http://www.TheECMG.comhttp://www.TheECMG.com1

Presented To:

Customer NameCustomer Name

Company NameCompany Name

http://www.TheECMG.comhttp://www.TheECMG.com2

ECMGECMG At a glance At a glance

– Business created in CY 2001– Major focus on printed circuit boards– Represent six (6+) complementary China based PCB

fabricators– Five (5) offices in North America, two (2) in Europe

and one (1) in Asia– Seven (7) outside sales, Three (4) quotation analysts,

Three (3) CSRs; Fourteen (14) employees total– ECMG is atypical of most electronics representatives – Provide Global coverage for customers and Principals

alike

http://www.TheECMG.comhttp://www.TheECMG.com3

ECMG’sECMG’s PrincipalsPrincipals• Complementary Principals with minimal overlap in product offering, becase we know no one

shop can build all technology.

• Focused on rigid printed circuit boards (All China based)– Guang Dong Ellington Electronics Technology Co. ,LtdGuang Dong Ellington Electronics Technology Co. ,Ltd

• EllingtonEllington 2 to 12 layer2 to 12 layer Low-med. Tech (LMHV) Large Low-med. Tech (LMHV) Large volumevolume

– Shenzhen Sun&LYNN Circuits Electronic Co. ,LtdShenzhen Sun&LYNN Circuits Electronic Co. ,Ltd • Sun & LynnSun & Lynn 2 to 12 layer 2 to 12 layer Low-med tech HMLV (low MOV)Low-med tech HMLV (low MOV)

– Shenzhen Fastprint Circuit Technology Co LtdShenzhen Fastprint Circuit Technology Co Ltd• SFPCSFPC up to 50 layerup to 50 layer All technologies, time critical/QTA All technologies, time critical/QTA

ShopShop

– BoardTek Electronic CorporationBoardTek Electronic Corporation• BoardTek BoardTek 2 to 26 layer2 to 26 layer Hi tech, Exotic Material, HDI & Metal BackedHi tech, Exotic Material, HDI & Metal Backed

– Shenzhen Desow Technology Co. ,LtdShenzhen Desow Technology Co. ,Ltd • Desow Desow SS to 28 LayersSS to 28 Layers HMLV PCB & FPC

– Shenzhen Shennan Circuits Co., Ltd.Shenzhen Shennan Circuits Co., Ltd.• ShennanShennan 2 to 42 layer2 to 42 layer Hi tech, heavy Cu, XL formatHi tech, heavy Cu, XL format

– HD-FLEX TECHNOLOGY CO., LTDHD-FLEX TECHNOLOGY CO., LTD• H-D FlexH-D Flex 1 to 8 layer 1 to 8 layer LMLV FLEXIABLE PCBSLMLV FLEXIABLE PCBS

– Tat Chun Printed Circuit Board Co., Ltd.Tat Chun Printed Circuit Board Co., Ltd.• Tat ChunTat Chun SS to 6 layerSS to 6 layer Low tech/hi volumeLow tech/hi volume

• Extensive due diligence and customer feedback, world class pricing and quality

http://www.TheECMG.comhttp://www.TheECMG.com4

ECMG’sECMG’s Other SourcesOther Sources

Other Items sourced in China– LCD/LCM – PCBA & Sub-Assembly– Cable Assemblies– Sheet metal & Stamping– Plastic Injection Modeling– CNC machines tooling– Full Box build assembly– Heat Sinks & RFI Shields– AntennasCable Assemblies:– Semi-Rigid RF Cables and Flex RF Cables– Earphones– Medical Cables– Wire Harnesses– Wireless and Mobile Antennas– Fiber OpticalTurnkey Solutions / System Integrations:– Electro-Mechanical Assemblies– Box Build and Sub-Systems– Engineering Services– Surface Mount and Through Hole Capability

http://www.TheECMG.comhttp://www.TheECMG.com5

How isHow is ECMG ECMG different?different?

