Ref: BARC/CnID/AMIS/SKB/2020/ 61826 Sub: Minor fabrication - invitation to quote Date: June 19 , 2020
Last date for receiving quotations: /06/2020
Dear Sir/Madam,
1. Quotations are invited by Head, Control Instrumentation Division, on behalf of President of
India for minor fabrication job givenbelow:
SI No. Description Quantity
1 PCBLayout design, Fabrication, Procurement of components, Assembling and
Testing of HMI module, Main Power Supply Module, Power Supply Module
& Front Panel PCB with piggybackKeypad as per specifications given in
Annexure-I, II,III.
16 (4 Sets)
2. Quotations are invited on the letter head with official seal(rubber stamp) for the above mentioned
job.The quotation should contain the following details:(i) Validity of offer (ii) Terms and
conditions of offer (iii) PAN, GST, registration no.(iv)Delivery time schedule(v)Price breakup.
The quotation has to be signed by authorized person with company seal.
3. Item intended to be fabricated/procured in this workis required for R&D purposehence GST
@5% will be applicable and GST certificate will be provided by BARC for the same.
4. The quotation must reach, Head, Control Instrumentation Division by 13/07/2020 (12:00 Noon)
and must be sent in a sealed envelope super scribed with the above Ref. No., and due date given
above.The quotation must be sent by speed post/ordinary post only.
5. Address for sending quotation is as following:
Head,
Control Instrumentation Division,
BARC, Trombay, Mumbai - 400 085.
(Kind attention: S. K. Bahuguna, SO/G, CnID)
6. Requirements of supplier qualification:
i. Certification: The bidder must have ISO 9001:2008 certification and must attach
documentary evidence with the bid.
ii. Human resources: The supplier must give the details of human resources including
Engineers, Draftsman, assembly mechanic, quality control inspector, etc.
iii. Infrastructure: The supplier must give the details of infrastructure suitable for this job
such as Orcad design entry tool, cadence allegro layout tool, solidworks/similar
mechanical design tool, fabrication facility, assembly equipments,electronic testing
equipments.
Government of India
Bhabha Atomic Research Centre
CnID,
TROMBAY,
MUMBAI - 400 085
iv. Past experience: Bidder must provide documentary evidence of prior experience of
working with similar high density, high speed electronic designs with capabilities to do
multilayer PCB design with client’s name.
v. Bidder should have necessary electronic hardware test set up at their facility to carry out
the above fabrication and testing. The list of facilities must be submitted along with the
bid.
vi. If required, vendor must allow BARC officials factory visit for evaluation.
7. The bidder should quote for fabrication of the items, including the cost of the materials.
No free issue of materials will be provided by BARC.
8. Delivery schedule :
1 First two set of boards (total 8 nos)within 22 weeks from the date of schematics cleared
for layout from the user. Important milestones are as follows:
i. Final gerber generation -14 weeks (This includes two week for netlist verification
and layout approval at BARC)
ii. Fabrication & assembly - 6 weeks
iii. Testing - 2 weeks ( First at vendor’s site and then at BARC)
2 Remainingtwo set of boards (total 8 nos) within 10 weeks from the date of acceptance of
first 8 boards by I/O.
3 The vendor shall deliver all the boards within 36 weeks from the date of purchase order
issued to the vendor.
9. The vendor should give atleast 15 working days advance intimation to the Indenting Officer to
arrange for visiting vendors’s premises for inspection & functional testing.
10. Boards shall be delivered by the bidder at CnID Stores, Bhabha Atomic ResearchCentre,
Trombay, Mumbai-400085.
11. All materials required for the above said job shall be supplied by the bidder.
12. All work covered by the specification shall be subject to quality surveillance by our engineer.
The finished board shall not be dispatched prior to approval by our engineer, at bidder’s
premises. Necessary inspection facilities shall be provided to our engineers during
fabrication/repairs at bidder’s premises
13. The finished PCBs shall be guaranteed for 1 year against defects and poor workmanship. The
guarantee shall include onsite replacement of defective boards at no extra cost.
14. Payment will be made by electonic transfer after satisfactory completion of the work as per
government rules.
15. Delivery charges if any must be clearly mentioned in the offer. Quotation must indicate the
validity of offer.
16. Head, Control Instrumentation Division reserves the right to accept / reject any or all the
quotations received withoutassigning any reasons.
