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© 2011 ANSYS, Inc. October 22, 2014 1
ANSYS Icepak R16.0 Update New Features and Enhancements
© 2011 ANSYS, Inc. October 22, 2014 2
• Multiphysics – Icepak – HFSS/Maxwell/Q3D 2-way coupling – Icepak – Ansoft 2-way coupling automation using Feedback Iterator – Temperature-dependent power map import from Sentinel TI
• ECAD import – EDB import capability
• Meshing enhancements – Concurrent assembly meshing
• Modeling and GUI Enhancements
• Solver Enhancements – Parallel Speedup – NC Interface creation – Surface monitoring
• Post processing enhancements
ANSYS Icepak R16.0 Update
© 2011 ANSYS, Inc. October 22, 2014 3
Multiphysics
© 2011 ANSYS, Inc. October 22, 2014 4
• Import losses from HFSS/Maxwell/Q3D into Icepak – Import volumetric and surface losses from HFSS/Maxwell/Q3D into Icepak via
the Workbench project schematic – HFSS/Maxwell generate temperature-dependent data
• Export temperature feedback data from Icepak to HFSS/Maxwell/Q3D – Icepak generates thermal feedback when solution cell updated
• Perform coupling iterations until desired level of convergence – Manual cyclic updates of individual system components
• Option to report assigned volumetric and surface losses in Icepak
Two-way Coupling with HFSS/Maxwell/Q3D
© 2011 ANSYS, Inc. October 22, 2014 5
Both surface and volume mapping supported
Icepak – Q3D 2-way coupling
© 2011 ANSYS, Inc. October 22, 2014 6
• Automatic system updates using the Feedback Iterator – Automatic cyclic updates of system components until temperatures stop
changing within desired level of tolerance
Automatic Coupling Iterations between HFSS/Maxwell/Q3D and Icepak
© 2011 ANSYS, Inc. October 22, 2014 7
Icepak – SI Wave Coupling
© 2011 ANSYS, Inc. October 22, 2014 8
• Improved filtering of powermaps from SI Wave – Filter by area, power – Clip to board outline – Preview imported powermaps
SI Wave Powermap Filtering
© 2011 ANSYS, Inc. October 22, 2014 9
Icepak – Sentinel TI Coupling
© 2011 ANSYS, Inc. October 22, 2014 10
Icepak- Sentinel TI Coupling: Temperature Dependent Powermaps
• Temperature dependent powermaps allow system thermal design variations and optimization with realistic powermaps on chips
• Reduce iterations between chip and system thermal tools
<Co-ord> T1 PD1 T2 PD2 T3 PD3 T4 PD4 T5 PD5
© 2011 ANSYS, Inc. October 22, 2014 11
ECAD Import
© 2011 ANSYS, Inc. October 22, 2014 12
Icepak ECAD Import Capabilities • Cadence
– Allegro 15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 – APD 15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 – SiP Digital/RF 15.7, 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 – Virtuoso 5.10, 6.14, 6.15, & 6.16 (Linux only)
• Mentor Graphics – Boardstation Classic 8.x (uses HKP design flow) – Boardstation XE v2007, v2007.1, v2007.2, v2007.3 and v2007.7 (uses HKP design flow) – See ODB++ Below
• Zuken – CR5000 10 and higher (Zuken translator for .anf & .cmp) – CR8000 2013 and higher (Zuken translator for .anf & .cmp)
• ODB++ – Altium Designer R10 and greater – Cadence OrCAD 16.3 and greater – Mentor Expedition EE7.9.1 and greater – Mentor PADS 9.4 and greater – Zuken Cadstar 12.1 and greater
• Other ECAD Formats – .anf ANSYS neutral file format – .dxf AutoCad drawing format – .gds IC Chip format
© 2011 ANSYS, Inc. October 22, 2014 13
ECAD Import
• ECAD import process optimized • Faster processing, esp. with trace rendering
• EDB integration • EDB import now available • All ANF import features supported
• Booleanized outlines of pads, paths, vias • Wirebonds • Import ODB++ files via EDB
• Interactive selection and display of vias • Ability to deactivate via sets and exclude from conductivity
calculations • Improved filtering of IDF components
• Filtering of capacitors, inductors and resistors now possible
© 2011 ANSYS, Inc. October 22, 2014 14
Display and Modeling of Vias
© 2011 ANSYS, Inc. October 22, 2014 15
Meshing
© 2011 ANSYS, Inc. October 22, 2014 16
