Adhesion to metals, glass, and ceramics is excellent. The cured epoxy is a superior electrical insulator and is colored is gray. MicroCoat Polymer System 3417-2’s high performance coupled with its convenient handling make it widely used in a variety of applications in the aerospace, electronic, microelectronics, electrical, automotive and chemical industries. MicroCoat 3417-2 will meet NASA low outgassing specifications. Product Advantages
A single component system; no mixing required prior to use, no viscosity changes over time. Room temperature storable; not premixed and frozen! Versatile cure schedules. High shear and peel strength to similar and dissimilar substrates over the remarkably wide
temperature range of -100oC – 340oC. (Note: Color changes to slightly amber >300oC) Passes Gross Leak – Seal Integrity - Mil-Std-883 Method 5005 Sub Group 3 Mil-Std-883 1014 2)
Gross Leak Test Good electrical insulating properties and chemical resistance. Superior thermal shock, impact and stress cracking fatigue resistance, Will meet NASA low outgassing per ASTM E-595, NASA MSFC 1443, Mil-Std-883 5011.4 (3.8.6) RoHS Compliant
The information contained herein, is, to the best of our knowledge accurate. However, MicroCoat Technologies, LLC does not assume any liability whatsoever for the accuracy or completeness of the information contained herein. Final determination of the suitability of any material is the sole responsibility of the user. The information contained herein is considered typical properties and is not intended to be used as specifications for our products. This information is offered solely to assist purchasers in selecting the appropriate products for purchaser’s own testing. All products may present unknown hazards and should be used with the proper precautions. Although certain hazards are described herein and in the Material Safety Data Sheets, we cannot guarantee that these are the only hazards that exist. Repeated and prolonged exposure to epoxy resins can cause sensitization or other allergic responses.
Conductive, Non-Conductive, Non-Conductive, Conductive, and and Thermally Conductive Die Attach Thermally Conductive Die Attach
Adhesives Adhesives
Conductive, Non-Conductive, Non-Conductive, Conductive, and and Thermally Conductive Die Attach Thermally Conductive Die Attach
Adhesives Adhesives
Al2O3
AlN
BoN
Diamond
Ag
MicroCoat Technologies, LLC
In electronics, thermal management is crucial in both the design of circuit-board assemblies and in the production of semiconductor materials. For PC boards a crucial aspect can be the heating or cooling power required to keep a circuit within its specified operating temperature range.In the manufacturing of silicon wafers it is important to maintain a very uniform temperature distribution across the wafer in order to achieve quality production processes and high yields.
Conductive AdhesivesConductive Adhesives
• SMD Attach To PCB and SMD Attach To PCB and CeramicCeramic
• Screen Printing TracesScreen Printing Traces• Die AttachDie Attach• Solder ReplacementSolder Replacement• Flex Silver TracesFlex Silver Traces• Flex Carbon TracesFlex Carbon Traces• Anti-StaticAnti-Static• Chip Component TerminationChip Component Termination• Tantalum Capacitor Tantalum Capacitor
TerminationTermination• Static DischargeStatic Discharge• Platable For SMD ComponentsPlatable For SMD Components• Quick-Set PCB RepairQuick-Set PCB Repair• Bio-SensorsBio-Sensors• Silver Spray-OnSilver Spray-On
Low Outgassing Die AttachLow Outgassing Die AttachAdhesivesAdhesives
UV/Heat Cure for HighUV/Heat Cure for HighAccuracy Placement of Accuracy Placement of Opto DevicesOpto Devices
MicroCoat Technologies, LLC
MicroCoat TechnologiesMicroCoat Technologies
Advantages of Advantages of Conductive Conductive Adhesives Adhesives Over SolderOver Solder• Low Thermal Processing StressLow Thermal Processing Stress• Thermomechanical Fatigue ResistanceThermomechanical Fatigue Resistance• Low VOC’sLow VOC’s• Eliminates Solder MaskEliminates Solder Mask• Excellent Fine PitchExcellent Fine Pitch• Wide Process WindowWide Process Window• NO Residues, high SIRNO Residues, high SIR• No CleanNo Clean• NO LEAD!!NO LEAD!!
MicroCoat Technologies, LLC
MicroCoat TechnologiesMicroCoat Technologies
• 85% Ag – NO ORGANICS85% Ag – NO ORGANICS• NO Outgassing – NONE!, NO Outgassing – NONE!,
NADA!, ZIPPO!, LING!, NULL!, NADA!, ZIPPO!, LING!, NULL!, REI!REI!
DOWN THE HOLE
LAUNCH
PAD
APPROVED FOR A HARD LANDING ON VENUS!!!!!!!APPROVED FOR A HARD LANDING ON VENUS!!!!!!!
