LOW COST AND LOW MASS BUMP BONDING SAMI VAEHAENEN – CERN PH-ESE 1.
ILP-Based Inter-Die Routing for 3D ICs Chia-Jen Chang, Pao-Jen Huang, Tai-Chen Chen, and Chien-Nan Jimmy Liu Department of Electrical Engineering, National.
Low cost and low mass bump bonding
System in Package and Chip-Package-Board Co-Design
