Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and Form

Deflash

Plating

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

High Speed

Wafer Sort

Gate /Base

ProbeSource/

Emitter ProbeHSWS process HSWS process

sorts out sorts out

electrically bad electrically bad

dice and ink it out.dice and ink it out.

High Speed Wafer SortHigh Speed Wafer SortSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Wafer Saw

DICING / WAFER SAWINGDICING / WAFER SAWING

unsawnunsawn waferwafer

connected diceconnected dice

wafer holderwafer holder

wafer tapewafer tape

sawn wafersawn wafer

singulated dicesingulated diceWafer sawing is to separate the Wafer sawing is to separate the

dice in wafer into individual chips.dice in wafer into individual chips.

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Die Attach

Die Attach is a process of bonding Die Attach is a process of bonding

the microchip on the leadframe.the microchip on the leadframe.

Cu Leadframe

Die Attach Material

Die or MicrochipDie or Microchip

Die AttachDie AttachSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

EUTECTIC DIE ATTACH SETEUTECTIC DIE ATTACH SET--UPUP

LEADFRAME w/ PLATINGLEADFRAME w/ PLATING

CAVITY COLLETCAVITY COLLET

DIE w/ BACKMETALDIE w/ BACKMETAL

HEATER BLOCK

SOFT SOLDER DIE ATTACH SETSOFT SOLDER DIE ATTACH SET--UPUP

SOFT SOLDER WIRE SOFT SOLDER WIRE

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

CAVITY COLLETCAVITY COLLET

DIE w/ BACKMETALDIE w/ BACKMETAL

HEATER BLOCK

LEADFRAME w/ PLATINGLEADFRAME w/ PLATING

EPOXY DIE ATTACH SETEPOXY DIE ATTACH SET--UPUP

SYRINGE SYRINGE

EPOXYEPOXY

NOZZLESNOZZLES

DIEDIE

FLAT FACE FLAT FACE

COLLETCOLLET

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

HEATER BLOCK

LEADFRAME w/ PLATINGLEADFRAME w/ PLATING

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Wirebond

99.99% Gold wires99.99% Gold wires

ThermosonicThermosonic wire bonding employs wire bonding employs

heat and ultrasonic power to bond Au heat and ultrasonic power to bond Au

wire on die surface.wire on die surface.

ThermosonicThermosonic WirebondWirebondSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

THERMOSONIC WIREBOND SETTHERMOSONIC WIREBOND SET--UPUP

Au WIRE

SPOOL

DIE BONDED LEADFRAME

CERAMIC

CAPILLARY

Au BALL

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

HEATER BLOCK

WIREBONDSWIREBONDS

DIE DIE

BALL BONDBALL BOND

(1ST bond)(1ST bond) WEDGE BOND OR WELDWEDGE BOND OR WELD

(2nd bond)(2nd bond)

LEADFRAME LEADFRAME

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Mold

Transfer molding is a Transfer molding is a

process of encapsulating process of encapsulating

the the wirebondedwirebonded microchip. microchip.

It gives the package its It gives the package its

distinct shape.distinct shape.Mold flashesMold flashes

(Molded Body)

Transfer MoldingTransfer MoldingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

TRANSFER MOLDING SETTRANSFER MOLDING SET--UPUP

CAVITIESCAVITIES

PLUNGERPLUNGER

PISTONPISTON

MOLD BASEMOLD BASE

MOLD MOLD

COMPOUNDCOMPOUND

MOLD TOOLMOLD TOOLWIREBONDED WIREBONDED

LEADFRAMELEADFRAME

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

MOLD TOOLMOLD TOOLMOLD COMPOUND MOLD COMPOUND

PELLETSPELLETS

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

MOLD TOOLMOLD TOOL

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Deflash

DeflashingDeflashing is a mechanical is a mechanical

process of removing the process of removing the

mold flashes and bleeds.mold flashes and bleeds.

DeflashDeflashSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

MOLD MOLD

FLASHESFLASHES

HIHI--PRESSURE NOZZLESPRESSURE NOZZLES MOLDED MOLDED

PACKAGEPACKAGE

BLASTING BLASTING

MEDIAMEDIA

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

DEFLASH SET UPDEFLASH SET UP

MOLD MOLD

FLASHESFLASHES

HIHI--PRESSURE NOZZLESPRESSURE NOZZLES MOLDED MOLDED

PACKAGEPACKAGE

BLASTING BLASTING

MEDIAMEDIA

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

DEFLASH SET UPDEFLASH SET UP

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Plating

Solder plating is the Solder plating is the

process of coating the leads process of coating the leads

with with SnSn--PbPb solder by solder by

electrolysis.electrolysis.

SnSn--PbPb coated leadscoated leads

Solder PlatingSolder PlatingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

SOLDER PLATING SET UPSOLDER PLATING SET UP

Semiconductor Manufacturing ProcessSemiconductor Manufacturing Process

SnSn--PbPb

SOLDER SOLDER

ANODESANODES

MOLDED MOLDED

LEADFRAMESLEADFRAMES

+ -

e-

Sn-Pb

PLATING

SOLUTION

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Trim & Form

Trim & Form is a Trim & Form is a

mechanical process of mechanical process of

trimming and trimming and leadformingleadforming

the leads.the leads.

Singulated packages/ unitsSingulated packages/ units

Trim and FormTrim and FormSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock

Test / Mark /

Reel

Electrical testing process Electrical testing process

sorts out fallsorts out fall--outs from outs from

electrically good units.electrically good units.

Electrical FallElectrical Fall--outsouts

Electrically good unitsElectrically good units

Electrical TestingElectrical TestingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

LASER marking process LASER marking process

imprints device name, imprints device name,

datecodedatecode & company & company

logo on the package.logo on the package. FFFF 8328304F8

32

8304

F832

8304

F832

8304

F832

8304

F832

8304

Laser MarkingLaser MarkingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

F832

8304

F832

8304

Tape & reel is the standard Tape & reel is the standard

packing for surface mount packing for surface mount

packages/ devices.packages/ devices.

Carrier tape

F832

8304

Tape and Reel PackingTape and Reel PackingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

BoxstockBoxstock

Static DissipativeStatic DissipativeEmbossed Carrier TapeEmbossed Carrier Tape

Antistatic Cover TapeAntistatic Cover Tape

Tape and Reel PackingTape and Reel PackingSemiconductor Manufacturing ProcessSemiconductor Manufacturing Process

Manufacturing TechnologyManufacturing TechnologyManufacturing Technology

Trim and FormPlating

Deflash

Wafer Saw Die Attach

Wire Bond Mold

Test / Mark /

Reel

High Speed

Wafer Sort

Boxstock