• PCB experts• Significant investment in hardware and software• Centralized hub for quoting, order entry/status

and technical queries• Global footprint• Maintain own ftp site for large data package

upload and dissemination to principals• Direct sales/sales affiliate combination equates

to 30+ sales people globally• ECMG has an employee based in China

http://www.TheECMG.comhttp://www.TheECMG.com6

TheThe ECMGECMG AdvantageAdvantage

• Our Principal’s missions are to provide customers with the highest quality products at world class prices

• ECMG’s mission is to provide a world class link between our Principals and our customers

• Asian pricing/ with domestic expertise. – Ability to deal with customers during the day in local

language and the factories at night

• “A Western face with Eastern advantages”

http://www.TheECMG.comhttp://www.TheECMG.com7

Index

Philippines (4)

St. Louis, MO (6)

Longmont , CO (1)

Montreal, PQ (2)

Budapest , HU (3)

Hong, Kong CN (1)

New England Area (2)

http://www.TheECMG.comhttp://www.TheECMG.com8

ECMG Major CustomersECMG Major Customers

http://www.TheECMG.comhttp://www.TheECMG.com9

Ellington Electronics Ellington Electronics Technology Co., Ltd.Technology Co., Ltd.

http://www.TheECMG.comhttp://www.TheECMG.com10

• Location• No. of Employees• Years in business• Capabilities

• Capacity• Approvals

• Zhongshan, Guangdong, PRC• 7000• 6• Double-sided and Multi-layer to 12• FR1, FR2, CEM1, CEM3, FR4• HAL, Ni/Au plating, OSP• ENIG, immersion silver• Carbon paste surface print • Peelable mask• Single-sided PTH• HDI, Laser Drilling

• 2,000,000 SqFt. per month• ISO 9001, 14001, TS 16949

Ellington Electronics Ellington Electronics Technology Co., Ltd.Technology Co., Ltd.

http://www.TheECMG.comhttp://www.TheECMG.comRev 06.30.08 11

Ellington Electronics Technology Co., Ellington Electronics Technology Co., Ltd.Ltd.

Items Production Prototype(<35ft 2 )

Panel Size 22 ” × 27 ” 24 ” × 30 “

Max Layer Counts 20 24

Board Thickness (max) 0.25 ” 0.25 “

                                (min) 0.012 “ 0.010 ”

Core Thickness(min) 0.003 “ 0.002 “

Drill Size Mechanical (min) 0.008 ” 0.006‘'

Drill Size Laser(min) 0.004 ” 0.003 “

Aspect Ratio 0.334027778 0.500694444

Line Width Spacing 1/3 oz (outer)

3.5mil/3.5mil 3mil/3mil

Line Width Spacing 1/2 oz (inner)

3mil/3mil 2.5mil/2.5mil

Layer to Layer Registration 0.004 ” 0.003 ”

Soldermask Plug Hole Hole Diameter: 24mil Hole Diameter: 32mil

Min Soldermask Dam 0.004 “ 0.003 “

Impedance Control (50/60/70/100/110/120)+/-

10% (50/60/70/100/110/120)+/-8%

Multilayer : Copper Weight (inner) (outer)

4oz 5 oz

  3oz 4oz

Double Side: Copper Weight 5oz 6oz

Buried Via Yes Yes

Blind Via Yes Yes

Rambus 28 Ohm +/-10% 28 Ohm ± 8%

HDI 1+N+1 4mil Via hole 2+N+2 4mil Via hloe

Items Production Prototype(<35ft 2 )

