Post on 24-Mar-2020
SiP Conference China 2018Oct. 17-19, 2018Shanghai, China
Romain FrauxCEO – System Plus Consulting
Electronic Costing & Technology Experts
Power electronics – MEMS & Sensors – LED & Optoelectronics – Advanced Packaging – System
TRENDS IN AUTOMOTIVE SIP SYSTEMS: REVIEW BASED
ON TEARDOWN OF ACTUAL SOLUTIONS
2SiP Conference China 2018, September 17, 2018
6 COMPANIES TO SERVE YOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies
3SiP Conference China 2018, September 17, 2018
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
4SiP Conference China 2018, September 17, 2018
BUSINESS MODEL
Customer Specific
Catalog
Costing Tools Training
Reverse Costing
Teardown + Cost Analysis
5SiP Conference China 2018, September 17, 2018
FIELDS OF EXPERTISE
Pressure SensorGyro/AcceleroIMU/ComboOscillators/CompassEnvironmentGas SensorFingerprintMicrophoneLight/Optic
UV LEDLampWhite/Blue
InfraredVisible
WLPSiP
Embedded3D Packaging/TSV
Automotive Consumer
EnergyMedical Telecom
DiscreteModule
Compound (GaN, SiC)Power RF
6SiP Conference China 2018, September 17, 2018
OUTLINE
❑ Introduction
❑ System in Package in Automotive
▪ Power Modules
▪ Sensors
▪ Transmission
▪ RF
▪ Computing
System in Package illustrationSource: Amkor
7SiP Conference China 2018, September 17, 2018
INTRODUCTION
❑ Advanced Packaging
8SiP Conference China 2018, September 17, 2018
INTRODUCTION
❑ Automotive Electronics
Source: Bosch
9SiP Conference China 2018, September 17, 2018
System in Package in Automotive▪ Power Modules▪ Sensors▪ Transmission▪ RF▪ Computing
10SiP Conference China 2018, September 17, 2018
❑ Power Modules Market
▪ This Market forecast shows that the market for the Power Module devices will follow a rising trendwith an estimated 1.5 billion increase in the next five years.
POWER MODULES
11SiP Conference China 2018, September 17, 2018
❑ Molded IGBT Modules
▪ IGBTs and Diodes molded in a package.
▪ Strong presence in EV/HEV power units (VW, Toyota,
POWER MODULES
Bosch T-PM IGBT Module Infineon HybridPACKDSC Module
Toyota Prius DSC ModuleMitsubishi TPM IGBT Module
12SiP Conference China 2018, September 17, 2018
❑ Molded IGBT Modules
▪ Exemple of Internal Structure
POWER MODULES
Toyota Double Side Cooling Module Cross-Section
Copper Spacer
IGBT Diode
Emitter plate
Collector plate
Top copper leadframe
Thick copper leadframe
IGBT
Diode
Mitsubishi TPM Module Opening
13SiP Conference China 2018, September 17, 2018
❑ ADI µModules
▪ µModules offer real SiP integration
POWER MODULES
µModule Top View, X-Ray View, Opening View & Cross-Section View
14SiP Conference China 2018, September 17, 2018
POWER MODULES
❑ Linear Technology µModules
▪ 40A DC/DC Regulator with:
➢ Integrated constant-frequency current mode regulator
➢ Power MOSFETs
➢ 0.18μH Stacked Inductor
➢ Protection circuitry
➢ 5V regulator and other supporting discrete components.
LTM4636 µModule Cross-Sections
LTM4636 µModule
Package Molding
Stacked Inductor
15SiP Conference China 2018, September 17, 2018
POWER MODULES
❑ Linear Technology µModules
▪ Triple 10A Step-Down DC/DC μModule Regulator
➢ Included in the package are the switching controllers, power FETs,inductors, and most support components
Inductors
Controller
MOSFETs
Switching mode DC/DC converters
LTM4633 µModule Top View & Opening View
16SiP Conference China 2018, September 17, 2018
❑ Infineon DrBlade – Integrated Power Stage
▪ ASE aEASI Packaging Platform (Advanced Embedded Active System Integration)
▪ Organic Substrate Process Flow Modified to Meet High Power Applications
▪ 2 Power MOSFET + 1 Driver
▪ RDL: 2+1 Layer
POWER MODULES
Infineon TDA21320 Cross-Section
Infineon TDA21320 Top View, Bottom View & X-Ray View
MOSFET MOSFET
Copper HS
Copper LineCopper Line
Copper Line
Solder
17SiP Conference China 2018, September 17, 2018
System in Package in Automotive▪ Power Modules▪ Sensors▪ Transmission▪ RF▪ Computing
Source: Bosch
18SiP Conference China 2018, September 17, 2018
❑ Around 50 MEMS Components in a Car
SENSORS
Source: Bosch
19SiP Conference China 2018, September 17, 2018
❑ Around 50 MEMS Components in a Car
SENSORS
Source: Bosch
20SiP Conference China 2018, September 17, 2018
❑ Around 50 MEMS Components in a Car