Meshing Enhancements
• Meshing enhancements – Concurrent meshing of assemblies • Speed-up of overall meshing time • Not licensed
– No O-grids option for individual assemblies
– Improved visualization of mesh cut planes based on type of region (Solid only, Fluid only and All)
© 2011 ANSYS, Inc. October 22, 2014 17
GUI & Modeling
© 2011 ANSYS, Inc. October 22, 2014 18
• Simplify Board/via and Trace heating panels
• Use mouse buttons to expand/collapse tree nodes under Project and Library
• Show objects by type – Traces, CAD and Joule heating
GUI Enhancements
© 2011 ANSYS, Inc. October 22, 2014 19
• New option to specify ‘Fixed velocity’ for fluid blocks – Vacuum chamber simulations – Specify fixed velocities in X,Y,Z
directions for fluid blocks to create quasi-vacuum regions
– Specify radiation and natural convection conditions
Vacuum Chamber Simulation
© 2011 ANSYS, Inc. October 22, 2014 20
Network Block Enhancements
• Transient simulation capability for network blocks – Specify mass and specific heat – Implemented for all network block
types – Can parameterize mass and specific
heat
© 2011 ANSYS, Inc. October 22, 2014 21
• Internal sources for species modeling – 2D and 3D species sources can be specified
• Transient thermal boundary conditions for recirculating openings
• Type 2 blowers: option to offset the inlet from the center
• Custom vias creation for PCB object
• ‘Individual temperature variation for orthotropic thermal conductivities
Miscellaneous Enhancements
© 2011 ANSYS, Inc. October 22, 2014 22
Solver Enhancements
© 2011 ANSYS, Inc. October 22, 2014 23
Solver Enhancements
• Solver robustness • Improved implementation of non-conformal interfaces • Improved handling of 2D objects touching assemblies • Faster and more robust creation of interfaces in solver
• Object ‘Unmerge’ option for all objects • Better control for macros and post-processing
© 2011 ANSYS, Inc. October 22, 2014 24
Parallel Solver Speedup • Parallel Solver Improvements
• Improved handling of NC interface creation • Solver data export frequency control • F-cycle for algebraic multi-grid method
• Parallel Solver Speedup • Improvement in total solver time up to 40% • Overall reduction in RAM usage
Total time Benchmark time I/O time
0.002.004.006.008.00
10.0012.0014.0016.0018.00
1 2 4 8 16
V15.0.7 Total Time, hrs
V16 Total Time, hrs
0.002.004.006.008.00
10.0012.0014.0016.0018.00
1 2 4 8 16
V15.0.7 Benchmark Time, hrs
V16 Benchmark Time, hrs
0
0.1
0.2
0.3
0.4
0.5
0.6
1 2 4 8 16
V15.0.7 I/O Time, hrs
V16 I/O Time, hrs
© 2011 ANSYS, Inc. October 22, 2014 25
Solution Monitoring
• Surface monitors for object surfaces • Heat flow, Mass flow, Volume flow and
Temperature • Can select an individual side or all sides
• Point monitors for mass concentration of species
© 2011 ANSYS, Inc. October 22, 2014 26
Post-processing Enhancements
© 2011 ANSYS, Inc. October 22, 2014 27
New Color Map Schemes
• Infrared color map schemes supported • Mono chromatic red and gray added • All color map schemes supported by Fluent and CFD now available
© 2011 ANSYS, Inc. October 22, 2014 28
3D Projection of Cut-plane Surface Contours
• Option to project cut plane surface contours to 3D
• Projection is in direction of surface normal
• Only available for smooth shading
© 2011 ANSYS, Inc. October 22, 2014 29
Particle Trail Particle Coarsening
• Option to skip trail particles • Works like uniform points but with mesh point distribution • Speeds up rendering and model transformation
© 2011 ANSYS, Inc. October 22, 2014 30
Multi-valued Isosurfaces
• Option to specify multiple iso-values for a single iso-surface object • Clipping is possible
© 2011 ANSYS, Inc. October 22, 2014 31
• Numeric iso-values can be added to iso-lines of post –processing objects
Numeric Iso-values for Iso-lines
© 2011 ANSYS, Inc. October 22, 2014 32
• Summary report column customization – Choose output columns – Same columns exported to
Excel as well
Summary Report Customization