Surface Finishing  HASL  Selective immersion gold

plating 

   Entek  HASL

  Immersion Gold v

Flash Gold  Entek

  Contact Finger Gold

Plating  Glicoat

   Carbon Ink  Immersion Gold 

   Immersion Sliver  Flash Gold

   Immersion Tin  Contact Finger Gold

Plating

     Carbon Ink

     Immersion Sliver

     Immersion Tin

Green Technology  OSP Laminate for lead-free

processing

   Immersion Gold  Halogen free material

   Flash Gold  

   Immersion Silver  

   Immersion Tin  

http://www.TheECMG.comhttp://www.TheECMG.com12

SHENZHEN SUN & LYNN SHENZHEN SUN & LYNN CIRCUIT CO., LTDCIRCUIT CO., LTD

http://www.TheECMG.comhttp://www.TheECMG.com13

SHENZHEN SUN & LYNN SHENZHEN SUN & LYNN CIRCUIT CO., LTDCIRCUIT CO., LTD

• Location• No. of Employees• Years in business• Capabilities

• Capacity• Approvals

• Bao An region of Shenzhen• 1700• 10• Double-sided and Multi-layer to 12• FR1, FR2, CEM1, CEM3, FR4• HAL, Ni/Au plating, OSP• ENIG, immersion silver• Carbon paste surface print • Peelable mask• Single-sided PTH

• 700,000 SqFt. per month• ISO 9001, 14001, TS 16949

http://www.TheECMG.comhttp://www.TheECMG.com14

Shenzhen Fastprint Shenzhen Fastprint Circuit Technology Co., Circuit Technology Co.,

LTD.LTD.• Largest QTA/Proto/small volume shop in

China

• 24 hour to 7 day turns

http://www.TheECMG.comhttp://www.TheECMG.com15

Shenzhen Fastprint Circuits Co., Shenzhen Fastprint Circuits Co., LTD.LTD.

• Location• No. of Employees• Years in business

• Capabilities

• Capacity• Approvals

• Shenzhen, Guangdong, PRC• 300• 18

• Material: FR4,Halogen Free, Different material mixing laminating• Max panel size: 23inch*35inch • The standard PCB thickness: 8.3-220mil • Max Aspect Ratio:1:12.5• Min layer by layer spacing: 2mil • Min track width/ gap 3/ 3mil• Min pad size: 16mil• Surface finishes HASL, Flash Gold,

Immersion Gold, Gold finger, OSP• Gold Fingers :• Ni/Au plated: (Ni>5um, Au>0.75um) • Select immersion Ni/Au or Chemical :• Ni/Au: Ni>4um, Au>0.05um • Flash gold plated: Ni>5um, Au>0.075um • Solder mask thickness: 9 +/- 2 um • OSP(ENTEK) thickness: 0.30-0.16um•  Via holes of Solder mask • Via holes solder mask covered.• Via holes of BGA solder mask plugged,

No Sn/Pb in the via holes.• Impedance Control PCB• Controlled Impedance tolerance:

up to 50Ω +/- 5 Ω; over 50 Ω +/- 10%

• 100,000 SqFt. per month, 4000 new jobs tooled monthly• ISO 9001, 14001,

http://www.TheECMG.comhttp://www.TheECMG.com16

Shenzhen Shennan Circuits Co., Shenzhen Shennan Circuits Co., LTD.LTD.

http://www.TheECMG.comhttp://www.TheECMG.com17

Shenzhen Shennan Circuits Co., Shenzhen Shennan Circuits Co., LTD.LTD.

• Location• No. of Employees• Years in business• Capabilities

• Capacity• Approvals

• Shenzhen, Guangdong, PRC• 800• 22• Double-sided to Multi-layer up to 42• Large format backplanes up to 0.300”• FR1, FR2, CEM1, CEM3, FR4, RCC• Mixed Materials, high frequency, • Aluminum backed PCBs• HAL, Ni/Au plating, OSP• Immersion Gold Plating• HDI microvia blind and buried • Controlled Impedance • One of first IPC members in China• Peelable mask• Single-sided PTH

• 750,000 SqFt. per month• ISO 9001, 14001, TS 16949, TL 9000

http://www.TheECMG.comhttp://www.TheECMG.com18

Tat Chun PCB Co., Ltd.Tat Chun PCB Co., Ltd.

http://www.TheECMG.comhttp://www.TheECMG.com19

Tat Chun PCB Co., Ltd.Tat Chun PCB Co., Ltd.• Location• No. of Employees• Years in business• Capabilities

