Seminar Report ‘08
3D Integrated Circuits and their economic feasibility
A Case for Wireless 3D NoCs for CMPs Hiroki Matsutani (1), Paul Bogdan (2), Radu Marculescu (2), Yasuhiro Take (1), Daisuke Sasaki (1), Hao Zhang (1),
Sneak Peek into the Future with Prof. Indranil Sengupta, IIT Kharagpur
3 d ic
Sec13 Paper Imeson Copy
3D-INTEGRATED CIRCUITS
Ronald Lipton, ACES March 4, 2009 1 Application of Vertically Integrated Electronics and Sensors (3D) to Track Triggers Contents Overview of 3D Fermilab.
Naveen Ppt 3d ic technology
MonolithIC 3D Inc., Patents Pending MonolithIC 3D ICs November 2012 1 MonolithIC 3D Inc., Patents Pending.
MonolithIC 3D ICs
