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HANDBOOK OF ELECTRONIC MATERIALS Volume 9
HANDBOOK OF ELECTRONIC MATERIALS
Compiled by : ELECTRONIC PROPERTIES INFORMATION CENTER Hughes Aircraft Company Culver City, California
Sponsored by: u.s. DEFENSE SUPPLY AGENCY Defense Electronics Supply Center Dayton, Ohio
Volume 1: OPTICAL MATERIALS PROPERTIES, 1971
Volume 2: III-V SEMICONDUCTING COMPOUNDS, 1971
Volume 3: SILICON NITRIDE FOR MICROELECTRONIC APPLICATIONS, PART I:
PREP ARATION AND PROPERTIES, 1971 Volume 4: NIOBIUM ALLOYS AND COMPOUNDS, 1972
Volume 5: GROUP IV SEMICONDUCTING COMPOUNDS, 1971
Volume 6: SILICON NITRIDE FOR MICROELECTRONIC APPLICATIONS, PART II:
APPLICATIONS AND DEVICES, 1972
Volume 7: III-V TERNARY SEMICONDUCTING COMPOUNDS-DATA TABLES, 1972
Volume 8: LINEAR ELECTROOPTIC MODULATOR MATERIALS
Volume 9: ELECTRONIC PROPERTIES OF COMPOSITE MATERIALS
HANDBOOK OF ELECTRONIC MATERIALS Volume 9
Electronic Properties of Composite Materials
Maurice A. Leeds Electronic Properties lnfornwtion Center
Hughes Aircraft Company, Culver City, California
IFIIPLENUM· NEW YORK-WASHINGTON-LONDON • 1972
This document has been approved for public release and sale; its distribution is unlimited. Sponsored by U.S. Defense Supply Agency, Defense Electronics Supply Center, Dayton, Ohio. Under Contract No. DSA 900-72-C-1182
Library 0/ Congress Catalog Card Number 76-147312 ISBN 978-1-4615-9614-1 ISBN 978-1-4615-9612-7 (eBook) 001 10.1007/978-1-4615-9612-7
©1972 IFI/Plenum Data Corpotation, a Subsidiary of Softcover reprint of the hardcover 1 st edition 1972 Plenum Publishing Corporation 227 West 17th Street, New York, N.Y. 10011
United Kingdom edition published by Plenum Press, London A Division of Plenum Publishing Company, Ltd. Davis House (4th Floor), 8 Scrubs Lane, Harlesden, NW10 6SE, London, England
All Rights Reserved
No part of this publication may be reproduced in any form without written permission from the Publisher
CONTENTS
INTRODUCTION . 1
CERAMIC MATRIX Aluminum Phosphate Reinforced with S-994 Fiberglass . . . . .. 5
FIBERS
GLASS
Boron [Tungsten Core] .......... . Graphite and Carbon . . . . . . . . . . . . Graphite-Polyacrylanitrile [PAN] Precursor Glass . . . . . . . Glass Fabric .... High Silica Content Glass Quartz. . . . Quartz Fabric . . .
7 7 9
10 10 11 13 13
Glass Aluminum. . . . . . . . . . . . . . . . . . . . . . . . . 15
LAMELLATE Glass-Metal
LAMINATES Carbon/Graphite-Epoxy Carbon/Graphite-Polyester Boron-Epoxy . . . . . . . Fiberglass-Amide-Imide .. Fiberglass-Diphenyl Oxide Fiberglass-Acrylic. . . . Fiberglass-Diallyl Isophthalate (DAIP). Fiberglass-Diolefin Fiberglass-Nylon .. Fiberglass-Epoxy .. Fiberglass-Phenplic Fiberglass-Polybenzimidizole (PBI). Fiberglass-Polybenzothiazoles (PBT) Fiberglass Polyester. Fiberglass-Polyimide. Fiberglass-Silicone . Fiberglass-Teflon . . Polyester (Fiber)-Epoxy, Phenolic, Polyester. PRD 49-Epoxy .... PRD 49-Polyimide. Quartz-Epoxy ... Quartz-Phenolic . Quartz-Polybenzimidizol (PBI)
v
19
20 26 26 27 27 27 28 30 32 33 41 42 47 48 55 61 63 66 67 71 72 72 73
CONTENTS (CONT'D)
LAMINATES (Cont'd) Quartz-Polyester Quartz-Polyimide Quartz-Silicone Quartz-Teflon
METALLIC MATRIX Unidirectionally Solidified Eutectics Dispersion-Strengthened Nickel and Aluminum Tungsten Fiber Reinforced Copper Fiberglass Reinforced Aluminum . . . . . . .
MOLDED COMPOSITE Asbestos-Polyester Dacron-Diallyl Phthalate (DAP) Fiberglass-Epoxy . . Fiberglass-Melamine Fiberglass-Nylon . . Fiberglass-Phenolic Fiberglass-Polybutadine Fiberglass-Polyimide . . Fiberglass-Polycarbonate Fiberglass-Polyester Fiberglass-Teflon
MISCELLANEOUS Concrete Pavement Asphalt Pavement
REFERENCES
vi
77 78 80 80
81 81 82 83
85 86 88 89 90 91 92 92 93 94 95
97 98
99
INTRODUCTION
Composites are the fastest growing class of structural material. Consequently, electronic properties are often difficult to find. This report was prepared in order to present a compilation of reliable data on the electronic and electrical properties of composites.
Composites provide an opportunity to tailor the properties to the application; a factor that allows designers an unlimited variety of new materials for new uses. It is this feature that has contributed to the rapid growth of composites.
The electrical properties of a composite can be of vital importance in the use or application of the material in a system. The designer therefore, must be able to obtain the necessary electrical or electronic property data to guide him in the materials selection. It is the purpose of this report to assist the designer and engineer in fulfilling that requirement.
Properties This report provides a compilation of the most commonly required electronic properties data of structural composites. Thermal properties often influence electrical design; consequently several of these properties are included. The specific properties tabulated are:
Arc Resistance Arc Tracking Resistance Dielectric Constant Dissipation Factor Electrical (Volume) Resistivity Electrical (Volume) Conductivity
Thermal Conductivity Linear Thermal Expansion
Coefficient
Other electrical and thermal properties are compiled as the data was made available.
Materials The first requirement of a material for inclusion was compliance with the definition adopted for composites. Structural composites are defined as:
A homogeneous combination of two or more materials, resulting in structural properties of the composite superior to those of either constituent. Each phase shall be identifiable on a microscopic or greater scale.
Further classification was accomplished by the list of general types included and specifically excluded as follows:
Included Fiber/Polymer Matrix Fiber/Metal Matrix Fiber/Ceramic Matrix Lamellates Aligned Eutectics Dispersion Strengthened Alloys Mixtures (high impact strength)
Excluded Metal Alloys Non-structural composites Solid State Electronic Devices Electrical Contact Materials
A few other classes were included though not listed above because no electrical data were available, i.e. Whisker/Matrix and Flake/Polymer Matrix.
When selecting a material for this report, a major consideration was that it be primarily useful as a structural component and that electrical properties be secondary. For example, concrete or asphalt for a highway is a structural material. However, the electronic properties become important when high frequency electronic detectors are embedded in order to monitor and control traffic. Boron and graphite fiber/polymer matrix composites are excellent structural materials, used in many applications including aircraft. In this regard, electrical properties become very important with the possibility of lightning strikes. Tungsten wire reinforced copper was developed as a high strength material suitable for structural applications (Reference 47). However, the excellent conductivity of this composite makes it a suitable contender for power transmission.
Occasionally, composite materials with a borderline compliance to the above criteria are included. This resulted when unusual or unique materials were uncovered during the search and the electronic properties were available. On the other hand, in a class of composites having a large population of similar materials, a few representative examples were selected from more than one readily available source.
In addition to the data itself, other information is provided. With most citations a brief statement clarifying important parameters is given. Additional material descriptions seemed superfluous because it was assumed the engineer is familiar with the material he is considering. Standard test methods stated in the reference are included in the compilation because the author believes the value of the data is greatly enhanced when the test method is given. Nonstandard test methods described in the reference are noted in tables by an "R" or foot note. Where a "U" appears in the table, or no reference to test methods is given, the reader may assume that they are not known.
Data Sources A variety of literature provided the data for this compilation. Included were reports from conferences, journals and periodicals, books, government research reports and sales literature from materials manufacturers.
2
ASSESSMENT OF DATA
The prec~s~on and accuracy* of the data in this report must be carefully weighed by designers and engineers when determining the degree of applicability to specific projects. Several factors that should be considered are discussed below.
Composites are multiphase materials with two or more constituents. Therefore, within a given class with more than one available source for the constituents, the composite properties depend upon the constituents used. In addition, it is highly probable that the composite's properties will vary from lot to lot of the constituents.
The process by which a composite is manufactured has many factors, such as time, temperature, pressure, etc., each of which could influence the properties. A feature of many composites is the ability to fabricate the final shape with few or no intermediate operations. The tooling used for this shaping could influence the properties. Very often property data is determined on specimens of standard shapes formed in special tools. The same material formed into a different shape may have different values for the same property. This phenomenon is characteristic of many composites because of the high incidence of anisotropy.
Measurement accuracy is.dependent upon the test method, especially when determining electrical properties. Accuracy is also influenced by the care in application of the method and the equipment used.
Property data is also affected by other variables such as Thermal and environmental history Properties of constituents Distribution of constituents Presence of foreign matter including voids
Finally, reported values are influenced by material sampling techniques and statistical analysis methods.
This report should be useful to the designer and engineer as a guide to the electrical properties of composites. For design data, however, closer contact to the references and other sources is advisable.
Many new composites are finding expanded use, yet electrical property data is scarce. The references in this report identify the sources of recent and current activity for a rapidly expanding and changing information field.
* Precision and accuracy, as used here, are defined in ASTM E177.
3
CERAMIC MATRIX
ALUMINUM PHOSPHATE REINFORCED WITH 5-994 FIBERGLASS
Thickness
030 inch
Fiberglass coated with Dow Corning
DL-805 silicone resin
Dielectric Constant
3.44
5
Ref. 7
Loss Tangent
0.0062
BORON [Tungsten Core] Ref. 8
United Aircraft Tungsten Core Filament (.0005" Diameter)
Mean value of resistance (9 measurements) 44.6 ohms.
Length of sample between edges of mercury pool 0.5259".
Diameter as measured (3 measurements) 0.00393".
The effective resistivity (assuming homogeneous filament)
2600]1~cm.
Effect of Current on Above Resistivity
Current in Fiber (m. amp) Resistance of Fiber (ohms)
1. 73 44.2
2.60 42.7
6.00 47.5
10.00 44.4
GRAPHITE AND CARBON Ref. 54
HMG-50 HMS
YARN TOW
DENSITY gm/ cm 3 1.68 1.84
RESISTIVITY ohm-em 1.35 x 10- 3 0.83 x 10- 3
SPECIFIC HEAT cal/gm;oC 0.3 0.3
7
GRAPHITE AND CARBON Ref. 44
Unit KCF-IOO KGF-200
Carbon content % 99.5 99.8
Electric resistance ohm-em 7.5 x 10- 3 3.0 x 10- 3
Thermal conductivity* Kcal/m hroC 15.4 30-40
Coefficient of thermal expansion 1O-6;oC 1.7 1.5
* Calculated by Lorentz Number. By Lorentz, thermal conductivity is a function of the absolute temperature and the electrical conductivity.
GRAPHITE AND CARBON Ref. 5
o 20 40 60 80 Fiber Modulus, psi x lO-6
8
GRAPHITE - POLYACRYLANITRILE (PAN) PRECURSOR
• 1-22
I
\
I-IS e-
'" 81-14 '" ~ '" r:f 1-10
1-06
\ \ \ \ . \
\
1000 2000 HTT <."el
Ref. 56
3000
Variation of the resistivity ratio with HTT of specimen.
HTT - Heat treat temperature during graphitization .
• •
1000 3000
Variation of longitudinal resistivity for carbon fibers.
9
GLASS Ref. 30
Dissipation factor Surface Dielectric constant tan 0 resistivity
Material (Hz) (Hz) (ohm/em)
"E" glass 6.43 at 102 0.0042 at 10~ 10 15* fibers 6.11 at 10 10 0.006 at 10 10
"A" glass 6.8 at 5 x 105 0.007 at 5 x 105 10 12
fibers
* Estimate (figure for "E" glass not known).
GLASS FABRIC Ref. 55
Frequency 1000 Hz
TOC Dielectric Dissipation Constant Factor
25 6.3 0.0037
10
HIGH SILICA CONTENT GLASS
Composition is 99.3% silica
Refrasil, Batt, Felt and Cloth
2.or--------r--------~------~--------.--------.