• Capacity• Approvals

• Zhongshan, Guangdong, PRC• 2500• 18• Single-sided & Double-sided, • Multi-layer up to 6• XPC, FR1, FR2, CEM1, CEM3,

FR4• HAL, Ni/Au plating, OSP• Immersion Gold Plating• Carbon paste surface print • Silver through hole• Peelable mask• Single-sided PTH• 3,000,000 SqFt. per month• ISO 9001, 14001, TS 16949

http://www.TheECMG.comhttp://www.TheECMG.com20

H-D Flex Technology Co., H-D Flex Technology Co., LTD.LTD.

http://www.TheECMG.comhttp://www.TheECMG.com21

H-D Flex Technology Co., H-D Flex Technology Co., LTD.LTD.

• Location• No. of Employees• Years in business

• Capabilities

• Capacity• Approvals

• Doumen, Guangdong, PRC• 400• 3

• Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs

• Number Of Layer• Flexible 1~8• Rigid-Flex 2~10• Material PI PET FR-4 BT• Copper Thickness 1/3oz 1/2oz

1oz max 2oz• Min Board thickness 2mil• Max. Board Thickness 126mil• Max Panel Size 18 X 24inch (460mm x

616mm)• Min. Trace line width and spacing• Single Sided 2mil / 2mil• Double Sided 3mil / 3mil• 4 Layers 3mil / 3mil• 6 Layers 3mil / 3mil• 8 Layers 3mil / 3mil• Min. Hole Diameter 0.05mm(2mil) • Punching 0.30mm(12mil)

• 240,000 SqFt. per month• ISO 9001-2000, ISO 14000

http://www.TheECMG.comhttp://www.TheECMG.com22

H-D Flex Technology Co., H-D Flex Technology Co., LTD.LTD.

• Location• No. of Employees• Years in business

• Capabilities

• Capacity• Approvals

• Doumen, Guangdong, PRC• 400• 3

• Single Sided, double sided, multi layer flexible circuits and multi layer rigid flex PCBs

• Number Of Layer• Flexible 1~8• Rigid-Flex 2~10• Material PI PET FR-4 BT• Copper Thickness 1/3oz 1/2oz

1oz max 2oz• Min Board thickness 2mil• Max. Board Thickness 126mil• Max Panel Size 18 X 24inch (460mm x

616mm)• Min. Trace line width and spacing• Single Sided 2mil / 2mil• Double Sided 3mil / 3mil• 4 Layers 3mil / 3mil• 6 Layers 3mil / 3mil• 8 Layers 3mil / 3mil• Min. Hole Diameter 0.05mm(2mil) • Punching 0.30mm(12mil)

• 240,000 SqFt. per month• ISO 9001-2000, ISO 14000

http://www.TheECMG.comhttp://www.TheECMG.com23

BoardTek Electronic CorporationBoardTek Electronic Corporation • Multilayer PCB - BoardTek's main product. To differentiate with most of the PCB shop in Taiwan or Asia, BoardTek take a lot of effort in R&D to fulfill our customer's

needs! BoardTek provide higher layer count, blind/buried vias, high performance material, heavy copper foil, impedance control, edge plating, multi-tier, castellation… into traditional multilayer PCB.

• High performance laminate materialBoardTek can process various material for different application. It includes High Tg, low Dk, low loss, low water absorption like GETEK, Polyimide, Cyanate ester, BT, PPE, and many others. We also specialize in mix-dielectric (or hybrid dielectric) multilayer (Please refer to RF/microwave PCB)

• High speed circuits or impedance control PCB BoardTek worked for high speed module like Rambus memory module (RIMM) for many years. We can control the circuit characteristics in single-ended as well as differential impedance control with very tight tolerance (see below). For some application like RIMM, we also control the delta impedance (ΔZ0), propagation delay (Tpd), and ΔTpd by monitor the laminate dielectric constant and thickness.