SUPER HIGH SUPER HIGH TEMPERATURETEMPERATURE CONDUCTIVE CONDUCTIVE
DIE ATTACH ADHESIVE TO DIE ATTACH ADHESIVE TO >650>650ooCC
Wirebonded Die394-95Ni/Moly TabEutectic Bond (Sn/Ge)Au PadSubstrate
MicroCoat TechnologiesMicroCoat Technologies
UV/Thermal Cure UV/Thermal Cure Conductive Conductive Adhesive for Adhesive for Die AlignmentDie Alignment
AdhesiveAdhesive Die Attach Die Attach Align &Align & Thermal Thermal Perfectly Aligned DevicesPerfectly Aligned Devices DispenseDispense UV CureUV Cure Cure Cure
UV Light Wand
MicroCoat Technologies, LLC
MicroCoat TechnologiesMicroCoat Technologies
Flip Chip Bumping Using Flip Chip Bumping Using Conductive Conductive
SilverSilver• Adhesive bumpingAdhesive bumping is a flip-chip bumping is a flip-chip bumping
process that stencils electrically conductive process that stencils electrically conductive adhesive over an under-bump metallization adhesive over an under-bump metallization placed over the bond pad. The stenciled placed over the bond pad. The stenciled adhesive serves as the bump after it has adhesive serves as the bump after it has been cured. Mounting of adhesive-bumped been cured. Mounting of adhesive-bumped flip-chips also uses conductive adhesives. flip-chips also uses conductive adhesives.
Stenciled Conductive Ag
UV Cure Low Temperature UV Cure Low Temperature Glass Glass Replacement for Hybrid Replacement for Hybrid CircuitsCircuits
UV Cure Low Temperature UV Cure Low Temperature Glass Glass Replacement for Hybrid Replacement for Hybrid CircuitsCircuits
100% Solids100% Solids<25 Second Cure Time<25 Second Cure TimeWithstands 230Withstands 230ooC Solder ReflowC Solder ReflowPrint and Cure Before or After TrimmingPrint and Cure Before or After TrimmingNo Post Cure Resistor Drift - No Post Cure Resistor Drift - NoneNone!!
MicroCoat Technologies, LLC
Optoelectronic“Light Pipe” System
OptoelectronicOptoelectronicOptoelectronic“Light Pipe” System“Light Pipe” System“Light Pipe” System
• Customer Problem Solving
LED DETECTORLED DETECTOR
MicroCoat Technologies, LLC
?
• Customer Problem Solving
An optoelectronic “Light Pipe” System An optoelectronic “Light Pipe” System for Optical Switchesfor Optical Switches
MicroCoat Technologies, LLC
• Customer Problem Solving
An optoelectronic “Light Pipe” System An optoelectronic “Light Pipe” System for Optical Switchesfor Optical Switches
MicroCoat Technologies, LLC
Optically clear Coating
• Customer Problem Solving
An optoelectronic “Light Pipe” System An optoelectronic “Light Pipe” System for Optical Switchesfor Optical Switches
MicroCoat Technologies, LLC
White Reflective Coating
• Customer Problem Solving
An optoelectronic “Light Pipe” System An optoelectronic “Light Pipe” System for Optical Switchesfor Optical Switches
MicroCoat Technologies, LLC
Optional Black Coating
• Customer Problem Solving
Optical SwitchOptical Switch
An optoelectronic “Light Pipe” System An optoelectronic “Light Pipe” System for Optical Switchesfor Optical Switches
MicroCoat Technologies, LLC
Thermoelectric Thermoelectric ComponentsComponents Thermoelectric Thermoelectric ComponentsComponents
HOT’N-COLD CO.HOT’N-COLD CO.
Moderately Flexible, Moderately Flexible, High Temperature, UV CureHigh Temperature, UV CureCoatingCoating
Peltier DevicePeltier Device
MicroCoat Technologies, LLC
UV and UV/Visible UV and UV/Visible Light Light Curing Curing EquipmentEquipment
UV and UV/Visible UV and UV/Visible Light Light Curing Curing EquipmentEquipment
MicroCoat Technologies, LLC
The Energy Rule The Energy Rule The Waste Disposal RuleThe Waste Disposal RuleThe Labor RuleThe Labor Rule The WIP RuleThe WIP Rule The Overhead RuleThe Overhead Rule The Capacity RuleThe Capacity Rule The Real Estate RuleThe Real Estate Rule
The UV Rules ofThe UV Rules of ResponsibilityResponsibility
MicroCoat Technologies, LLC
SHORTENING CYCLE SHORTENING CYCLE TIMETIME SHORTENING CYCLE SHORTENING CYCLE TIMETIME
WIP (Work in Process)WIP (Work in Process)
Labor per PartLabor per Part
Overhead per PartOverhead per Part
REDUCESREDUCES
THE RESULT THE RESULT
Higher ProfitsHigher ProfitsMicroCoat Technologies, LLC