Encl:
1. Annexure-I: General specification (1 sheet)
2. Annexure-II: Technical specifications (4 sheets)
3. Annexure-III: Block Diagrams & BOM (11 sheets)
(Anuradha Mayya)
Head, Control Instrumentation Division
[For & on behalf of the President of india(the purchaser)]
ANNEXURE-I (1 sheet)
(Ref:BARC/CnID/AMIS/SKB/2020/ 61826 )
General Specifications
1.0 Quality surveillance, inspection and inspection report:
1.1 All work covered by the specifications shall be subject to quality surveillance by the purchaser or
his authorised representatives for which purpose the fabricator shall allow access at all reasonable times
during components assembly to:
1.1.1 The premises in which work is being carried out.
1.1.2 The drawings and / or tooling involved.
1.1.3 Gauges, instruments etc. required for inspecting the work.
1.2 Inspection and tests shall be carried out by the fabricator as per the requirements detailed in the
drawings and these specifications.
1.3 The finished components shall not be despatched prior to approval by our engineer.
2.0 Delivery: 3.1 The bidder shall deliver first two set of boards within 22 weeks from the date of schematics cleared
for layout from the user.
3.2 The bidder shall deliver remaining two set of boards within 10 weeks from the date of acceptance of
first 8 boards by I/O.
3.3 The bidder shall deliver all the boards within 36 weeks from the date of purchase order issued to bidder fromCnID, BARC, Mumbai-85.
3.4In case any extension in the delivery period is required, the fabricator should submit a written request
for the same before the expiry of work order. Any delay in delivery which is attributable to the fabricator
is liable for LD to be imposed on the fabricator
3.0 Sub Contract: 4.1The fabricator shall not sub-contract any or all the work without written consent from the purchaser.
The fabricator shall be responsible for all work of the sub-contractor of the fabricator, if at all allowed by
the purchaser.
5.0 Taxes:
5.1 GST @ 5%will be applicable and GST certificate will be provided by BARC for the same.
5.2An undertaking should be provided regarding promptly deposition of GST to authorities.
6.0 Excise duty:NA
7.0 Payment:
7.1 Payment will be made only after satisfactory completion of work and on production of bill,
advance stamped receipt& Guarantee/Warrantee Certificate. Advance / Part payment against
delivery cannot be made.
7.2 It may be noted that Income tax at 2% and GST TDS at 2% will be deducted from your bill.
8.0 Confidentiality:
8.1 No party shall disclose any information to third party concerning the matters under this
contract generally. In particular, any information identified as “PROPRIETARY” in nature by the
disclosing party shall be kept strictly confidential by the receiving party and shall not be disclosed
to any third party without the prior written consent of the original disclosing party. 8.2 “RESTRICTED INFORMATION” categories under section 18 of the Atomic Energy Act, 1962 and
“OFFICIAL SECRETS” under section 5 of the official Secrets Act,1923: -
Any contravention of the above mentioned provisions by any contractor, sub-contractor, consultant,
advisor or the employees of a contractor will invite penal consequences under the aforesaid legislation.
8.3 Prohibition against the use of BARC’s name without permission for publicity purposes: - The contractor or sub-contractor, consultant, advisor or the employees engaged by the contractor shall not
use BARC’s name for Publicity purpose through any public media like press, radio, T.V. or internet
without the prior written approval of BARC (vide circular ref: 2/Misc-9/Lgl/2001/92 dated April 30,
2001).
(S. K. Bahuguna)
Indentor
Annexure-II(4 Sheets)
(Ref:BARC/CnID/AMIS/SKB/2020/ 61826 )
Technical specification for Layout, Fabrication of PCB Design, Procurement of components,
Assembling and Testing of HMI module, Main Power Supply Module, Power Supply
Module & Front Panel PCB with piggyback Keypad
Job Description:
• Layout, fabrication, procurement of components, assembly, testing of HMI Module, Main
Power Supply Module, Power Supply Module, and Front Panel PCB with piggyback
Keypadas per the technical specifications including scope of work, material, standards and
qualification.
• Circuit schematics will be provided by user (purchaser) for layout and fabrication.
• Supply of HMI Module, Main Power Supply Module, Power Supply Module, and Front
Panel PCB with piggyback Keypad: 4 No. for each type (2 No. for each type shall be
provided in first iteration and remaining 2 no. of each type after testing and correction in first
set)
Technical Specifications
1. Description, Drawings, Bill of Material
The circuit schematics and part number of components will be provided to the supplier after
placement of Purchase Order. The PCB layout shall be designed by supplier. Designer shall
interact with user’s engineer and after completion of layout, the layout file shall be submitted to
user before fabrication. Refer Figure-1,2, 3& 4 for block diagram and Table-1, 2, 3& 4 for Bill of
material.