• Blind/buried via PCBFor high density PCB application, BoardTek can build multilayer board by sequential lamination and laser via (please refer to Microvia PCB )

• Heavy copperBoardTek can process multilayer PCB with very thick copper foil in inner or outer layer for high power PCB application.

• High layer countBoardTek keep working with our customer in high layer count multilayer PCB. To improve the layer-to-layer registration, we installed the pin lamination system for this purpose. BoardTek is also plan to setup a new wet process line to increase the board thickness up to 0.25" or even higher.

• Others: Laminate material: FR-4, high Tg FR-4, FR-5, GETEK, BT, Polyimide, PPE, PTFE(Teflon), Polyester (GIL), Cyanate ester, Green laminate (halogen free), Ohmega-ply, Resin coated copper foil (RCC), Thermal clad, T-clad Surface finishing: HASL, OSP, immersion Ni/Au, bondable Ni/Au, immersion Ag, immersion Sn Special offer: Castellation, multi-tier, pin insertion, selective plating, press-fit, edge plating…

• Charlotte Ku BoardTek Electronic Corporation TEL: 886-3-4839611 EXT,1411 FAX: 886-3-4839620 E-MAIL: charlotte@mail.boardtek.com.tw

Click on picture for

PDF brochure

http://www.TheECMG.comhttp://www.TheECMG.com24

BoardTek's CapabilityBoardTek's CapabilitySpecification Standard Critical

Layer count 2~22 28~32

Minimum Line/space 4/4 3/4

Minimum innerlayer core thickness 0.004" 0.003"

Minimum finished hole size (Mechanical drilling) 0.008" 0.006"

Minimum finished hole size (Laser drilling) 0.004" 0.003"

Maximum aspect ratio (conventional) 6:1 10:1

Maximum aspect ratio (laser via) 0.5:1 0.7:1

Hole size dimension tolerance +/-0.003" +/-0.002"

Minimum pad size (mechanical drilling) 0.018" 0.016"

Minimum pad size (laser drilling) 0.014" 0.012"

Maximum board thickness 0.250" 0.275"

Minimum board thickness (2L) 0.010" 0.005"

Minimum board thickness (4L) 0.016" 0.012"

Minimum board thickness (6L) 0.022" 0.018"

Minimum board thickness (8L) 0.028" 0.024"

Maximum copper foil thickness (IL) 4 oz 5 oz

Maximum copper foil thickness (OL) 5 oz 8 oz

Impedance control tolerance +/-10% +/-6%

Maximum panel size 18" x 22" 22" x 28"

Contour routing dimension tolerance +/-0.005" +/-0.003"

Depth control routing tolerance +/-0.004" +/-0.002"

http://www.TheECMG.comhttp://www.TheECMG.com25

ECMGECMG Contact Contact InformationInformationName

Title Employee First NameMiddle Initial

Employee Last Name

Nick Name/AKA Company Name Division Title

Mr. Kevin C. Arns KC The ECM Group, LLC. Electronics Division President/Principal

Mr. Paul S. Arns Paul The ECM Group, LLC. Electronics Division Director of Operations

Mr. Oscar   Cabahug Oscar The ECM Group, LLC. Electronics Division Inside Sales/Technical Service

Ms. IVYMAE C. CONCHAS Ivy The ECM Group, LLC. Electronics Division Inside Sales/Customer Service

Mr. Dundee A Espina Cocoy The ECM Group, LLC. Electronics Division Asian Sales Manager

Mr. Timothy   Esposito Tim The ECM Group, LLC. Venture Group VP of Business Development

Ms. Brenda M. Hampton Brenda The ECM Group, LLC. Electronics Division Corporate Controller

Mrs. Susan E. Hledin Sue The ECM Group, LLC. Electronics Division Inside Sales Manger

Mrs. Anne   Keating Anne The ECM Group, LLC. Electronics Division Customer Service

Mr. Christopher   Keating Chris The ECM Group, LLC. Electronics Division European Sales Manager

