Planning for Local Net Congestion in Global Routing Hamid Shojaei, Azadeh Davoodi, and Jeffrey Linderoth* Department of Electrical and Computer Engineering.
1 Thermal Via Placement in 3D ICs Brent Goplen, Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota.
APLACE: A General and Extensible Large-Scale Placer Andrew B. KahngSherief Reda Qinke Wang VLSICAD lab University of CA, San Diego.
A Diagonal-Interconnect Architecture and Its Application to RISC Core Design Mutsunori Igarashi, Takashi Mitsuhashi, Andy Le, Shardul Kazi, Yang-Trung.
