Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs Hao Yu, Joanna Ho and Lei He Electrical Engineering Dept. UCLA Partially supported.
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ATMEL High Temp H Bridge
1 High-Speed Digital Circuit Design Chris Allen ([email protected]) Course website URL people.eecs.ku.edu/~callen/713/EECS713.htm.
100+ GHz Transistor Electronics: Present and Projected Capabilities [email protected] 805-893-3244, 805-893-5705 fax 2010 IEEE International Topical.
MARS A Scan-Island Based Design Enabling Pre-Bond Testability in Die-Stacked Microprocessors Dean L. Lewis Hsien-Hsin S. Lee Georgia Institute of Technology.
Graham Beck (QMUL) LBNL Sept.2013 1 Berlin, March 2013: FEA of Side-Mounted Card + Straight Cooling Pipe (no meander through SMC region): For adequate.
Simultaneous Power and Thermal Integrity Driven Via Stapling in 3D ICs
7 a H-Brigde for DC-Motor Applicattions
Thermal FEA Update (mainly END of STAVE) September 2013
100+ GHz Transistor Electronics: Present and Projected Capabilities
Class-D Audio Power Amplifiers: PCB Layout For Audio Quality, EMC & Thermal Success (Home Entertainment Devices) Stephen Crump [email protected] Audio Applications.