:!:I~ 1.5 , :I: ::>' tiiE:
b ':;: ~ :::J
§ 1.0~-------+--------+_~~~£+--~~--;_------~ u c;; E '" .c: I-
'" >
] O.5~-------+~.-=---+--------;---------r------~ i:i:i
O~------4~OO------~8~070----~1~20~O~--~1~6700~--~2~OOO
MEAN TEMPERATURE - of
Sleeving and Cloth Breakdown Voltage
B-)1 --...:=========== C·100-48
Cloth C·100·28 C·100·48
500
0~--~~--~~--~~--~~--~2~500
-==========r;;i/C-100.28 N-Ya
-------.-.:.. B-24
Sleeving Series B·)1 Series N·Ya Series B·24
TEMPERATURE - of
11
Thickness .015 :027
Thickness .050 ,013 .007
Ref. 39
HIGH SILICA CONTENT GLASS (CONT'D) Ref. 39
All Forms
~ VO~lume DIelectric Temp. Resistivity Constant Power Factor Frequency
80°F. 5 X lOB .001- .004- 60 cycle - 1 MC 1 X 1014* 1.3 - 2.3*
500°F. 5 X 1012 1.5 .002 60 cycle - 1 MC 900°F. 5 X 109 1.5 .001 1 KMC
'Depending on moisture content. The dielectric constant of pure non-porous silica is about 3.8.
12
QUARTZ
QUARTZ FABRIC
Freq., 8.52 GHz
TOC K' tan 0
25* 3.02 .0054
25 2.98 ;0019
98 2.97 .0018
198 2.96 .0016
307 2.95 .0015
418 2.95 .0014
497 2.945 .0014
591 2.95 .0016
729 2.96 .0022
828 2.975 .0029
905 2.99 .0035
995 3.01 .0042
* As received, other values after vacuum bake for 24 hours at 125°C.
Frequency 1000 Hz
TOC Dielectric Dissipation Constant Factor
25 3.7 0.0001
13
Ref. 61
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GLASS-METAL Ref. 63
Glassed Steel
Crys talli zed Amorphous Glass Glass Layer Layer
Thermal conductivity
Ceramic component only. Btu-in/hr f t 2 0p 8 6
Composite, 0.05 in. ceramic plus 11/16 in. steel, k/l 123 98
Typical chemical service. (liquid product, steam jacketed vessel), overall "U" 87 74
Dielectric strength
Volts per mil, room temp .• 60 cycle 735 700
Dielectric constant f = 106 cps 8.24 8.02
19
LAMINATES
CARBON/GRAPHITE-EPOXY
Unidirectional Piber Orientation
Electrical resistivity (microhm-in.)
Longitudinal
Transverse
Coefficient of thermal expansion (10- 6 in./in./op)
Longitudinal
Transverse
Thermal conductivity (Btu./hr./ft. 2 /op/ft.)
Longitudinal
Transverse
Specific heat (Btu./lb./op)
* Tested at room temperature.
20
Graphite* Epoxy
1.18 x 10 3
2.76 x 106
-0.2
16
28
0.8
0.21
Ref. 43
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tI::l 0 Z
........
C'"l ~
"0
::r:
H ~
tTl
I tTl
"0
0 ><
><
,-..
n 0 Z
~ - 0 '-"
::0
(J)
i-t)
~
I-'
SOV/
o C
AR
BO
N
FIB
RE
IEP
OX
Y A
T 1
00
·C.
• (J
=
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GLE
B
ET
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EN
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A
ND
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E
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INA
L A
XIS
.
- • u • t 4
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-I
t-~
• Z
t-
)
bJ
"'" u
30
I&.
t&.
bJ
0 u z 2
0t-
../'
•
0 (/)
Z
4 n.
x W -10L·------------------------------------------------------------------~
PLO
T O
F T
HE
RM
AL
EX
PA
NS
ION
C
OE
FF
ICIE
NT
V
ER
SU
S S
ln2(
J FO
R
TY
PE
II
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OM
PO
SIT
ES
.
Tes
t m
etho
ds
in r
efer
ence
.
('")
S; ~ C) ~ ::r:
1-1 ~
ttl
I ttl '" ~ 0-<
r--
('")
~ t:1
'-' " (1
) I-h .r::.
......
CARBON/GRAPHITE-POLYESTER Ref. 19
Unidirectional Fiber Orientation
Modmor Type I Composite Resistivitr 775 (25"'C) 660 (180"'C) ohm-cm 10-
Thermal Conductivity .04 (25°C)
BORON-EPOXY
Unidirectional Fiber Orientation
Electrical resistivity (microhm-in.)
Longitudinal
Transverse
Coefficient of thermal expansion (10- 6 in./in./oF)
Longi tudina1
Transverse
Thermal conductivity (Btu./hr./ft. 2/oF/ft.)
Longitudinal
Transverse
Specific heat (Btu.1b./oF
* Tested at room temperature. Test methods unknown.
26
BoronEpoxy *
3.94 x 10 3
3.94 x 1012
2.5
7.9
1.1
0.6
0.28
Ref. 43
70
SOV/
o C
AR
BO
N
FlB
RE
I E
PO
XY
A
T 10
00C
.
8 •
AN
GLE
B
ETW
EEN
D
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TIO
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ND
TH
E
LON
GIT
UD
INA
L A
XIS
.
<.0 • 0 - ~ 4
0
z !!l
u IlL
t-.)
IlL
ti
l
"'"
30
0 u z 0 Cii
2
0
z 4 n.
>< "'"
10
-1~~----------------------------------------------------------------------
PLO
T O
F T
HE
RM
AL
E
.l(P
AN
SIO
N
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NT
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R
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OM
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.
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etho
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ref
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ce.
~
::0 ~ ....
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C) ~ ::c:
I-f
~
tTl
I tTl
"0
o ><
>-<
,.-.. n ~ o '-'
::0
CD
H,
.j:::.
. I-
'
FIBERGLASS-AMIDE-IMIDE Ref. 55
Test Dielectric Dissipation Resin Temperature, Constant, Factor, Loss
of K' tan <5 Index
* Amide-imide 75 4.29 0.018 0.0772 300 4.37 0.016 0.0699 400 4.31 0.016 0.0690 500 4.53 0.038 0.1721
FIBERGLASS-DIPHENYL OXIDE Ref. 55
Test Dielectric Dissipation Resin Temperature, Constant, Factor Loss
of K' tan <5 Index
Dipheny1-oxide* 75 4.83 0.024 0.1159 300 4.98 0.023 0.1145 400 5.06 0.027 0.1366 500 5.20 0.027 0.1404
FIBERGLASS-ACRYLIC Ref. 55
Test Dielectric Dissipation Resin Temperature, Constant, Factor Loss
of K' tan <5 Index
* Acrylic 75 3.88 0.027 0.1048 300 4.63 0.013 0.0602 400 4.63 0.047 0.2176
* E glass style 181 fabric. Resin content approximately 35 percent. Test frequency 9.35 GHz.
27
Fl'BERGLASS-DIALLYL ISOPHTHALATE (DAIP) Ref. 55
Test Dielectric Dissipation Temperature Constant, Factor, Loss
Resin of K' tan <5 Factor
DAIP 75 4.16 0.010 0.0416 300 4.21 0.0-14 0.0589 400 4.24 0.017 0.0721 500 4.29 0.029 0.1244
E glass style 181 fabric. Resin content approximately 35 percent. Test frequency 9.35 GHz.
5.0
w ~ 4.5 -c: 8 .!:! ~ 4.0 0;
C
----------~~ 0--
o Diallyl Isophthalate
100 200 300 500 Temperature, OF
Dielectric constant at 9.35 GHz of sty1e-120 glass-fabric laminates as function of temperature (40 percent resin content).
28
FIBERGLASS-DIALLYL ISOPHTHALATE (DAIP) (CONT'D)
0.04 o Oiallyl Isophthalate
0.01
100 200 300 400 500 Temperature. of
Dissipation factor at 9.35 GHz of .style-l20 glass-fabric laminates as function of temperature (40 percent resin content),
0.14.----,-----r-----,---.-----,r---,
0.12 0 Oiallyl Isophthalate
.0 c: ~ X
-",
0.10
..: 0.08 .s ~ ~
30.06
004·
100 200 300 Temperature. of
400 500
Loss factor at 9.35 GHz of style-l20 glass-fabric laminates as function of temperature (40 percent resin content) ,
29
Ref. 55
FIBERGLASS-DIALLYL ISOPHTHALATE (DAIP) (CONT'D) Ref. 60
Poly-Preg Poly-Preg Dielectric Constant P 680* P 681**
9.3 GHz 3.9 106 Hz 4.1 10 3 Hz 4.4
Dissipation Tangent
9.3 GHz 0.016 0.014 106 Hz 0.013 10 3 Hz
* Fiberglass style 181 fabric with I 550 finish ** Fiberglass style 1581 fabric with volan finish
FIBERGLASS-DIOLEFIN Ref. 55
Test Dielectric Dissipation Temperature Constant, Factor, Loss
Resin of K' tan 0 Factor
Diolefin 75 3.41 0.0120 0.0409 300 4.08 0.0104 0.0424 400 4.20 0.0086 0.0361 500 4.63 0.0068 0.0315
E glass style 181 fabric. Resin content approximately 35 percent. Test frequency 9.35 GHz.
30
FIBERGLASS-DIOLEFIN (CONT'D)
.0 c:
5.0
-w
~ 4.5
t::
8 '-'
~ 4.0-Ol o
100 200 300 500 Temperature, OF
Dielectric constant at 9.35 GHz of style-l20 glass-fabric laminates as function of temperature (40 percent resin content).
0.04
(; DioJefin
~ 0.03
c: ,g 0.02 ~ .~
'"
100 200 300 400 500 Temperature, of
Dissipation factor at 9.35 GHz of style-l20 glass-fabric laminates as function of temperature (40 percent resin content).
31
Ref. 55
FIBERGLASS-DIOLEFIN (CONT'D)
FIBERGLASS-NYLON
*
<0
§ x
-w
o 14,---,--,----,---,-----,-_---,
0.12
I> Diolefin
0.10
~. 0.08
~ ~
.§ 0.06
0.04
100 200 300 400 500 Temperature. OF
Loss factor at 9.35 GHz of style-120 glass-fabric laminates as function of temperature (40 percent resin content).
Effect of Silanes on Electrical Properties of Glass** Reinforced Resins at 1000 CPS
Ref. 55
Ref. 48
Finish on Fiberglass Dielectric Constant Dissipation Factor
16 Hrs 16 Hrs Dry 100% RH/120°F Dry 100% RH/120oC
None 4.5 8.3 0.035 5.2
Silane Y-5l08 4.2 4.2 0.035 0.53
Silane Y-4087 4.7 5.2 0.037 0.50
* All silanes used at 0.5 wt percent loading, based on glass ** 181 glass fabric reinforced resin, Glass content 40-45 % wet, %.
32-
w
w
Tes
t P
rop
erty
M
etho
d
Die
lectr
ic
Con
stan
t 9.
37 G
Hz
MIL
-R-9
300
Dry
Die
lect
ric
Con
stan
t 9.
37 G
Hz"
M
IL-R
-930
0 W
et
Die
lectr
ic
Con
stan
t U
10
6 Hz
Die
lectr
ic
Co
nst
ant
U
103
Hz
Dis
sip
atio
n
Fac
tor
9.37
Hz
MIL
-R-9
300
Dry
Dis
sip
atio
n
Fac
tor
9.37
Hz
MIL
-R-9
300
Wet
Dis
sip
atio
n
Fac
tor
U
106
Hz
Dis
sip
atio
n
Fac
tor
U
103
Hz
* Fl
ame
resi
stan
t
Pol
y-P
reg
F155
F
16l
E-7
05
(28)
(2
8)
(60)
4.55
4
.4
4.4
4.7
6
4.82
0.01
0 .0
11
.012
0.01
6
0.00
7
* P
oly-
Pre
g P
oly-
Pre
g P
oly-
Pre
g E
-741
D
E-7
77
E-7
80
F-1
53
'Tl
H
(60)
(6
0)
(60)
(2
8)
gJ
:;0 CJ s;: (f.l
(f
.l
I ttl
4.68
4
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4.6
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)
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I-f)
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OQ
H
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) V
l V
l s:: Vl
4.86
(I
) p..
1-'-
Vl
Vl
5.15
rt
'<
H
(I)
H 00
.....
0.
018
0.02
2 0.