SENSORS
Source: Bosch
21SiP Conference China 2018, September 17, 2018
❑ TPMS: Tire Pressure Monitoring System
▪ Mendatory in several countries
SENSORS
TPMS Integration TPMS Opening
TPMS Sensor
22SiP Conference China 2018, September 17, 2018
❑ TPMS: Tire Pressure Monitoring System
▪ Freescale (NXP) TPMS
SENSORS
Freescale FXTH87 TPMS Package Views, Opening & Cross-Section
Package Molding
Metal lid
AccelerometerASIC
Pressure Sensor
Silicone gel
Leadframe
Package Molding
23SiP Conference China 2018, September 17, 2018
❑ TPMS: Tire Pressure Monitoring System
▪ Infineon TPMS
SENSORS
Infineon SP37 TPMS Package Views, Opening & Cross-Section
ASIC MEMS
MEMS
Package molding
ASIC
Copper leadframe
24SiP Conference China 2018, September 17, 2018
❑ Airbag ECU
▪ Airbag ECU uses multiple inertial sensors
SENSORS
Continental Airbag ECU TRW (ZF) Airbag ECU
25SiP Conference China 2018, September 17, 2018
❑ Airbag ECU
▪ Continental Airbag ECU
➢ 2 x Panasonic Combo Sensors (Single-Axis gyro + 2-Axis Accelerometer)
➢ 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer)
SENSORS
Panasonic Combo Sensors NXP Single & Dual-Axis Accelerometers
Accelerometer
Gyroscope
ASIC
Accelerometer
ASIC
26SiP Conference China 2018, September 17, 2018
SENSORS
❑ Airbag ECU
▪ TRW (ZF) Airbag ECU
➢ 1 x Panasonic Gyroscopes (Single-Axis)
➢ 2 x NXP Accelerometer (Single + Dual-Axis Accelerometer)
NXP Single-Axis Accelerometer NXP Dual-Axis AccelerometerPanasonic Single-Axis Gyro
Accelerometer ASIC
Gyroscope ASIC
27SiP Conference China 2018, September 17, 2018
System in Package in Automotive▪ Power Modules▪ Sensors▪ Transmission▪ RF▪ Computing
28SiP Conference China 2018, September 17, 2018
TRANSMISSION CONTROL UNIT
Bosch TCU (Source: Bosch)
❑ Transmission Control Unit (TCU)
▪ Standard ECU
29SiP Conference China 2018, September 17, 2018
❑ Continental TCU
▪ Double Clutch Transmission (DCT)
▪ Bare-Die High-Density Interconnect (BD-HDI) substrate technology
▪ 13 ICs, 10+ MOSFETs, Diodes, Passives
TRANSMISSION CONTROL UNIT
Continental Advanced TCU
ICs
MOSFETS
31SiP Conference China 2018, September 17, 2018
System in Package in Automotive▪ Power Modules▪ Sensors▪ Transmission▪ RF▪ Computing
32SiP Conference China 2018, September 17, 2018
RF
❑ GPS IC
▪ Multi-die integration
Ublox GPS Chip
33SiP Conference China 2018, September 17, 2018
❑ Vehicle Central Infotainment Unit
▪ Network Access Device Module (NAD)
▪ 2G, 3G, 4G LTE, GNSS
RF
xxxxx
34SiP Conference China 2018, September 17, 2018
❑ Vehicle Central Infotainment Unit
▪ Network Access Device Module (NAD)
▪ 2G, 3G, 4G LTE, GNSS
RF
Wistron NeWeb Corp. NAD ModuleCross section of Electronic Board (10 layers)
35SiP Conference China 2018, September 17, 2018
System in Package in Automotive▪ Power Modules▪ Sensors▪ Transmission▪ RF▪ Computing
36SiP Conference China 2018, September 17, 2018
❑ Single-Chip Module
COMPUTING
Single-Chip Module Introduction (Source: NXP)
37SiP Conference China 2018, September 17, 2018
❑ nepes Roadmap
COMPUTING
Nepes Roadmap (Source: Nepes)
38SiP Conference China 2018, September 17, 2018
COMPUTING
❑ nepes System in Fan-Out WLP
▪ System-in-Package at wafer-level
▪ LPDDR2 Package-on-Package Configuration
▪ Embedded Flash
▪ Embedded PMIC
Discrete passives components
Flash Memory(SPI NOR )
PMIC
i.MX6Q or iMX6DApplication Processor
Via Frame (Through Package Via)
Source : Nepes
DRAM Package
SiP (AP + Flash + PMIC)
Package Cross-Section ©2017 by System Plus Consulting
APFlash
39SiP Conference China 2018, September 17, 2018
COMPUTING
Package Cross-Section – Bumps & RDLs©2017 by System Plus Consulting
Application Processor
Package Molding
SMD Capacitor
4-Layer RDL
Solder Ball
Redistribution Layers©2017 by System Plus Consulting
❑ nepes System in Fan-Out WLP
▪ Chip first type Fan-Out
▪ 4 Redistribution Layers (RDLs)
▪ Via Frame (Through Package Via) formed from a PCB panel for theredistribution of the memory but also to increase the strength of thepackage
40SiP Conference China 2018, September 17, 2018
AVAILABLE REPORTS
And many more !www.systemplus.fr
41SiP Conference China 2018, September 17, 2018
THANK YOU!
Customer Specific
Catalog
Costing Tools Training
Reverse Costing
Teardown + Cost Analysis