Mr. Michael   Keating Mike The ECM Group, LLC. Electronics Division European Account Manager

Mr. Arturo H. Lopez Art The ECM Group, LLC. Electronics Division Inside Sales/Customer Service

Mrs. Vanessa E. Martinez Vanessa The ECM Group, LLC. Electronics Division Customer Service

Mr. Robert J. Mills Bob The ECM Group, LLC. The ECM Group, LLC. President/Principal

Mr. Daniel R. Pontis Dan The ECM Group, LLC. Electronics Division Director of Sales - West USA

Mr. Bipin G. Shah Bipin The ECM Group, LLC. Electronics Division Customer Service

http://www.TheECMG.comhttp://www.TheECMG.com26

ECMGECMG Principal Contact Principal Contact InformationInformation

Tat Chun: Dominic Leung Tat Chun Printed Circuit Board Co., Ltd.31/F., Aitken Vanson Centre,No. 61 Hi Yuen Road,Kwun Tong, Kowloon, Hong Kong.Tel: +852 3579 6017Fax: +852 2415 3158Mobile: +852 9228 6593 / +86 136 5238 4229Email: dominicleung@tatchunpcb.com.hk

EllingtonMr David NgGuangdong Ellington Electronics Technology Co. Ltd.88 Gaoping Industrial Zone, Sanjiao town of Zhongshan City,Zhongshan Guangdong province China 528445Tel. +86-760-540-9988Email: david.ng@ellingtonpcb.com

Shennan: Jackie SunSales and Marketing DepartmentShenzhen Shennan Circuits Co., Ltd.The CATIC Shahe Industrial Zone, Shenzhen, 518053, ChinaTel:        86-755-8610 6462  86-755-8609 5314Fax:        86-755-8609 5224Cell Phone: 86-13480616906Website:    www.shennan.com.cnE-mail:     jackie@shennan.com.cn

SFPC: Mrs. Tracy Leung Sales EngineerShenzhen Fast-print Circuit Tech Co., Ltd is TEL: +86-755-26073471FAX:+86-755-26074417 or +86-755-26074446E-mail: ossales2@chinafastprint.com

HD FLEX: Ms Shouyan Xu (Megan)Sales Engineering

HD-FLEX TECHNOLOGY CO., LTD Zhufeng Road, Qian Wu TownDoumen District Zhuhai City, Guangdong Province China

shouyan.xu@hd-flex.com shouyan1111@126.com MSN:shouyan1111@hotmail.com skype:shouyan1111@hotmail.comPhone: 86 756 3933780-227Fax: 86 756 3933778WWW.HD-FLEX.COM 　 Email ： HD-FLEX@HD-FLEX.COM

Sun & Lynn PCBNancy LiSHENZHEN SUN & LYNN CIRCUIT CO., LTDSun & Lynn industrial zone, Jin Xiu Heyi, shajing townBao'an District ,Shenzhen ,Guangdong province, China 518128Tel ： +86-755-27280399Fax ： +86-755-27507268E-mail: nancy@slpcb.netwww.slpcb.com

http://www.TheECMG.comhttp://www.TheECMG.com

ECMGECMG Secondary Secondary OfferingsOfferings

Information on all items below can be sent upon request:Other Items sourced in China

– LCD/LCM – PCBA & Sub-Assembly– Cable Assemblies– Sheet metal & Stamping– Plastic Injection Modeling– CNC machines tooling– Full Box build assembly– Heat Sinks & RFI Shields– AntennasCable Assemblies:– Semi-Rigid RF Cables and Flex RF Cables– Earphones– Medical Cables– Wire Harnesses– Wireless and Mobile Antennas– Fiber OpticalTurnkey Solutions / System Integrations:– Electro-Mechanical Assemblies– Box Build and Sub-Systems– Engineering Services– Surface Mount and Through Hole Capability

27

http://www.TheECMG.comhttp://www.TheECMG.com28

Thank You Thank You Very Very

Much!Much!