167
I-f)
~
Ii
1-'- n
0.01
2 I I
0.00
5 "-
FIBERGLASS-EPOXY (CONTID) Ref. 55
Test Dielectric Dissipation Temperature, Constant, Factor Loss
Resin of K I tan 0 Index
Epoxy 1 75 4.06 0.015 0.0609 300 4.30 0.033 0.1419 400 4.39 0.037 0.1624 500 4.44 0.042 0.1865
Epoxy 2 75 4.78 0.015 0.0717 300 4.61 0.018 0.0830 400 5.28 0.021 0.1109 500 5.43 0.025 0.1358
Epoxy 75 4.65 0.019 0.0884 novo1ac 1 300 4.61 0.023 0.1060
400 4.99 0.050 0.2495 500
Epoxy 75 4.68 0.013 0.0608 novo lac 2 300 4.97 0.022 0.1093
400 5.31 0.061 0.3239 500
Epoxy 75 4.59 0.025 0.1148 acrylate 300 5.16 0.042 0.2167
400 500
E glass style, 181 fabric. Resin content approximately 35 percent. Test frequency 9.35 GHz.
34
FIBERGLASS-EPOXY (CONT'D)
S-Glass Fabric
Electrical resistivity (microhm-in.)
Longitudinal
Transverse
Coefficient of thermal expansion (10- 6 in.jin.jOF)
Longitudinal
Transverse
Thermal conductivity (Btu-in. jhr ft 2 °F
Longitudinal
Transverse
Specific heat (Btu.jlb.jOF)
Data collected at room temperature.
.'
O,O~ ~ i§ ""f!;L1= ~'E: 14 ". "'"" ~,_ E. : ''':':; "'~. '''"i
" ,,:,::" , .. :LP
0 ,0) F-~4..'-i. I-"-H. f--+' :l'--l' 4-1-""-1-' -l-',.-+~,.J....j.=~~J- TOe
~FF-.- . 1- - 1"
, " i;.
3.94 x 10 19
3.94 x 10 19
3.5
11.4
Elap.ed tlm~(mtn.)
o 11 )0 ~ 6l SO 81 99
II ) 1 )0
0.17
0.12
0.24
Fiberglass laminate with 181 glass cloth tested at 8.52 GHz.
35
Ref. 43
Ref. 61
w
0-
6.0
5.5
~
'5.0
z ~
en z
4.5
0 u u 0:
: 4
.0
~
U
W
...J
3.5
w
0
3.0
--~~~~~~r-r-r-r-~~
o
E P
ON
8
28
/ S G
LAS
S @
10
6 C
PS
100
20
0
30
0
40
0
50
0
60
0
70
0
80
0
90
0
1000
11
00
1200
TEM
PE
RA
TUR
E f'
J o
f
Eff
ect
of
Tem
pera
ture
on
Die
lectr
ic C
on
stan
t o
f E
po
n 8
28
Co
mp
osi
te
C/l I G) .....
III
til
til C/l
C"+
'< .....
(I) .....
0
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Ii
1-" n ~
C/l
'TJ
1-"
::I
1-"
til ::r
'TJ ~
to
tTl ~
~
C/l
C/l I tTl ~
0 >< ~
,.-.
. (j
~
0-3
0 '-'
;:0
(I) I-h
VI
Co)
.....
.0301r---~--~--~--~--~----~--~--~--~--~----~~
.... Z
.02
7
.02
4
.021
LLJ
018
c).
z c::{ ~
.015
(J
) (J
) 9 .0
12
.00
9
.00
6
.00
3 o
" E
PO
N 8
28
/S
GLA
SS
@
106
C
PS
100
20
0
30
0
40
0
50
0
60
0
70
0
80
0
90
0
1000
12
00
14
00
TEM
PE
RA
TUR
E t
'V of
Eff
ect
of
Tem
pera
ture
on
Lo
ss T
an
gen
t o
f E
PO
N 8
28
Co
mp
osi
te
'Tl
H tx:l
ttl
:::0
G")
~
en
en
I ttl
"tJ ~
0-<
,......
n ~ o o....
J
:::0
<D
I-h
(N
FIBERGLASS-EPOXY (CONT'D)
9
~ 8 <{ I-UJ Z o U
U 7 Q: I-
U W ...J w 0 6
Cycles
4~ ________ ~~ ________ ~~ ________ ~~ ______ ~~
40 80 120 160 200 TEMPERATURE(OC)
Dielectric constant vs. temperature of composite at various frequencies. Glass, "E" glass, 181 cloth; resin, epoxide, Epikote 828jBF 3-400, 2 p.h.r.; keying agent, Volan A.
38
Ref. 30
FIBERGLASS-EPOXY (CONT'D)
10
0.6
0.2
Z <f 0.1 f-
lLJ --' (') 0.06 z <f
V> V> o ..J
0.02
0.01
0.006
Loss angle, tan 0 vs. temperature of composites at various frequencies. Glass, "E" glass cloth; resin, epoxide, Epikote 828/BF3-400, 3 p.h.r.; keying agent, Volan A.
39
Ref. 30
FIBERGLASS-EPOXY (CONTID)
E1012 .£;
o w u z « 0-V!
V! W a:
Curing agent: BF3-400. 1 p.h.r. Curing agent: BF3 -400. 2p.h.r.
108~------~1~0~O----------------~2~0~0~--------------~30C TEMPERA TURE(O F)
Insulation resistance vs. temperature of glass cloth-epoxide laminate. Glass, "E" glass, 12 ply, 181 weave; keying agent, Volan A; resin, Epikote 1310.
40
Ref. 30
FIBERGLASS-PHENOLIC Ref. 55
Test Dielectric Dissipation Temperature Constant Factor Loss
Resin of K' tan 0 Index
Phenolic 75 4.26 0.022 0.0937 300 4.59 0.039 0.1790 400 4.67 0.042 0.1961 500 5.13 0.096 0.4925
"E" glass style 181 fabric with approximately 35 percent resin content. Properties measured at 9.35 GHz.
Type F120 style 181 fabric
D1electr1c Constant, Dry Dielectric Constant, Wet Dissipation Factor, Dry Dissipation Factor, Wet
Volume Resistivity, Dry (ohm-cms) Volume Resistivity, Wet (ohm-ems) Surface Resistivity, Dry (ohms) Surface Resistivity, Wet (ohms)
41
1 Megacycle 5.92 5.92 0.021 0.024
Ref. 28
3000 Megacycles 4.23 ---0.083 ---
2.05 x 10 13
5.55 x 1012
4.60 x 1013
5.55 x 10 12
FIBERGLASS-POLYBENZIMIDIZOLE (PBI) Ref. 55
Test Dielectric Dissipation Temperature Constant Factor Loss
Resin of K' tan 0 Index
Polybenzi 75 4.02 0.0120 0.0482 midazole 300 3 . 94 0.0080 0.0315
400 4.08 0.0096 0.0392 500 4.20 0.0087 0.0365
E glass style 181 fabric. Resin content approximately 19 percent. Test frequency 9.35 GHz.
. . . . . !: l; : ~ . .
K ' ~i'i· +:t·· GP··· .~~~ttt:dl-tttmM 4.8H-l-+,;'·F·'4:: 't.-'··H·· '~" I--.. +-:-I!-" :+.:-. F. ... +.;:.,. .. ('-+++--1~F+==t-.j. . ..J,,"",l:-+ __ --I-+-I~--1
~··4· -+. ,+' ..... "1-":+.-'. 1-.'+;-.' F' ...j-/i,,' "$ .. =-+-. ++';i l-' +-1-+-+-+-1-:+4 1-=+= -~::jo...,J..-t-: ... .... r--.. i-
.020 ·:'; ! ;i;~ I ':;.;~ i~ iI :: Ii ~" 'i: I"· ~::bH i::' I :::· I :: I:: : H :I"· ,. ~"u : ,,; :: ,: I:: I:: I;· , .. : I,:;· w... H
i' I;'!, I·i';': I;';,,:,; !1-' V
- -Hi :iii· 1'" ' . !':; :g:: ji Y-
.. . ;/ ": i:' .:i'L
Temperature (Oe)
Resin content approximately 24 percent. Laminate density 1.949 g/cm3 .
42
Ref. 61
FIBERGLASS-POLYBENZIMIDIZOLE (PBI) (CONTID) Ref. 3
S glass style 181 with HTS finish E glass style 181 with A-lIDO finish
3Jr---------.----------r---------.r---------~--~
~ 3.6 z ~ C/) 3.5 z o (,)
(,) -0::: ~ (,) UJ .....J UJ o
3.4
3.3
3.2
3.0~--------~----------~--------~----------~--~ 50 100 150 200
TIME AT 600°F "'-J HOURS Effect of 600 0 F Aging in Air on Dielectric Constant of PBI at 9. 375 KMc
43
.... Z
IJJ
(!)
Z ~
(/)
~
~
(/) 9
.03
0 I
.027~
--1
.02
4 t-
~
.021
.018
.015
A
F -
R-I
OO
/E G
LAS
S
@
8.5
KM
c
.012
I JJ
.00
9
.00
6
.00
3 o
100
20
0
30
0
40
0
50
0
60
0
70
0
80
0
90
0
1000
120
0 14
00
TEM
PE
RA
TUR
E r
v o
f
Eff
ect
of
Tem
pera
ture
on
Lo
ss T
an
gen
t o
f A
F-R
-IO
O P
BI
Co
mp
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te
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o:
:l t'T
1 &S s;: (I
J
CIl I "0
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I-<
3
: I-
<
0 I-<
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0 t'"
"' tT
l
r-.
"0
ttl
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~
,.....,
n ~
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:::0
('I)
I-t)
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t;
6.0.r----T---~----~----~--~----~----r_--~----~--~~--_r----~~
5.5
.-5.
0 ·z
~
o 0
0 0
O-Q
o-
r--_
A
F-R
-IO
O/E
GL
AS
S@
8.5
KM
c -0
-.-
----0
en
z
4.5
0 u u ~
4.0
I- U
U
J ...
J U
J 0
3.5
3.0 o
100
20
0
30
0
40
0
50
0
60
0
70
0
80
0
90
0
1000
11
00
1200
TEM
PE
RA
TUR
E ~ o
f
Eff
ect
of
Tem
pera
ture
on
Die
lectr
ic C
on
stan
t o
f A
F-R
-IO
O P
BI
'Tj
H ~ ~ ~ C
Il I '" o t""
0<
~
Z
N
H 3::
H t:1
H
N o t""
tTl
,....., '" '" H
'>..
J
,.....,
(") ~
>-i
t:1
'>..
J
::0
(l)
Jot, . (".I
FIBERGLASS-POLYBENZIMIDIZOLE (PBI) (CONTID) Ref. 3
.0122 .-----,------.--------,.-------r-----, o o
.0114 ~----Jo...I...----------------
PBI/S-994 .0106 0
.0098
.0090
.0082
I- .0074 z ILl (!) .0066 z ~ en .0058 en 0 ...J
.0050 0
.0042 0
.0034
.0026 0
.0018 0 PBI AF-R-IOO
.0010
.0002 0 50 100 150 200
TIME AT 600°F,-o,J HOURS
Effect of 600 0 F Aging in Air on Loss Tangent of PBI at 9. 375 KMc
46
~ Z IJJ t!)
Z
~ (/) (/)
0 ..J
~ Z <4 I"-m Z 0 u (.)
:l: ~ u lLJ ..J i.LJ 0
FIBERGLASS-POLYBENZOTHIAZOLES (PBT) Ref. 3
E glass style 181 with A-llOO finish
.016 I I I I I
TEST FREQ. - 9.375 K Me .014 I-
.012 I-
.010 !-
.008 '-
006 ! I I I I . 0 100 200 300 400 500
5.0
4.9
4.8
4.7
4.6
4.50 100 200 300 400 500
TEMPERATURE,...., of
Effect of Temperature on Dielectric Properties of Polybenzothiazole Laminates
47
-
-~~
-
-
600
600
FIBERGLASS POLYESTER
Composition is mineral filled polyester resin reinforced
with random fiberglass mat.
Glastic UTS
Glastic Flame Test TSF Retard
Property Method Units (25)'" (25) *
Dielectric Strength, ST ASTM V/mil 400 350 Condition A D 229
Dielectric Strength, ST ASTM V/mil 250 250 After 200 hrs at 200°C D 229
Parallel Dielectric ASTM kV Strength, SS D 229 Condition A 40 40 D48/50 15 15
Power Factor ASTM % 60 cycles D 150 3.0 2.5
Dielectric Constant ASTM 60 cycles D 150
Arc Resistance ASTM seconds 120 120 Condition A D 495
Arc Tracking ASTM minutes 120 25 Resistance D 2302
Thermal ASTM ~tu/hr/ft2/i l;oF Conducti vi ty C 177 - -
Thermal Expansion ASTM in/inoC Coefficient D 690 - -
*Numbers in parenthesis refer to items listed in the References.
48
Glastic Rod
Stock (24) *
150
150 (150°C)
10 -
5.0
5.0
120
-
2.0
2 x 10- 5
FIBERGLASS-POLYESTER (CONT'D) Ref. 55
Test Dielectric Dissipation Resin Temperature Constant Factor Loss
of K' tan 0 Index
Polyester 1 75 4.15 0.012 0.0498 300 4.23 0.021 0.0888 400 4.36 0.025 0.1090 500 4.40 0.036 0.1584
Polyester 2 75 4.68 0.011 0.0515 300 4.73 0.025 0.1183 400 4.70 0.035 0.1645 500 5.01
TAC polyester 75 4.35 0.015 0.0653 300 4.37 0.017 0.0743 400 4.41 0.016 0.0706 500 4.46 0.018 0.0803
"E" glass style 181 fabric with approximately 35 percent resin content. Properties measured at 9.35 GHz.
O. 14.----,----,,-------,----,---,---~
"" § x
-w
0.12 .
0.10
..: 0.08
~ 3 006
004
o Tae Polyester
100 200 300 400 500 Tem~erature. OF
Loss factor at 9.35 GHz of sty1e~120 glass-fabric laminates as function of temperature (40 percent resin content).
49
FIBERGLASS-POLYESTER (CONT'D)
5.0
-",
~ 4.5 -c: o u u
___ --n-~~----~&---~-0------
~ 4.0-0;
C
100 200
DTac Polyester
300 500 Temperature, OF
I ,
Dielectric constant at 9.35 GHz of style-120 glass-fabric laminates as function of temperature (40 percent resin content).
00 c
0.04 D Tae Polyester
~. 0.03
i 0.02 .~ -----------~~---~ 0-6
0.01
100 200 300 400 500 Temperature, OF
Dissipation factor at 9.35 GHz of style-120 glass-fabric laminates as function of temperature (40 percent resin content).
50
Ref. 55
FIBERGLASS-POLYESTER (CONT'D)
The fiberglass used is style 181 fabric.
Poly-Preg Poly-Preg Test F14l F149 P 603 646
Property Method (28) (28) (60) (60)
Dielectric Constant 9.36 GHz MIL-R-7575
Dry 3.99 4.25 - 4.31 Wet - 4.33 - -
Dielectric Constant FSTM 106 Hz 406
Dry 2.4 4.27 Wet 2.5 -
Dielectric Constant FSTM 103 Hz 406 - - 4.48
Dissipation Factor 9.36 GHz MIL-R-7575
Dry 0.0106 o .Oll - 0.016 Wet - 0.015 - -
Dissipation Factor FSTM 106 Hz 406
Dry 0.0096 - 0.012 Wet 0.0120 -
Dissipation Factor FSTM 103 Hz 406 - - 0.008
51
FIBERGLASS-POLYESTER (CONT'D) Ref. 48
Effect of temperature on electrical properties of
diallylisophthalate (DAIP) modified polyester resin (1)
and laminate (3). At 8,500 - 10,000 megacycles (2).
Temperature °c Dielectric Constant Loss Tangent
20 4.49 .014 37 4.60 .015 87 4.69 .018
137 4.74 .018 187 4.70 .018 237 4.72 .018 260 4.75 .020
20 4.47 .Oll
(1) - California Chemical Company, Chevron 6100 - 85 pbw/DAIP - 15 pbw.
(2) - Tested according to MIL-R-25042A
(3) - Laminate from pretreated 181-150 Garan finish cloth, 12 ply, 1/8 inch laminate, 70% glass.
52
FIBERGLASS-POLYESTER (CONT'D) Ref. 30
~ I-
:1 l?f:g;; '" z I- <{ U I-W VJ -' Z W 0 -0 u
o.
o.
0.0
0.0
0.0
2
1
7
5
3
." 0.02 z <{
~ 0.0 1_
0.007
0.005 ~
0.003
- f-- 7 ---.?::--
/ / V V
I / 1
/ / / / / /
/ / V /
V 1
~ / / ~...c::. 1
1
-80 -40 o 40 80 120 160
TEMPERATURE(OC)
Dielectric constant and loss angle vs. temperature at various frequencies. Glass chopped-strand-mat-polyester laminate.
Filled Glass Mat Laminates
Ref. 16
Aged As Molded (2.5 min at 240°F) (0.5% USP-245)
Post Cured (16 hrs at 135°C) ( 2 hrs at 180°C) ( 2 hrs at 200°C)
(10 days at 220°C)
Electrical Properties * Arc Resistance, sec ..... Dielectric Strength
Perpendicular, S.T., volts/mil. Perpendicular, S.S., volts/mil. Parallel, S.T., kv.. . ........ . Parallel, S.S., kv ....
Dielectric Strength, wet. Perpendicular, S.T., volts/mil Perpendicular, S.S., volts/mil.. Parallel, S.T., kv. . .. Parallel, S.S., kv. . ... .
Power Factor, 100 cycles, 'Yo . .... . ])i('lcctrie Constant ....... . Volume I{esistivity, ohm-em. Surface Resistivity, ohm ........ . Insulation Resistance, ohm .... . Track Resist., inclined plane, min.
170-180
470-480 450-460
65-70 60-65
1.0-1.2 4.1-4.3
lAS X 10'· > 1.0 X 10" > 1.0 X 10"
650-700
* 33% Koplae V7000-15, 33% glass, 34% ASP-400.
53
175-185
485-495 460-470
60-65 55-60
0.85-1.05 4.1-4.3
lAO X 10'0 > 1.0 X 10" > 1.0 X 10':1
750-850
185-195
495-505 470-480
55-60 50-55
485-495 470-480
55-60 50-55 1.4-1.6 4.1-4.3
0040 X 10'· > 1.0 X 10" > 1.0 X 10'"
FIBERGLASS-POLYESTER (CONTID) Ref. 16
70
60
a:: 50 0 .... ~ 40 a:: W 30 ~ Q.
t!- 20
10
0 0 50 100 150 200 250 300
TEMPERATURE, "C
Influence of temperature on the % power factor of V7000-15
54
~
Z ~
CJ)
3.71
3.61
Z o
3.5
t(.
)
(.) a:: ~ 3
.4t-
frl ...J
lLI
<.n
-<.n
0
3.31
-
RE
INF
OR
CE
ME
NT
_liE
II G
LAS
S
TE
ST
ED
A
T 6
62
0 F
®
10'
0 C
PS
3.2
' I
I I
I o
20
0
40
0
60
0
80
0
TIM
E A
T 6
00
°F
'" H
OU
RS
Eff
ect
of
60
00
F A
gin
g o
n D
iele
ctr
ic C
on
stan
t o
f A
F-R
-50
00
Po
lyim
ide L
am
inate
s
- - -
10
00
'T1
H tJ:I
ttl ~
t""' >- C/)
C
/)
I "d
0 t""' ><
H 3:
H t:l
ttl
::tl
(\)
I-t)
(N
.00
90
1 R
EIN
FOR
CE
ME
NT
_"E
" G
LAS
S
TES
TED
AT
6
62
of
@ 1
010
CPS
.00
80
1-
-I
'OO
7 t l
... Z
LIJ " Z ~
fI)
fI) 9
.00
60
....
Ot
0.
.ooe
ol- I
I I
I I
.00
40
0 2
00
4
00
6
00
8
00
10
00
TIM
E
AT
600°
F,..
, HO
UR
S
Eff
ect
of 6
000
F A
ging
on
Lo
ss T
ang
ent
of A
F-R
-50
00
Po
lyim
ide
Lam
inat
es
'Tl
H
tI:I
tTl
::tl
G) ~
en
en
I ."
0 t.- 0-<
H :s: H t:l
tTl
,-..
n 0 z >-
3 - t:l '-'
::tl
(1)
H)
VI
FIBERGLASS-POLYIMIDE (CONTID) Ref. 3
.010r-------~------~--------~------~------~------~
...... 009 z w (!) z ~ .008
en en o ..J
.007
.0060
4.3 ..... z ~ 4.2 en z 0 4.1 (,)
u a::: 4.0 .... (,) IJJ ..J 3.9 IJJ -0
3.80
100
100
TEST FREQ. - 9.375 K Me REINFORCEMENT- E GLASS STYLE 181
200 300 400 500
200 300 400 500
TEMPERATURE I"oJ of
600
600
Effect of Temperature on Dielectric Propertie s of Skybond 700 Polyimide Laminates
57
FIBERGLASS-POLYIMIDE (CONT'D) Ref. 55
"
Test Dielectric Dissipation Temperature Constant, Factor Loss
Resin of K' tan <5 Index
Po1yimide 1 75 3.81 0.0075 0.0286 300 3 . 88 0.0117 0.0454 400 3 . 89 0:0075 0.0292 500 4.01 0.0111 0.0445
Po1yimide 2 75 4.20 0.0071 0.0298 300 4.30 0.0082 0.0353 400 4.34 0.0110 0.0477 500 4.34 0.0150 0.0651
E glass style 181 fabric with approximately 35 percent resin content. Properties measured at 9.35 GHz.
Glass Fabric Ref.
4,6 4.6
" 4.1 ' , 1
) .. ) .. 0.010 0.010
IS 0
0.0 16 10J I.
0.01' 197 4. >69 55
61
.... .... . ))Z U
o.OIl
0.00 1
Fiberglass laminate with 181 glass cloth and a pol yol eros s -linked polyimide resin, 8. 52 GHz
58
41 . 70 ... 71 Sl9 IS
0.012 409 91 195 107 'OJ IZO
0.00'
0 . 004
'00 ZOO 100 400 soo 600 TOe
Fiberglass laminate with 181 glass cloth and a polyimide resin, 8.52 GHz
* Sk
ybon
d 70
0 L
amin
ates
Pro
per
ty
As
is
D 2
4/23
* D
48/
S0*
Die
lectr
ic s
tren
gth
S
ho
rt t
ime
para
llel
to l
amin
ate
(vo
lts)
55
,000
-
32,0
00
Ste
p-b
y-s
tep
para
llel
to l
amin
ate
(vo
lts)
38
,000
-
16,0
00
Sh
ort
ti
me
(vo
lts/
mil
) 17
9 -
-S
tepw
ise
(vo
lts/
mil
) 14
0 -
-D
iele
ctr
ic C
on
stan
t (lM
C)
4.1
0
4.3
0
4.81
D
issi
pat
ion
Fac
tor
(lMC
) .0
0445
.0
0639
.0
1650
Insula~ion
resi
stan
ce
(meg
ohm
s)
1.9
x
107
--
Vol
ume
Resi
stiv
ity
(o
hm-e
ms)
2.
47 x
101
5 -
-S
urf
ace
Resi
stiv
ity
(o
hms)
3.
35 x
10
14
--
* AS
TM
con
dit
ion
ing
pro
ced
ure
s,
ASTM
D
618-
61
X-B
and
Dat
a (8
.5
KMC)
~
Tem
pera
ture
D
iele
ctr
ic C
on
stan
t D
issi
pat
ion
Fac
tor
Room
Tem
pera
ture
3
.74
0.
016
50°C
3
.74
0.
015
100°
C
3.7
4
0.01
4
150°
C
3.7
4
0.01
8
200°
C
3.7
4
0.01
3
250°
C
3.7
4
0.01
0
300°
C
3.7
0
0.01
5
* E
gla
ss
181
sty
le f
ab
ric w
ith
A-l
lOO
fi
nis
h.
C96
/3S
/90*
- - - - - -1
.4 x
10
2 1
.16
x
lOll
2
.90
x
1010
'T.I
1-1 ~ ~ 5: en
en
I "tl o t"" -<
1-1 3:
1-1 o tTl
~
n ~ ~
c '-' " (1) H1
V1 o
FIBERGLASS-POLYIMIDE (CONT'D)
* * Test F170 Fl7l Property Method Units (28) (28)
Dielectric Constant U 8.5 GHz 3.74 3.76
Dielectric Constant U 106 Hz 4.1
Dissipation Factor U 8.5 GHz 0.016 0.016
Dissipation Factor U 106 Hz 0.0044
Thermal Conductivity U cal/cm secoC
Thermal Expansion Coefficient U in/in;oC _70° to 90°C 90° to 170°C
170° to 400°C
* E glass style 7781 fabric ** E glass style 181 fabric with A-llOO finish
*** S-994 glass roving
60
** *** Pyralin Pyralin Cll) (ll)
3.9 3.9
0.015 0.014
4.36 x 10- 4
0.74 x 10- 5 0.34 x 10-5 0.69 x 10- 5
FIBERGLASS-SILICONE Ref. 55
Test Dielectric Dissipation Temperature Constant Factor Loss
Resin of K' tan 0 Index
Silicone 75 3.98 0.0081 0.0322 300 4.17 0.0069 0.0288 400 4.31 0.0066 0.0284 500 4.46 0.0070 0.0312
"E" glass style 181 fabric with approximately 35 percent resin content properties measured at 9.35 GHz.
61
FIBERGLASS-SILICONE (CONT'D)
Property
Dielectric Constant 9.36 GHz
Dry
Dielectric Constant 9.36 GHz
Wet
Dielectric Constant 106 Hz
Dry
Dielectric Constant 106 Hz
Wet
Dissipation Factor 9.36 GHz
Dry
Dissipation Factor 9.36 GHz
Wet
Dissipation Factor 106 Hz
Dry
Dissipation Factor 106 Hz
Wet
Dielectric Strength 9.37 GHz
Arc ResistaI 9.37 GHz
* E glass ** D glass
Test Method Units
MIL-R-25506
MIL-R-25506
MIL-R-25506
MIL-R-25506
MIL-R-25506
MIL-R-25506
MIL-R-25506
MIL-R-25$06
U V/mil
ce U seconds
F130* F13l* F130** POly-Preg
5860* (28) (28) (46) (60)
3.946 3.60 4.17
4.021
4.03 3.9
4.12 4.0
0.0082 0.002 0.013
0.0106
0.0019 0.002
0.0075 0.010
100
244
62
FIBERGLASS-TEFLON Ref. 57
RT/duroid 5870 is a polytetrafluoroethylene
laminate reinforced with randomly oriented microglass fibers.
Property
Dielectric Strength, Short Time, volts/mil. Dielectric Constant, 1 MHz Dissipation Factor, 1 MHz Dielectric Constant, 10 GHz Dissipation Factor, 10 GHz Surface Resistivity, Ohms
As Received 96 hours, 100% R.H., 23°C
Volume Resistivity, Ohm - Cm As Received 96 hours, 100% R.H., 23°C
Arc Resistance
Thermal Expansion Coefficient x 10- 5
Longitudinal Direction, O-lOO°F Transverse Direction, O-lOO°F Thickness Direction, O-lOO°F Longitudinal Direction, 100°F-350°F Transverse Direction, 100°F-350op Thickness Direction, 100°F-350°F
Thermal Conductivity, BTU - in. Hr. -Sq. Ft. ~
63
ASTM Method
D149-55T D153l-58T D153l-58T MIL-P-13949 MIL-P-13949 D257-57T
D495-56T
U
U
Test Values
300 2.35 0.0005 2.35 .0012
3.0 x 1014
3.0 x 10 14
2.0 x 10 13
2.0 x 10 13
No track up to melting at 180 sec.
1.6 4.0 10.0 1.0 2.0 10.1 1.8
FIBERGLASS-TEFLON (CONT'D) Ref. 57
Dielectric Constant vs. Frequency (Hz)
2.40
-----~----RT/dUlid 5870
---2.30
2.20 106 107 108 1010
Dissipation Factor vs. Frequency (Hz)
.0015
RT/dUD " ,,'
--' """" ----' ~ .... --.0010
.0005 I""""""'
107 108 1010
64
FIBERGLASS-TEFLON (CONT'D) Ref, 61
F1uorg1ass E 650/2-1200
E .L E II Freq. , GHz TOe K tan 0 K tan 0
8,5 23 2.505 .0014 2.847 .0036
4 -195 2.533 .00082 2.896 .00172
DiC1ad-522
E 1. sheet All values of tan <5 multiplied by 104
TOe Freq, (Hz) 10 102 103 104 105 106 107 5.5xl07 9xl07 3.14xl0 9~
25 K 2.739 2.740 2.738 2.737 2.735 2.734 2.733 2.732 2.731 2.712 1 tan <5 8.6 7.0 6.7 6.1 6.3 6.95 7.7 10.0 11. 7 22.5
100 K 2.710 2.705 2.704 2.698 2.696 2.683 2.680 1 tan <5 11.1 8.10 8.25 7.17 7.07 7.7 31
250 K 2.554 2.534 2.522 2.503 2.502 2.49 1 tan <5 79.0 36.3 20.35 14.9 11.6 10.6
-78 K 2.796 2.793 2.790 2.784 2.78 2.78 2.752 1 tan <5 4.2 5.9 6.8 7.1 7.7 9.8 17
-195 K 2.801 2.799 2.794 2.792 2.787 2.758 1 tan <5 .0005 2.2 4.5 5.1 5.4 12
-269 K 2.789 2.789 2.784 2.783 2.780 1 tan <5 .0003 1.2 2.0 2.2 2.1
* Ca.pper cavity
E II sheet
TOe Freq. (Hz) 3xl08 109 3x109 8.5x109 1.4x101O 2.4x101O
25 K 3.155 3.153 3.152 3.146 3.133 3.127 tan <5 28 30 33 40 48 52
100 K 3.11 tan <5 39
250 K 3.03 tan <5 36
-54 K 3.17 3.13 tan <5 35 39
-195 K 3.22 3.12 tan <5 28 31
65
Exp
erim
enta
l L
amin
ates
wit
h a
Ree
may
R
einf
orce
men
t
XXXP
E
poxy
P
hen
oli
c U
nit
s C
ondo
M
atri
x
Mat
rix
8: D
iele
ctr
ic C
on
stan
t -
A
3.2
-3.4
3
.9
(1
mc)
-
024/
23
3.3
-3.6
4
.0
Die
lectr
ic S
tr.
Per
p.
St
vpm
A
91
7 P
ar.
SXS
kv
kv
048/
50
80-1
10
75
Insu
lati
on
Res
ista
nce
m
ohm
C
-96/
35/9
0 10
9-1
0"
109
Su
rfac
e R
esis
tan
ce
m o
hm
C-9
6/35
/90
108
-10"
10
8
X
Po
ly-
Ph
eno
lic
est
er
Mat
rix
M
atri
x
4.0
3
.1
4.0
3
.1
90
70
109
109
lOll
"0
o t'"""
0-< rn ~
rn
::0
r--.
. 'T
l H
~
::0
'--'
I rn
"0
o ><
0-
<
"0 ffi z o t'""
" H
n .. "0
o t'""" ~ ~
tTl
::0
::0
(I)
I-t)
V1
.....
Die
lectr
ic P
rop
erti
es o
f PR
D-4
9-11
1 C
ompo
site
s at
9.3
GHz
F
requ
ency
vlo
Tem
p.
Fib
er
Sam
ple
Fib
er
Fib
er
Res
in
of
Con
diti
on
Ori
enta
tio
n
P52
89-l
8A
49-1
11
58
BP-
907
77
---
1 to
E
(120
S
tyle
)
" "
" "
" ---
II to
E
" "
" "
315
---
II to
E
" "
" "
77
Aft
er 3
15
of
II to
E
mea
sure
men
t
~
" "
" "
77
Aft
er 2
4 h
rs
II to
E
in H
2O
P528
9-25
49
-I I
I 54
E
pon-
828
77
---
II to
E
(120
S
tyle
)
" "
" "
315
---
II to
E
Die
lectr
ic
Con
stan
t
3.25
3.67
4.05
3.6
8
3.6
5
3.45
3.8
8
Los
s T
ange
nt
0.00
995
0.01
27
0.05
09
0.01
67
0.01
86
0.01
59
0.04
06
'"tl ::0
o .;:.
\.0
I tT
l '"
tl a ~
::0
CD
I-t)
. ......
o
PRO 49-EPOXY (CONT'D) Ref. 10
* Thermal Conductivity of PRD-49-III/Epoxy Composites
v/o Thermal Conductivity Fiber Form Fiber Heat Flux Direction Btu/hr 1ft 2 r F/ ft
120 style fabric 46 Across fabric layers 0.123
120 style fabric 46 Parallel to wrap 0.525
181 style fabric 59.5 Across fabric layers 0.122
Unidirectional 54.0 Transverse to fibers 0.087
Unidirectional 54.0 Parallel to fibers 1. 01
* Test methods unknown.
68
PRO 49-EPOXY (CONT'D)
9.3 GHz FREQUENCY
I I 181 E-GLA$/POL YMIDE
\ I -4.0
OIELECTRIC CONSTANT
3.0
o
- I f ~ PRD49-1/BP907
I ----
EPOXY RESIN SYSTEM GOOD ONLY TO 3000 F
100 200
TEMPERATURE DEGREES F
0.02 ,...-------,--------...----,
PRD49-1/BP907
LO$ I ___ ~~~ .. ==~~~~ TANGENT ~.01 t-
181 E-GLA$/POL YMIDE
0.001 L.... ___ -'-___ --'-_--'
o 100 200
TEMPERATURE DEGREES F
Test methods in reference.
69
300
Ref. 59
......
o
Co
effi
cien
t o
f T
herm
al
Exp
ansi
on f
or
Un
idir
ecti
on
al
PRO
49-1
Fib
er R
einf
orce
d/E
poxy
Com
posi
tes
Un
idir
ecti
on
al
Fib
er O
rien
tati
on
Co
effi
cien
t o
f T
herm
al
Exp
ansi
on,
10-6
in
/in
oC
(1
0-6
in/i
nOF
)
Tes
t C>
T
empe
ratu
re R
ange
, vc
C
ompo
site
D
irec
tio
n
-250
° to
+15
0 +1
00
to +
150
ERLA
46
l7/P
RO
49
-1
0°
-3.6
8
(-2
.0)
-6.6
(-
3.7
)
90°
+45
.0
(+25
) +
101.
0 (+
56)
Res
in S
yste
m N
o.
2/
PRD
49-1
0°
-4
.95
(2
.75
) -7
.6
(4.2
2)
90°
+61
.0
(+34
) +
93.0
(+
52)
~O =
Lo
ng
itu
din
al m
easu
rem
ent,
p
ara
llel
wit
h fi
ber
90°
= T
ran
sver
se m
easu
rem
ent,
p
erp
end
icu
lar
wit
h f
iber
-100
to
+10
0 -2
00 t
o
-100
-4.4
5
(-2
.47
) -2
.7
(-1
.5)
+38
.0
(+21
) +
20.0
(+
11)
-5.8
(-
3.2
2)
-3.2
(-
1.8
0)
+56
.0
(+31
) +
41. 0
(+
23)
-250
to
-2
00
+1.
0 (+
0.56
)
+30
.0
(+17
)
o (0
)
+41
.0
(+23
)
'"0
§ ~
\D
I tTl
'"0
o ><
0-
<
r--- n ~
t-3
t:J
'-' ::0
(1)
t-t,
N
\D
PRD 49-POLYIMIDE Ref. 59
9.3 GHz FREQUENCY *
V % TEMP. DIELECTRIC LOSS RESIN f (OF) CONSTANT TANGENT
POLYIMIDE 48 70 3.40 0.00645 (P13N) 100 3.42 0.00727
200 3.47 0.00792 225 3.46 0.00775 275 3.42 0.00726 300 3.39 0.00717 400 3.40 0.00973 500 3.45 0.0148 600 3.52 0.0210
36 70 3.28 0.00505 100 3.29 0.00555 200 3.31 0.00621 250 3.32 0.00654 300 3.30 0.00660 400 3.31 0.00889 500 3.39 0.0132 600 3.45 0.0194
* Test methods given in reference
71
QUARTZ-EPOXY Ref. 55
Dielectric Dissipation Reinforce- Constant, Factor, Loss
Resin ment K' tan <5 Index
Epoxy 120 glass 4.55 0.019 0.0865 novo1ac 1 503 quartz 3.46 0.015 0.0519
Quartz style 503 fabric. Test frequency 9.35 GHz. Test methods unknown.
Property Epoxy Ref. 46 Fabric Description Epon 828/CL
Oz/sq yd 8.4 Weave 8H satin Finish AlIOO Dielectric constant X-band, dry-room temp 3.470
(9,375 megacycles) Loss tangent X-band, dry-room temp 0.0092
QUARTZ-PHENOLIC Ref. 46
Property Phenolic Fabric Description V-204
Oz/sq yd 8.4 Weave 8H satin Finish AlIOO Dielectric constant X-band, dry-room temp 3.86
(9,375 megacycles) Loss tangent X-band, dry- room temp 0.040
72
QUARTZ-POLYBENZIMIDIZOL (PBI) Ref. 46
Property PBI Fabric Description AF-R-IOO
Oz/sq yd 8.4 Weave 8H satin Finish AIIOO Dielectric constant X-band, dry-room temp 3.360
(9,375 megacycles) Loss tangent X-band, dry room temp 0.0034
Quartz style 581 with amino silane finish. Ref. 3
.0066
.0058
.0050 o t- .0042 z
PBI/Quartz
lLJ C) o z .0034 ~ en en .0026 o 0 ..J
.0018 o PBI
.0010
.0002 0 50 100 150 200
TIME AT 600°F ~ HOURS
Effect of 600 0 F Aging in Air on Loss Tangent of PBI at 9. 375 KMc
73
~
ao. --~~~~~r-r-III1I1I1~
5.5
~
5.0
z ~
CJ)
z
4.5
0 (,
)
(,) ~
4.0
~
(,)
t.aJ
...J
3.5
t.aJ
0
3.0
A
~
00
0
6 A
F-R
-IO
OIQ
UA
RT
Z ®
9.3
75
KM
c
o 10
0 2
00
3
00
4
00
5
00
6
00
7
00
8
00
9
00
10
00
1100
12
00
TEM
PE
RA
TUR
E f
'I o
f
Eff
ect
of
Tem
pera
ture
on
Die
lectr
ic C
on
stan
t o
f A
F-R
-IO
O P
BI
'8 > ~
N I '" o t"" >< ~ N
......
3: ......
t:I ......
N o t""
,....., '" 0:1 ......
'-'
::0
(1)
I-t! . ().:I
F-
Z ~
CJ)
Z
0 0 0 -til
a:: .... 0 La
J ..
J La
J c
3.7
-. -----~----_r_-----r___----~-__,
PBI
AF-
R-I
OO
3.4
3.3
6 P
BI/
Qu
artz
3.2
3.0
50
10
0 15
0
T I M
E
AT
60
0°
F "-
I H
OU
RS
Eff
ect
of
60
00
F A
gin
g i
n A
ir o
n D
iele
ctr
ic C
on
stan
t o
f P
BI
at
9.3
75
KM
c
20
0
'8 >- ~
N I '"I::l o t"" ><: g; z N
1-1 :s:
1-1
t:l
1-1
N o t""
,-.
'"I::l ~
1-1
'-'
::tI
(1)
I-i)
. VI
~
.03
0
.02
7
.02
4
.-.0
21
Z
lLJ
(!)
.018
z t=! C
J)
.015
C
J) 9
.012
.00
9
.006~
'" A
F -
R -
10
0/ Q
UA
RTZ
.00
3
@ 9
.37
5 K
Mc
o 10
0 2
00
3
00
4
00
5
00
6
00
7
00
8
00
9
00
10
00
1200
14
00
TEM
PE
RA
TUR
E "
-I o
f
Eff
ect
of
Tem
pera
ture
on
Lo
ss T
ang
ent
of
AF
-R-I
OO
PB
I
::0
CD
I-t)
VI
~ N I '1:::l o t"'"
to( ~ N
H :s::
H
o H
N o t"'"
r"\
'1:::l tI:1
H
'-'
QUARTZ-POLYESTER Ref. 55
Dielectric Dissipation Reinforce- Constant Factor, Loss
Resin ment K' tan 0 Index
Polyester 1 503 quartz 3.45 0.005 0.0173 TAC polyester 503 quartz 3.19 0.010 0.0319
* Quartz style 503 fabric. Test frequency 9.35 GHz.
Dielectric Dissipation Reinforce- Constant Factor, Loss
Resin ment K' tan 0 Index
DAIP 503 quartz 3.40 0.005 0.0170
* Quartz style 503 fabric. Test frequency 9.35 GHz.
Dielectric Dissipation Reinforce- Constant Factor, Loss
Resin ment K I tan 0 Index
Diolefin 503 quartz 2.81 0.0039 0.0110
* Quartz style 503 fabric. Test frequency 9.35 GHz.
77
QUARTZ-POLYIMIDE Ref. 55
Dielectric Dissipation Reinforce- Constant Factor Loss
Resin ment K I tan 0 Index
Polyimide 503 quartz 3.16 0.0049 0.0155
Quartz style 503 fabric. Test frequency 9.35 GHz.
Quartz style 581 fabric astroquartz. Polyimide PBI-373. Ref. 2
Laminate Identification A-730-2
Thickness, in. .54
Specific Gravity 1.64
Resin Content, % W/O 35.0
Void Content, % V/O 5.7
Dielectric Constant/Loss Tangent at 9.375 GHz: R.T. 3.27/.008
400°F 3.17/.003
500°F 2.21/.003
600°F 3.00/.004
* see Figure on next page.
Coefficient of Linear Thermal Expansion of Quartz/ BPI-373 Polyimide Eaminate - Wrap Direction
Temp. Range 75°p-400op 400op-500°F 500°F-600op
CTE 10- 6 . j" 0p 1n 1n :
Spec. 1 2.31 2.50 1.50
2 1.77 3.25 1. 75
3 2.23 2.2.5 1. 75
Avg 2.10 2.67 1.67
Laminate #A-714-1. Test method given in reference.
78
A-714-1
.28
1.68
34.8
5.5
*
QUARTZ-POLYIMIDE Ref. 2
N :z: (!J
1.0 ,....,
3.40
I , I 1------! i
( I
I
r; 3.30t--+-~~~-+---+-0\
e +0) s::
~ 3.20 -~h~t1i;t-j--- i--f--- I ---I --f---~ I i r---r---ri-r--Ut --+1-is 3. 10 t--+' ---1------+--~ -----+- f I - I -t-i --
I ! I !! ! t !
.008 N :z: (!J
1.0 .006 ,...., M . 0\
e .004 +0) t: QJ 0)
.002 t: ttl .... VI VI .000 0 -'
l \
+-----+---+----+1 -- --i---J-T~k ~ -r---j--+-- ------- --- -- --- ,- ----l-- -- r-- - t-----L-----,
i ~!
Lh I I I I I " I I
i- -r--- t--t-· -,- T~~tt-2 --ri--~t~-~~) - --- ,i--- j L I i -+- --
! 200 300 400 500 600 700 900
Test Temperature, of
DIELECTRIC PROPERTIES OF QUARTZ/BPI-373 POLYIMIDE LAMINATE VS. TEMPERATURE
79
QUARTZ-SILICONE Ref. 46
Property Fabric Description Silicone
Oz/sq yd 8.4 Weave 8H satin Finish None Dielectric constant X-band, dry-room temp 2.93
(9,375 megacycles) Loss tangent X-band, dry-room temp 0.00098
QUARTZ -TEFLON Ref. 46
Property Fabric Description Teflon
Oz/sq yd 8.4 Weave 8H satin Finish Teflon Dielectric constant X-band, dry-room temp 2.47
(9,375 megacycles) Loss tangent X-band, dry-room temp 0.0007
80
METALLIC MATRIX
UNIDIRECTIONALLY SOLIDIFIED EUTECTICS
Thermoelectric Properties of the
Controlled Sb-lnSb and Te-Bi.Te. Eutectics
Material pohm-cm Qp.v/o Kw/cmo
Sb 4.4 X 1~ 35 0.18 InSb 10 .... -325 0.16 InSb-Sb eutectic
with 4.3 rods 3.05 X 10'" -18 0.11 II Sb rods 33.0 X 104 -71 0.08 n Sb rods
with 8.5 rods 3.0 X 10- -12 0.12 Sb rods 33.0 X 10'" -53 0.09 n Sb rods
with 28 rods 3.15 X 10'" -8.2 0.14 Sb rods 34.0 X 10'" -28 0.10 1. Sb rods
BI.T"" lo-a 214 0.02 Te 4.0 X 10-1
Bt.T",,-Te eutectic 5.4 X 104 18 (20 C) II growth
22 (40 C) rectlon 25 (60 C)
2.2 X lo-a 45 (20 C) 1. growth 55 (40 C) rectlon 65 (60 C)
DISPERSION-STRENGTHENED NICKEL AND ALUMINUM
Physical Properties of Dispersion-Strengthened
Nickel and Aluminum at Room Temperature
Thermal Conduc-
tivity
dl-
dl-
at 700 F. Electrical Btu(ft- Resistivity
Alloy Dlspersold Density hr_OF)-1 (microhm-em)
TD Nickel- 2% ThO. 0.322 50.0 7.6 High Purity None 0.320 54.5 7.0
Nickel" TDNICb 2% ThO. 0.306 8.3 108.0 Aluminumo None 0.097 120.0 2.9 SAP· 13% AI.O. 0.100 100.0 4.2 M257· 8% AI.O. 0.098 110.0 3.4 M486d Intermetallic 0.104 60.0 6.7
Compound
• <0.1% total impurities other than thoria. b 20.0% Cr added to Ni matrix • • <1.0% total impurities other than alumina. dAI-7.8% Fe-l%(Cr-V-Ti-Zr).
81
Ref. 20
Ref. 62
TUNGSTEN FIBER REINFORCED COPPER Ref. 47
.6 6 I~ J.
.5 ~ EI~ctric~1 / ~ndUCtiVity /
Electrical
~I. resistiVit'y -
i .... " ~ Id'
E u E ~ .4 - ';' 4 _ c: - '"
~p
iL>"..... V ~ ~ f<!'
"'" fo,....<;
cV ~ "1~
Open symbol s denote resistivity; _ -sOlid SYTbOIS Idenoti coniuctiV!ty
, 1
o o 20 40 60 80 100 Fiber content, vol u me percent
Electrical resistivity and conductivity of tungsten-fiber-reinforced copper composites.
82
FIBERGLASS REINFORCED ALUMINUM
ELECTRICAL RESISTIVITY
Glass Fiber: "E" - . 0006" Dia. -Parallel Oriented Coating Alloy: 2% Zn 0.2% Cd 1100 Al
Matrix Alloy: 2014 Al Vacuum Injection Casting
Heat Treatment: Solutioned and Aged
Percent Glass Resistivity Av. Resistivity By Volume (microhm-cm) (microhm-cm)
0 3.13 15 6.42 15 6.45 15 6.54 6.49 15 6.43 15 6.64 19 6.66 19 6.30 19 6.29 6.47 19 6.64 19 6.48 22.5 6.50 22.5 6.55 6.525 30 6.50 30 6.45 6.42* 30 6.30 30 5.71 5.74**
* Samples air cooled immediately after casting
Ref. 64
Calculated Resistivity (mi cron -cm)
3.13
3.69
3.86
4.00
4.47
4.47
** Held at 900°F for three hours, then slow cooled in furnace
83
FIBERGLASS REINFORCED ALUMINUM
THERMAL EXPANSION DATA
30-40% Glass in a 2014 Aluminum Matrix Glass Fiber: "E" - .0006" Dia. -Parallel Oriented
Coating Alloy: 2% Zn 0.2% Cd 1100 Al Vacuum Injection Casting
As Cast
Temperature --AI:.. of L
First Cycle 75 0 161 .0004 300 .0011 502 .0020 715 .0024
1030 --1054 .0023 407 .0004
75 -.0008
Second Cycle 75 0 990 .0029
75 0
Third Cycle 70 0 207 .0005 357 .0013 484 .0020 688 .0023 960 .0027 764 .0020 574 .0018 413 .0012 227 .0005 70 --
Fourth Cycle 70 0 303 .0013 670 .0022 942 .0024 562 .0017 222 .0003
70 -.0002
84
Ref. 64
MOLDED COMPOSITE
ASBESTOS-POLYESTER Ref. 48
Random Distribution, Cut Fibers
Polyester Premix Molding Compound Reinforced with Crocidolite Asbestos (Short View Fibers)
Dielectric Constant: @ 1 KHz @ 10 KHz
Powder Factor: @ 1 KHz @ 10 KHz
Volume Resistivity: @ 500 Vdc, ohm-em
85
7.3 6.1
0.22 0.014
1.2 x 10 12
DACRON-DIALLYL PHTHALATE (DAP) Ref. 53
Random Distribution, Cut Fibers
Test Method
Property FTMS 406
Arc Resistance Secs 125 4011
Dielectric Strength (S/S) Volts/Mil D48/50 > 397 4031
Dielectric Constant 1 KC Dry 3.7 4021
Dielectric Constant 1 KC D24/23 3.8 4021
Dielectric Constant 1 MC Dry 3.5 4021
Dielectric Constant 1 MC D24/23 3.5 4021
Dissipation Factor 1 KC Dry 0.014 4021
Dissipation Factor 1 KC D24/23 0.015 4021
Dissipation Factor 1 MC Dry 0.016 4021
Dissipation Factor 1 MC D24/23 0.020 4021
Volume Resistance Megohms C 720/70/100+Dew 0.06 x 106 MIL-M-14 F
86
00
'I
Pro
per
ty
Die
lectr
ic
Co
nst
ant
lOb
H
z D
ry
Wet
Die
lectr
ic
Co
nst
ant
103
Hz;
Dry
W
et
Dis
sip
atio
n
Fac
tor
106
Hz
Dry
W
et
Dis
sip
atio
n
Fac
tor
103
Hz
Dry
W
et
Die
lectr
ic
Str
eng
th,
SS
Wet
Ele
ctr
ical
Res
ista
nce
(V
olum
e)
Hum
idit
y +
D
ew
Arc
R
esis
tan
ce
* F
lam
e re
tard
ant
Tes
t M
etho
d
FTM
S 40
6-40
21
FTM
S 40
6-40
21
FTM
S 40
6-40
21
FTM
S 40
6-40
21
MIL
-P
1983
3
U
Ran
dom
D
istr
ibu
tio
n,
Cut
F
iber
s
DAP
* 10
30
(53)
10
30 F
(5
3)
and
and
Pol
y-D
ap
Pol
y-D
ap
Un
its
6130
(6
0)
6l30
F
(60)
4.2
4
.2-3
.9
4.3
4
.2-4
.0
4.4
4
.3-4
.1
4.4
4
.3-4
.1
0.0
13
-0.0
10
0
.01
0-0
.01
7
0.0
15
-0.0
12
0
.01
4-0
.01
7
0.00
8 0
.00
7-0
.00
9
0.0
08
-0.0
10
0
.00
7-0
.01
7
V/m
i1
38-4
20
397-
424
1012
oh
ms
0.17
0.
