Aluminium Nanoceramic Substrates for Thermal Management in ... · Nano-ceramic Dielectric Material...
Transcript of Aluminium Nanoceramic Substrates for Thermal Management in ... · Nano-ceramic Dielectric Material...
Aluminium Nanoceramic Substrates for Thermal Management in Electronics
Dr. Pavel Shashkov, Cambridge Nanotherm Limited, UK
EMPS-4, Aalborg, 29th May 2013
Overview
Company Cambridge Nanotherm Limited, founded in Nov. 2010 in Cambridge, UK.
Products Nanoceramic-Aluminium substrates, boards, heat sinks for thermal management in LED Lighting.
Technology Proprietary , patented electrochemical process of forming ceramic layers on Al base of arbitrary shape, such as heat sinks, boards, heat-pipes.
Advantages High Thermal Conductivity and Dielectric Strength, also enables chip-on-heat sink designs.
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Nano-ceramic Dielectric Material
Composition: Nano-crystalline Al oxide
Crystalline grain size: 20-40 nm
Thermal conductivity: 6-7.2 W/mK
Dielectric strength: 60-110 KV/mm
Layer thickness (controllable): 5-50 µm
Temperature resistance: > 500 °C
Fully non-organic material
Can be applied to any shape Al base
Dielectric Comparison
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Nano-ceramic Technology
Proprietary, patented electrochemical process (different from anodising)
Proven technology (in use for engineering applications by blue chip customers)
Robust, reliable with excellent ceramic adhesion to Aluminium
Enabling application of ceramic layers on Al components of arbitrary shape
High thermal conductivity and dielectric strength of applied ceramic layer
Controlled thickness of ceramic layer to fit BDV requirements
Metal tracks applied directly on to the ceramic surface
Nanotherm Applications
Packaged LED on PCB board
with
NANOTHERM layer
Packaged LED on insulated heat sink
with
NANOTHERM layer
Circuit-on-Heatsink
LED chip on insulated heat sink
with
NANOTHERM layer
Chip-on-Heatsink
LED chip on insulated heat pipe
with
NANOTHERM layer
Form Factors - MBPCB
Flat plate MBPCB – 1.5mm Aluminium with nano-ceramic coating and Copper metallisation (typically 1/2oz – 3oz)
Form Factors – Heat sinks
3d Heat sinks – extruded Aluminium with nano-ceramic dielectric and Cu
tracking.
LED Chip on Heat sink LED Light Bar with Osram Oslon devices
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Chip-on-heat sink
Thermal Performance – Composite k (W/mK)
Metallised Alumina Tile
MBPCB (1W/mK, 100 micron Dielectric)
MBPCB (3W/mK, 40 micron Dielectric)
NANOTHERM™ MBPCB (7W/mK, 10
micron Dielectric)
Metallised Aluminium Nitride Tile
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Composite thermal conductivity of Cu-dielectric-Al biscuit Measured by Laser Flash [ASTM 1461-11]
Thermal Performance – LED temperature
Nanotherm™ MBPCB topped a list of over 20 materials tested!
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Nanotherm A B C D
Tem
pe
ratu
re R
ise
(d
egC
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Substrate Type
Temperature Rise over Ambient v Current
350mA
700mA
1000mA
1500mA
Nanotherm Advantages
Technical Advantages
Customer Benefits
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What We Offer
Cambridge Nanotherm Ltd (UK) 3b Homefield Road, Haverhill, Suffolk,
CB9 8QP, United Kingdom Tel: +44(0)1440 762159, E-mail: [email protected]
www.camnano.com
• Product Development
• Substrate Manufacturing
• Consultancy
Contact us:
Acknowledgements:
INSULATED METAL SUBSTRATES FOR THERMAL
MANAGEMENT IN SOLID STATE LIGHTING
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www.camnano.com