div class=trans-pagebuttonPage 1button div class=trans-image amp-img class=trans-thumb alt=Page 1: New Delhi the 27th July 2012 Subject: Modified Special Incentive Package Scheme M - SIPS to offset disability and attract investments in Electronics Systems Design and Manufacturing src=https:reader034fdocumentsinreader034viewer20220423025ecdd85e1787110540482ba6html5thumbnails1jpg width=142 height=106 layout=responsive amp-img divdivdiv class=trans-pagebuttonPage 2button div class=trans-image amp-img class=trans-thumb alt=Page 2: New Delhi the 27th July 2012 Subject: Modified Special Incentive Package Scheme M - SIPS to offset disability and attract investments in Electronics Systems Design and Manufacturing src=https:reader034fdocumentsinreader034viewer20220423025ecdd85e1787110540482ba6html5thumbnails2jpg width=142 height=106 layout=responsive amp-img divdivdiv class=trans-pagebuttonPage 3button div class=trans-image amp-img class=trans-thumb alt=Page 3: New Delhi the 27th July 2012 Subject: Modified Special Incentive Package Scheme M - SIPS to offset disability and attract investments in Electronics Systems Design and Manufacturing src=https:reader034fdocumentsinreader034viewer20220423025ecdd85e1787110540482ba6html5thumbnails3jpg width=142 height=106 layout=responsive amp-img divdivdiv class=trans-pagebuttonPage 4button div class=trans-image amp-img class=trans-thumb alt=Page 4: New Delhi the 27th July 2012 Subject: Modified Special Incentive Package Scheme M - SIPS to offset disability and attract investments in Electronics Systems Design and Manufacturing src=https:reader034fdocumentsinreader034viewer20220423025ecdd85e1787110540482ba6html5thumbnails4jpg width=142 height=106 layout=responsive amp-img divdivdiv class=trans-pagebuttonPage 5button div class=trans-image amp-img class=trans-thumb alt=Page 5: New Delhi the 27th July 2012 Subject: Modified Special Incentive Package Scheme M - SIPS to offset disability and attract investments in Electronics Systems Design...