14
seco
nds
J 25
125
DA
IP
lM30
(5
3)
lM30
F (5
3)
and
and
Pol
y-D
ap
Pol
y-D
ap
6230
(6
0)
6230
F (6
0)
4.0
4
.3-4
.0
4.0
4
.3-4
.1
4.2
4
.3-4
.1
'4.2
4
.3
0.01
2 0
.01
4-0
.01
1
0.01
4 0.
015
0.00
9 0.
008
0.0
08
-0.0
11
0
.00
8-0
.01
1
391-
425
389-
410
0.0
8
0.2
0
125-
150
125
I I
'Tl
H t:7:1
[T1 e:l t""' > (fl
(fl
I
HO
(flH
0>
"C
It""
'
2n~
;;t"
"'
t""'
''CI
~~
[T1
5S
,-.,
t""
'
~2:3
~[T1
"CI
'--'
,-.
, ~
"CI
'--'
~ o
00
0
0
Pro
per
ty
Die
lectr
ic
Co
nst
ant
106
Hz D
ry
Wet
Die
lectr
ic
Co
nst
ant
103
Hz D
ry
Wet
Dis
sip
ati
on
F
acto
r 10
6 H
z Dry
W
et
Dis
sip
atio
n
Fac
tor
103
Hz D
ry
Wet
Die
lectr
ic
Str
eng
th,
ST
Dry
W
et
Die
lectr
ic
Str
en
gth
, SS
D
ry
Wet
Ele
ctr
ical
Resi
stiv
ity
(V
olum
e)
Arc
R
esis
tan
ce
The
rmal
C
on
du
ctiv
ity
The
rmal
E
xp
ansi
on
C
oeff
icie
nt
Tes
t M
etho
d
FTM
S 40
6-40
21
FTM
S 40
6-40
21
FTM
S 40
6-40
21
FTM
S 40
6-40
21
U
FTM
S 40
6-40
31
U
FTM
S 40
6-40
11
U
U
Ran
dom
D
istr
ibu
tio
n,
Cut
Sh
ort
an
d L
ong
Fib
ers
* *
EM
7I02
E
7111
E
260
Un
its
(60)
(1
8)
(18)
5.1
5
.1
5.8
5
.1
-6
.0
(170
°C)
5.4
5
.5
0.0
19
0
.01
7
0.02
1 0
.02
(1
70°C
)
0.0
13
0
.01
6
V/m
il
380
420
--
V/m
i!
376
390
368
-
ohm
-em
1
x 10
16
seco
nd
s 18
6 18
0
cal/
sec/
cm2
/oC
/cm
10
x
10-4
in/i
n;o
C
1.1
x
10-5
0
.9
x 10
-5
(-30
to
+
30°C
) (-
30 t
o
+ 20
0°C
)
* E
360
(18)
4.5
4
.8
(170
°C)
0.00
15
0.0
2
(170
°C)
400 -
380 -
1.2
x
10-5
(-
30
to
+
200°
C)
---
, I I I
'Tl
H
t;:I
tT
l es t""'
;J>
C/'l
C/'l I tTl
"0
o ><
>-<
FIBERGLASS-MELAMINE Ref. 18
Random Distribution, Cut Short and Long Fibers
Test Property Method Units M-2880 M-2037
Dielectric Constant ASTM 106 Hz D150 6.2 8.0
Dissipation Factor ASTM 106 Hz D150 0.020 0.030
Dielectric Strength, ST ASTM
Dry D149 V/mil 300 230 Wet 275 150
Dielectric Strength, SS
Dry V/mil 250 220 Wet 250 135
Arc ASTM Resistance D495 seconds 180+ 180+
Thermal ASTM Conductivity Cl77 cal-cm/sec cm2 °C 10 x 10- 4
Thermal Expansion ASTM Coefficient D696 in/in;oC 1.6 x 10- 5 1.6 x 10- 5
89
'0
o
Pro
per
ty
Die
lect
ric
Con
stan
t 60
Hz
Die
lect
ric
Con
stan
t 10
3 "H
z D
ry
Wet
Die
lect
ric
Con
stan
t 10
6 Hz
D
ry
Wet
Dis
sip
atio
n
Fac
tor
60
Hz
Dis
sip
atio
n
Fac
tor
103
Hz
Dis
sip
atio
n
Fac
tor
106
Hz
Die
lect
ric
Str
eng
th,
ST
Die
lect
ric
Str
eng
th,
SS
Ele
ctr
ical
Resi
stiv
ity
(V
olum
e) Dry
W
et
A.rc
R
esis
tan
ce
The
rmal
C
on
du
ctiv
ity
The
rmal
E
xpan
sion
C
oef
fici
ent
Tes
t M
etho
d
ASTM
D
150
ASTM
D
150
ASTM
D
150
ASTM
D
150
ASTM
D
150
ASTM
D
150
ASTM
D
149
ASTM
D
149
ASTM
D
257
ASTM
D
495
Cen
co-
Fit
ch
ASTM
D
696
Ran
dom
D
istr
ibu
tio
n,
Cut
S
ho
rt
Fib
ers
ZYTE
L ZY
TEL
7010
-33
7110
-33
Un
its
(9)
(9)
4.52
4.
22
25.0
-
3.73
3.
38
10.7
-
0.01
99
0.01
85
0.02
21
0.01
77
V/m
il
530
630
V/m
il
440
510
ohm
-cm
4
.7x
10
15
4
.0 x
10
14
2.3
x
109
3.0
x 1
09
seco
nds
Btu
-in
/hr
ft2 °
F
in/i
n;o
F
1.3
x
10-5
1
.0 x
10-
5
NY
LAFI
L G
-l/3
0
(17
)
4.0
3.9
- 3.4
-
0.01
8
0.02
2
0.01
7
sod
400
5.5
x 1
01
5
- 148
1.5
2.1
x 1
0-5
NY
LAFI
L G
-IO
/40
(17)
4.4
4.4
- 4.1 -
0.00
9
0.01
1
0.01
8
480
400
2.6
x 1
01
5
- 100
3.3
1.4
x 1
0-5 c
_
"T:I
H
t7j
tTl 2i t:"
'" ;t>
(f
) (f
) I Z >-<
t:"'" §t
~
Ran
dom
D
istr
ibu
tio
n,
Cut
L
ong
and
Sh
ort
F
iber
s
Die
lectr
ic C
on
stan
t,
1 MC
D
ry
Dis
sip
atio
n F
acto
r,
1 MC
D
ry
Die
lectr
ic S
tren
gth
, V
olt
sjM
il,
SjT
D
ry
Sjs
Dry
Sj
T W
et
SjS
Wet
Vol
ume
Resi
stiv
ity
, O
hm-c
m
Co
effi
cien
t o
f L
inea
r Ex~ansion,
in.j
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FIBERGLASS-POLYBUTADINE Ref. 18
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PBD-l60
Dielectric Constant @ RT, 1 mc 4.2
Dielectric Constant @ 170°C 1 mc 4.25
Dissipation Factor @ RT 1 mc. .003
Dissipation Factor @ 170°C 1 mc .0035
Dielectric Strength V/mil SIT 420 +
Dielectric Strength V/mil SIS 420 +
Coefficient of Linear Expansion 1.3 x 10- 5 in/iniaC -30 to +200°C
FIBERGLASS-POLYIMIDE Ref. 18
Random Distribution, Cut Long Fibers
PI-560
Dielectric Constant @ RT, 1 mc 4.9
Dielectric Constant @ 170°C 1 mc 4.9
Dissipation Factor @ RT 1 mc .005
Dissipation Factor @ 170°C 1 mc .0045
Dielectric Strength V/mil SIT 380
Dielectric Strength V/mil SIS 350
Coefficient of Linear Expansion x 10- 5 in/iniaC -30 to +200°C .6
Half Life @ 260°C hrs. 5000
92
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482
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100
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ft2 °
F 0.
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rmoc
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120
2.3
2.1
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rmoc
omp
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5)
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6
3.6
8
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465
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ry
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ll
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tor
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40
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0.
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ic
Str
eng
th,
ST
LP4
06-
V/m
i1
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40
31
390
335
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41
0 40
1
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lectr
ic
Str
eng
th,
SS
LP4
06-
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i1
**
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40
31
290
307
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40
0 31
5
Arc
*
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esis
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ce
LP4
06-
seco
nds
191
184
4011
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Arc
AS
TM
min
ute
s T
rack
ing
D
2303
The
rmal
AS
TM
ca1
-cm
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cm
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1
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x
10-4
1
4.9
x
10-4
C
on
du
ctiv
ity
C
l77
The
rmal
AS
TM
in/i
n;o
C
1. 5
9 x
10-5
E
xpan
sion
D
696
Co
effi
cien
t ------
----
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M D
150
**
AST
M D
149
**
*AST
M D
495
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**
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e re
tard
an
t
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475
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351
389 *
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19
1
14
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10
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2.0
2
x 10
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Typ
e I
E1
ectr
. G
rade
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7)
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300-
350
-
***
180-
350
300-
600
"Ij
H
I:
!' tt
l es ~
en
en
I "0
o t-<
0-(
ttl ~
tTl ~
FIBERGLASS-TEFLON Ref. 57
Random Distribution, Cut Very Short Fibers
Typical Property ASTM Method Units Condition Value
Dielectric Constant Dl53l 2.5 GHz 2.38 ± .05 Perpendicular to 10.0 GHz 2.38 ± .05 molding direction
Dissipation Factor D153l 2.5 GHz .0025 10.0 GHz .0025
Coefficient of Thermal Expansion x 10-6 MD D696 in/in;oC -73 to 20°C 120
20 to 25°C 54 25 to 100°C 149
CMD -73 to 20°C 49 20 to 25°C 76 25 to 100°C 54
Thermal Conductivity cal-cm/hr cm2 °C 23 to 100°C 2.5
MD - molded direction CMD - perpendicular to molded direction
95
MISCELLANEOUS
CONCRETE PAVEMENT Ref. 61
Sample Density (MHz) 0.1 1 10 100
Sl Dry K 9.05 7.97 7.01 6.57
tan 0 .0946 .0913 .0730 .0536
Sl Wet K 176.5 69.2 23.5 13.2
tan 0 .822 1.088 .734 .485
Concrete pavement at 40% R.H., 25°C, 14 GHz
1 0.1 Various 5.03-5.06 .026-.029 2 0.1 Various 5.06-5.17 .034-.030 3 0.335 2.14 2.21 Face 1 5.21 .059
Face 1, 90° 5.20 .0612 Face 2 5.30 .0509 Face 2, 90° 5.26 .0505
4 0.453 2.04 2.81 Face 1 4.71 .0470 Face 1, 90° 4.60 .0455 Face 2 4.70 .0487 Face 2, 90° 4.55 .0487
97
ASPHALT PAVEMENT Ref. 61
Sample Density (Hz) 105 106 107 108
S Dry K 4.51 4.34 4.21 4.14
tan (3 .0280 .0221 .0181 .0198
S Wet K 42.0 17.7 9.03 6.54
tan (3 .875 .638 .444 .233
L Dry K 4.79 4.73 4.70 4.61
tan (3 .0187 .0158 .0123 .0121
L Wet K 14.48 9.28 6.65 6.01
tan (3 .368 .280 .190 .104
Asphalt pavement at 40% R.H., 25°C, 14 GHz
Sample Thickness Density H2O Orientation K' tan (3
No. (cm) (gj cm 3 ) (%)
1 0.1 Independent 4.73 .0114 2 0.1 Independent 4.62 .0103 3 0.1 5.03 .0120 4 0.1 5.48 .0095 5 0.91 2.35 .754 Face 1 6.02 .021
Face 1, 90° 5.53 .052 Face 2 5.37 .204 Face 2, 90° 5.44 .102
98
REFERENCES
1. ANON. Thermoplastics for Load-Bearing Electrical Applications. MATERIALS ENGINEERING, v. 76, no. 6, June 1972. p. 46-47.
2. AIR FORCE MATERIALS LAB., MANUFACTURING TECHNOL. DIV., Wright-Patterson Air Force Base, Ohio. Manufacturing Methods for High Temperature Reinforced Plastic Aircraft Radomes. Jan. 1972.
3. APONYI, T.J. High Temperature Composite Radome Materials. U.S.A.F.Georgia Tech. Symp. on Electromagnetic Windows. June 1966.
4. BISHAY, A. Electrical Conductivity in Glasses and Glass-Metal Composites. American Univ. in Cairo, Dept. of Materials Engineering and Physical Sci., Egypt-. Nov. 24, 1971. Avail. NTIS* as AD 734 252.
5. CELANESE CORP., Morris Court, Summit, New Jersey. Advanced Engineering Composites. What's New in Materials.
6. CONTINENTAL-DIAMOND FIBRE CORP., Newark, Delaware. Polyester Glass - Dilecto and Celoron. Sept. 1965.
7. COPELAND, R.L. and V.A. CHASE. Development of Fiber Reinforced Ceramic Radomes. U.S.A.F. Georgia Tech. Symposium on Electromagnetic Windows, Volume I. June 1966.
8. DEACON, R.F. Electrical Resistivity of Boron Fibers. BOEING SCIENTIFIC PHYS. LABS., Seattle, Washington, Aug. 1967. Avail. NTIS* as AD 658 896.
9,' DuPONT. DuPont Glass-Reinforced Zytel Nylon Resins. Sept. 1969.
10. DuPONT. DuPont's New High Modulus Organic Fiber for Plastics Reinforcement Ballistic Armor and Tension Cable Applications-PRD-49. Preliminary Data, Sept. 15, 1971.
11. DuPONT. Pyralin Polyimide High Temperature Resistant Materials.
12. BRELAND, J.G., JR. et al. Lightning Protective Coatings for Boron and Graphite Fiber Reinforced Plastics. In: 1970 Lightning and Static Electricity Conferen~e, Dec. 9-11, 1970. p. 233-251.
13. BATTELLE MEMORIAL INST., Columbus, Ohio. Electrical and Thermal Transport Models for Analysis of Reinforced Composites. By: DUGA, J.J. Contract No. NONR-4925(00). July 1966. Avail. NTIS* as AD 486 667.
14. FABIAN, R.J. Engineer's Guide to Polyimide Plastics. MATERIALS ENGINEERING, v. 74, no. 2, Aug. 1971. p. 26-31.
* National Technical Information Service, Springfield, Virginia 22151
99
15. FARAG, M.M. et al. Some Physical and Mechanical Properties of GlassAluminum Metal Composites. American Univ. of Cairo, Solid State Res. Center, Egypt. Feb. 1972. Avail. NTIS* as AD 738 663.
16. FEKETE, F. et al. Electrical Properties of Novel Heat Resistant-Fast Curing Thermosetting Resin Systems. Electrical Insulation Conf., Proc., 7th, Conf., Oct. 15-19, 1967. p. 1-5.
17. FIBERFIL DIVISION, REXALL CHEMICAL CO., Evansville, Indiana. Fiberfi1 Reinforced Thermoplastics.
lB. FIBERITE CORPORATION, Winona, Minnesota. Melamine, Phenolic, Epoxy and Polyesters. Apr. 1970.
19. MASSACHUSETTS INST. OF TECHNOL., DEPT. OF PHYSICS, Cambridge, Mass. Amorphous Carbon Films: Conduction Across Metal/Carbon/Metal Sandwiches. By: MacVICAR, M.L.A. Contract No. N00014-67-A-0204-004l. Sept. 1970. Avail. NTIS* as AD 712 073.
20. GALASSO, F.S. Unidirectional1y Solidified Eutectics for Optical, Electronic, and Magnetic Applications. J. OF METALS, v. 19, no. 6, June 1967. p. 17-21.
21. GENERAL ELECTRIC COMPANY, Pittsfield, Mass. GEMON Thermoset Polyimide.
22. GENERAL ELECTRIC COMPANY, INSULATING MATERIALS DEPT., Schenectady, New York. High Temperature Polyimide Prepregs.
23. INTERAND CORP., Rockville, Md. Whisker Reinforcement of Piezoelectric Transducer Ceramics. By: FEITH, K.E. Contract No. N00014-70-C-01B2. Aug. 1971. Avail. NTIS* as AD 730 484.
24. GLASTIC CORP., Cleveland, Ohio. Fiber Glass Electrical Insulation Rod. Nov. 1967.
25. GLASTIC CORP., Cleveland, Ohio. Fiber Glass Plastic Sheet Stock. Aug. 1, 1965.
26. GLASTIC CORP., Cleveland, Ohio. Fiber Glass Reinforced Plastic Structural Insulating Materials. July 1972.
27. HAWLEY PRODUCTS, A HITCO CO. Fiber Glass Reinforced Plastics.
2B. HEXCEL AEROSPACE. Composite Materials. Data Sheets.
29. HOGGATT, J.T. High Performance Filament Wound Composites for Pressure Vessel Applications. National SAMPE Technical Conference, Huntsville, Alabama, Oct. 1971. p. 157-167.
30. HOLLIDAY, L. Composite Materials. ELSEVIER PUBLISHING CO., 1966.
31. NASA. Po1yimide Resin-Fiberglass Cloth Laminates for Printed Circuit Boards. By: KENNEDY, B.W. Patent Application. Sept. 10, 1970. 13 p.
100
32. INTERAND CORP., Rockville, Md. A New Composite Ceramic Piezoelectric Transducer Material. By: LESTER. W.W. Contract No. N00014-70-C-0182. Nov. 1970. Avail. NTIS* as AD 714 494.
33. DARMORY, F.P. et al. P13N: Polyimide Laminating Varnish. Presented at the Annual Institute of Printed Circuits Meeting, Washington, D.C., Apr. 5-8, 1971.
34. SHEWCHUN, J. and J. MITCHELL. Electrical Conduction in Silicon-Carbide Composites. IEEE PROC., v. 117, no. 10, Oct. 1970. - p. 1933-1940.
35. JUN, C.K. and P.T.B. SHAFFER. Thermal Expansion of Niobium Carbide, Hafnium Carbide and Tantalum Carbide at High Temperature. J. OF THE LESS COMMON METALS, v. 24, 1971. p. 323-327.
36. HARADA, Y. and S.A. BORTZ. Properties of Hot-Pressed TaC-C and NbC-C Composites. Presented at the 69th Annual Meeting of the American Ceramic Society, May 2, 1967, New York City.
37. DAVIS, W.J. New TFE Fluorocarbon, Compound is Strong, Rigid. MATERIALS IN DESIGN ENG., v. 53, no. 3, Mar. 1961. p. 10-12.
38. HITCO, MATERIALS DIV., Gardena, Calif. Carbon and Graphite. Oct. 4, 1966.
39. HITCO, MATERIALS DIV., Gardena, Calif. Refrasil Product Bulletin, Aug. 1969.
40. HYDE, J.K. Glass Fibre Laminates in the Electrical Field. In: Glass Reinforced Plastics, Ed. by Phillip Morgan, Liffe Books, Ltd., London, 1961.
41. KNIBBS, R.H. and J.B. MORRIS. The Effects of Fibre Orientation on the Physical Properties of Composites. Plastics Inst., Conf. on Reinforced Plastics Res. Projects III, London, England, Nov. 10, 1971.
42. KNIBBS, R.H. et al. The Thermal and Electrical Properties of Carbon Fibre Uni-Direction Reinforced Epoxy Composites.
43. KUEBELER, G.C. and C.E. JORDAN. Advanced Composites .... The New "Diet" Material for Structural Applications. HERCULES CHEMIST, July 1971. p. 1-10.
44. KUREHA CARBON FIBER. KUREHA CHEMICAL INDUSTRY CO., LTD. New York, N.Y. 10017.
45. LIQUID NITROGEN PROCESSING CORP., Santa Ana, Calif. Fortified Polymers.
46. LUBIN, G. Handbook of Fiberglass and Advanced Plastic Composites. Van Nostrand Reinhold Co., New York, New York, 1969.
47. McDANELS, D.L. Electrical Resistivity and Conductivity of Tungsten-FiberReinforced Copper Composites. TRANS. OF THE ASM, v. 59, 1966. p. 994-997.
101
48. MOLZON, A.E. Electrical Properties of Plastic Materials; Data Compiled from Technical Conference Search. PLASTICS TECHNICAL EVALUATION CENTER, July 1965. Avail. NTIS* as AD 624 922.
49. MOREHOUSE, D.S. and H.A. WALTERS. Foamed Thermoplastic Microspheres in Reinforced Polyesters. SPE JOURNAL, v. 25, May 1969. p. 45-50.
50. MONSANTO CORP. Skybound 700 High Heat Resistant Polyimide Resin Technical Bulletin No. 5042C. Jan. 1970.
51. NAHILL, G.F. and R.A. QUINTUS. A New Laminate Offering Very High Insulation Resistance and Excellent Dielectric Strength. Electrical Insulation Conf., Proc., 7th, Conf., Oct. 15-19, 1967. p. 8-11.
52. NAUM, R.G. et al. Thermal Diffusivity and Thermal Conductivity of CarbonCarbon Composites. Presented XI Therm. Conf. Albuquerque, N. Mexico, Sept. 28-0ct. 1, 1971.
53. PARR MOLDING COMPOUNDS, U.S. POLYMERIC, INC. Composite Data Sheets, dated 1966-1967.
54. PENTON, A.P. et al. Fundamental Investigations of High Intensity Electric Current Flow, Processes and Resultant Damage in Advanced Composites. In: 1970 Lightning and Static Electricity Conf., Dec. 1970. p. 253-259.
55. PETRIE, E.M. Reinforced Polymers for High-Temperature Microwave Applications. IEEE TRANS. ON ELECTRICAL INSULATION, v. EI-5, no. 1, Mar. 1970. p. 19-26.
56. ROBSON, D. et al. Some Electronic Properties of Polyacrylonitrile-Based Carbon Fibers. J. OF PHYS., D, v. 5, 1972. p. 169-179.
57. ROGERS CORP., Rogers, Conn. RT/Duroids - Reinforced Teflon. 1970.
58. SHAFFER, T.B. and C.K. JUN. The Elastic Modulus of Dense Polycrystalline Silicon Carbide. MAT. RES. BULL., 1972.
59. STRATTON, W.K. Evaluation of DuPont's High Modulus Organic Fiber PRD-49 Type 1. National SAMPE Technical Conf., Apr. 21-23, 1971. p. 325-343.
60. U.S. POLYMERIC, I~C. Composite Data Sheets, dated 1966-1968.
61. WESTPHAL, W.B. and A. SILS. Dielectric Constant and Loss Data. MASS. INST. OF TECHNOL., Cambridge, Mass. Apr. 1972.
62. WOLF, S.M. Properties and Applications of Dispersion-Strengthened Metals. J. OF METALS, v. 19, no. 6, June 1967. p. 22-28.
63. DIETZ, A.G.H. Composite Engineering Laminates. THE MIT PRESS, Cambridge, Mass., 1969.
102
64. LOCKWOOD, P.A. Investigations of Glass Fiber-Metal Composite Materials. Contract No. NOrd-15764. Final Rept. - Nov. 1960. Avail. NTIS* as AD 274 530.
65. BRATSCHUN, W.R. et al. Uses of Ceramics in Microelectronics - A Survey. NASA SP-5097, 1971. Avail. U.S. Government Printing Office as 3300-0388.
103