Aluminium Nanoceramic Substrates for Thermal Management in Electronics

Dr. Pavel Shashkov, Cambridge Nanotherm Limited, UK

EMPS-4, Aalborg, 29th May 2013

Overview

Company Cambridge Nanotherm Limited, founded in Nov. 2010 in Cambridge, UK.

Products Nanoceramic-Aluminium substrates, boards, heat sinks for thermal management in LED Lighting.

Technology Proprietary , patented electrochemical process of forming ceramic layers on Al base of arbitrary shape, such as heat sinks, boards, heat-pipes.

Advantages High Thermal Conductivity and Dielectric Strength, also enables chip-on-heat sink designs.

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Nano-ceramic Dielectric Material

Composition: Nano-crystalline Al oxide

Crystalline grain size: 20-40 nm

Thermal conductivity: 6-7.2 W/mK

Dielectric strength: 60-110 KV/mm

Layer thickness (controllable): 5-50 µm

Temperature resistance: > 500 °C

Fully non-organic material

Can be applied to any shape Al base

Dielectric Comparison

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Nano-ceramic Technology

Proprietary, patented electrochemical process (different from anodising)

Proven technology (in use for engineering applications by blue chip customers)

Robust, reliable with excellent ceramic adhesion to Aluminium

Enabling application of ceramic layers on Al components of arbitrary shape

High thermal conductivity and dielectric strength of applied ceramic layer

Controlled thickness of ceramic layer to fit BDV requirements

Metal tracks applied directly on to the ceramic surface

Nanotherm Applications

Packaged LED on PCB board

with

NANOTHERM layer

Packaged LED on insulated heat sink

with

NANOTHERM layer

Circuit-on-Heatsink

LED chip on insulated heat sink

with

NANOTHERM layer

Chip-on-Heatsink

LED chip on insulated heat pipe

with

NANOTHERM layer

Form Factors - MBPCB

Flat plate MBPCB – 1.5mm Aluminium with nano-ceramic coating and Copper metallisation (typically 1/2oz – 3oz)

Form Factors – Heat sinks

3d Heat sinks – extruded Aluminium with nano-ceramic dielectric and Cu

tracking.

LED Chip on Heat sink LED Light Bar with Osram Oslon devices

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Chip-on-heat sink

Thermal Performance – Composite k (W/mK)

Metallised Alumina Tile

MBPCB (1W/mK, 100 micron Dielectric)

MBPCB (3W/mK, 40 micron Dielectric)

NANOTHERM™ MBPCB (7W/mK, 10

micron Dielectric)

Metallised Aluminium Nitride Tile

20

55

95

115

155

Composite thermal conductivity of Cu-dielectric-Al biscuit Measured by Laser Flash [ASTM 1461-11]

Thermal Performance – LED temperature

Nanotherm™ MBPCB topped a list of over 20 materials tested!

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10

20

30

40

50

60

Nanotherm A B C D

Tem

pe

ratu

re R

ise

(d

egC

)

Substrate Type

Temperature Rise over Ambient v Current

350mA

700mA

1000mA

1500mA

Nanotherm Advantages

Technical Advantages

Customer Benefits

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What We Offer

Cambridge Nanotherm Ltd (UK) 3b Homefield Road, Haverhill, Suffolk,

CB9 8QP, United Kingdom Tel: +44(0)1440 762159, E-mail: info@camnano.com

www.camnano.com

• Product Development

• Substrate Manufacturing

• Consultancy

Contact us:

Acknowledgements:

INSULATED METAL SUBSTRATES FOR THERMAL

MANAGEMENT IN SOLID STATE LIGHTING

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www.camnano.com