Stout & Billings July 2007 InterPack 2007, Vancouver Canada, ASME-JSME Thermal Engineering and Heat Transfer Conference USING LINEAR SUPERPOSITION TO SOLVE.
Dendritic growth in pure metals
Electrical Analogy of Heat Transfer P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Simple ideas to Eliminate Discontinuities.
Thermal Resistance Mel242-9
Measurement of Thermophysical Properties
