1.Introduction and application. 2.Light source and photomask, alignment. 3.Photolithography systems. 4.Resolution, depth of focus, modulation transfer.
Chapter 1 Introduction and Historical Perspective 1.Introduction. 2.Growth of IC – Moore’s law. 3.Some history in IC industry. 4.Semiconductors. 5.Semiconductor.
Nanoimprint lithography (NIL) 1.Overview. 2.Thermal NIL resists. 3.Residual layer after NIL. 4.NIL for large features (more difficult than small one).
1.SiO 2 properties and applications. 2.Thermal oxidation basics. 3.Manufacturing methods and equipment. 4.Measurement methods (mechanical, optical, electrical).
Nanoimprint lithography (NIL) 1.UV-curable NIL. 2.Resists for UV-NIL. 3.Mold fabrication for thermal and UV-NIL. ECE 730: Fabrication in the nanoscale:
Scanning probe microscopy (SPM) and lithography 1.Scanning tunneling microscopy. 2.Piezoelectric positioning. 3.Atomic force microscopy (AFM) overview.
Electron beam lithography (EBL) 1.Overview and resolution limit. 2.Electron source (thermionic and field emission). 3.Electron optics (electrostatic and.
Chapter 2 Modern CMOS technology 1.Introduction. 2.CMOS process flow (continued). 1 NE 343: Microfabrication and thin film technology Instructor: Bo Cui,
NCEP Global Ensemble: recent developments and plans Mozheng Wei*, Zoltan Toth, Dick Wobus*, Yuejian Zhu, Dingchen Hou* and Bo Cui* NOAA/NCEP/EMC, USA *SAIC.
1 NORTH AMERICAN ENSEMBLE FORECAST SYSTEM (NAEFS) Environmental Modeling Center NOAA/NWS/NCEP USA November 14, 2005 Acknowledgements: Louis Lefaivre, MSC,
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Initial and Lateral Boundary Condition Perturbations DET Module 2
