AMD annual-1999
AMD annual-1998
Algorithms for VLSI Physical Design Automation
Ibm research gto 2010 v lyon lite
Carbon nanotubes (cnt) as interconnects for future
1 A Dual-Core Multi-Threaded Xeon® Processor with 16MB L3 Cache Stefan Rusu, Simon Tam, Harry Muljono, David Ayers, Jonathan Chang (Intel, Santa Clara,
Simulating materials with atomic detail at IBM: From biophysical to high-tech applications Application Team Glenn J. Martyna, Physical Sciences Division,
Simulating materials with atomic detail at IBM: From biophysical to high-tech applications
Thin films are basic building blocks for devices. As device size shrinks, quantum effects become important, and traditional thinking in terms of electron.
The Monolithic 3D-IC
