Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs Hao Yu, Joanna Ho and Lei He Electrical Engineering Dept. UCLA Partially supported.
Thermal Via Allocation for 3D ICs Considering Temporally and Spatially Variant Thermal Power Hao Yu, Yiyu Shi and Lei He Electrical Engineering Dept. UCLA,
Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs
