INtro Conclusion
3D IC'S
Chip amount matches bet amount – Deal button near chips – Clear Button.
QuizOfThings
3D Nanoelectronic Computer Architecture and Implementation
3D-IC Dynamic Thermal Analysi With Hierarchical and Configurable Chip Thermal Model-IEEE-3DIC-2013
Mohammed Shahid Ali, A.R Nazmus Sakib, Dereje Agonafer. The University of Texas at Arlington.
Hsinchu, Taiwan December 6, 2000 1 International Technology Roadmap for Semiconductors (ITRS 2000) Assembly & Packaging International Technical Working.