2. PCB size specifications:
a) PCB Size: 160 mm x 100 mm (HMI Module, Main Power Supply Module and Power
SupplyModule)
: 162 mm x 205 mm (Front Panel PCB)
b) No. of layers- As applicable
3. Scope of Work
a) Hardware Schematic, Layout Design and Gerber file generation
i. Schematic design and BOM will be provided to supplier. The layout design shall be prepared
by an experienced and skilled engineer. If the layout design work is to be outsourced by the
supplier, the name of the company shall be mentioned in the quotation.
ii. Layout design shall be carried out from circuit schematics (.dsn format) as per IPC-2221
guidelines.
iii. All respective datasheets and layout guidelines shall be referred and shall be implemented in
schematic and layout design.
iv. Layout design files should be submitted to user for review and approval before proceeding to
next stage.
v. Signal Integrity (SI) and Power Integrity (PI) of the PCB should be carried out after final
layout.
vi. Gerber files in RS 274-X format should be generated.
b) PCB fabrication and component Assembly:
PCB fabrication shall be started only after the approval of schematic, Layout and Gerber file from
user. The supplier shall procure all the active and passive components and populate/assemble the
PCB. PCB fabrication, components assembly, PCB testing shall be as per the following
requirements:
1- Baking of PCB shall be done before components assembly as per the standard method.
2- The packages of critical components for assembly isBGA.
3- BOM and Package details for all the components are given in annexure-III.
4- The fabricator should buy all the items as per the BOM and of standard make.
5- Inspection of assembled PCB for any shorting.
6- X-Ray inspection for soldering of BGA components are needed to insure the proper joint of
balls on PCB.
7- Final acceptance of assembled PCBs shall be as per the quality acceptance plan given under
clause 6.0-“Quality Acceptance Plan (QAP)” of same annexure.
c) Supply of first set of Modules
After assembling, two numbers of assembled PCBof each type of module (HMI Module, Main
Power Supply Module, Power Supply Module and Front Panel PCB with piggyback Keypad)
shall be supplied for evaluation. User will evaluate the modules and give the feedback within two
weeks. Based upon the performance obtained during evaluation/testing, component changes and
PCB layout modifications if any, shall be carried out. Functional testing on modules will be
carried out as per test procedure prepared by user.
d) Fabrication of 2nd set of modules and final supply
After approval of revised layout and gerber files, new modules will be fabricated and 2numbers of
assembled modules (second set of modules) of each type shall be supplied for testing. Functional
testing of the final units will be performed by user’s engineer at supplier’s site as per mutually
agreed acceptance test procedure.
e) Documentation
The supplier must provide following documents:
i. Final Bill of material,
ii. General Arrangement and Mechanical drawings,
iii. PCB layout files and Gerber files,
iv. Bare Board Test Report, SI and PI analysis report
4. Material & Workmanship
a) Materials and standard parts shall be of good quality and in accordance with best engineering
practice in order to ensure satisfactory operation and ease of maintenance.
b) The components assembly and workmanship shall be in accordance with high grade industrial
practice and the best approved methods as per the given QAP and shall be adequate to achieve
accuracy and finish in accordance with drawings to ensure satisfactory operation and service
life of various parts.
c) A care for cleanliness is to be maintained during assembly and storage of components. A
complete record of assembly and subassembly checks is to be carried out. For this purpose a
checklist is needed to be maintained for counter verification of the finished / completed jobs,
required for assembly.
5. Standards & Engineering Practices to be Followed for PCB
a) PCB quality of FR4 grade Class-2, PCB thickness of 100 mil (or less) copper clad with glass
epoxy lamination should be used. Solder mask & legend print should be provided.
6. Quality Acceptance Plan (QAP)
Following are quality acceptance plan for the component assembly job under this minor
fabrication job.
a) Inspection-After components assembly the boards are required to test for interconnections &
continuity using test instruments. For BGA& fine pitch assemblies high resolution cameras
&AOI machine is required to use to insure solder ability of each pin of BGA on bare PCB. For
FPGAs/BGA device X-ray inspection report is required to generate for verification of solder
ability of BGA on PCB. The test reports should cover all data measured as per instructions
given at different stages of soldering. Acceptability of Electronics assemblies will be checked
as per IPC-A-610E.
b) Powering up of boards- All boards will be powered up after partial assembly (assembly of
power sections only) and complete assembly. Output voltages of each power section will be
reported.
c) After the inspection and powering test the boards will be given to the indenter for final
testing.If any assembly (soldering) defects are noticed during testing the supplier will
correct the same free of cost. If the boards are found functional, further remaining boards are
to be assembled, tested and final delivery can be made. Final acceptance of all the boards
will be given by the indenter after complete functional testing.
7. Quality Surveillance
a) General: Quality surveillance and expediting, relating to all the aspects of the contract will be
carried out by the purchaser or his authorized representative, for which purpose the supplier
and his subcontractor shall allow access to the premises in which the work is being carried out,
during manufacture, assembly and testing.
b) Produce an inspection plan to the purchaser’s satisfaction and notify when checkpoints on the
plan are imminent so that the purchaser’s representative may be present, if it is so desired.
c) The supplier shall be responsible for the inspection of the components that is subcontracted by
him.
d) Waiving of quality surveillance by the purchaser’s acceptance of the items by the purchaser or
his authorized agent, shall not relieve the supplier from his responsibility for supplying the
items in accordance with specification requirements of this document and purchase order.
8. Subcontracting
The supplier shall not sub-contract any or all the work without the written consent from the
purchaser.
9. Packing and Shipment
a) PACKAGING: After completion of all tests and acceptance by the purchaser, the assembled
PCBs shall be thoroughly cleaned, dried, protected from dirt, and any other damage.
Afterwards these PCBs shall be crated suitably with proper protection and with antistatic cover
and shipped to Purchaser’s workplace, CnID, B.A.R.C., Trombay, Mumbai - 400 085. The
Supplier shall be fully responsible for the proper care and handling of PCBs during packing and
shipment to ensure their arrival at destination without damage to any part.
b) DELIVERY: Delivery of subassemblies shall be made only after obtaining approval in all
respect from purchaser. Completed jobs shall be delivered on or before the stipulated delivery
period mentioned in Purchase Order/Work Order.
10. Warranty
The supplier shall give a warranty for a period of 12 months from the date of acceptance of all the
modules (after supply of all items) against defects and poor workmanship. A certificate stating the
period shall be given by the supplier for the same.
11. Deliverables:
The bidder will have to supply the following:
A. Board Layout File.
B. Gerber files in RS-274X format.
C. Sixteen Numbers (4 Set)of assembled and tested Modules (to be tested in two phases as given
in 3 (c) and 3 (d))
D. Documents as given in section-3 (e)
12. Vendor Qualification
a) Supplier shall have facilities and adequate resources for carrying out work of this nature. He
should have executed PCB fabrication & assembling work of similar complexity in recent past.
Supplier shall have necessary tools and manpower for layout design, gerber generation and
component assembling. Supplier shall have applicable software tools for SI and PI analysis.
b) If the supplier wants to outsource PCB fabrication, then name of the company having
fabrication facility shall be provided alongwith the quotation.
c) Supplier should have necessary test equipment like oscilloscope, network switch, etc.
d) User shall have a right to evaluate the supplier through facility inspection by user’s engineer
before the placement of purchase order. Vendor’s found not meeting above qualification
criteria are liable to be rejected during evaluation.
13. Confidentiality
The supplier shall agree to maintain confidentiality for the hardware schematic and other design
files.
14. The quotations shall have breakup of engineering cost, component cost and module cost.
Annexure
(Ref:BARC/CnID/AMIS/SKB/
BLOCK Diagram and BOM
(Layout, Fabrication of PCB Design, Procurement of components, Assembling and Testing of HMI module,
Main Power Supply Module, Power Supply Module & Front Panel PCB with
1.1-Block Diagram (HMI Module)
Figure-1: Block diagram of
Annexure-III (11 Sheets)
BARC/CnID/AMIS/SKB/2020/ 61826)
BLOCK Diagram and BOM
brication of PCB Design, Procurement of components, Assembling and Testing of HMI module,
Main Power Supply Module, Power Supply Module & Front Panel PCB with piggyback
Module)
1: Block diagram of HMI Module
brication of PCB Design, Procurement of components, Assembling and Testing of HMI module,
piggybackKeypad)
1.2- BOM of HMI Module
Table 1: BoM of HMI Module
Item Quantity Reference Part
1 1 CY1 1NF/2KV
2 9 C1,C2,C3,C4,C5,C15,C16,C24,C32 0.1uF
3 2 C6,C7 CAP
4 5 C8,C9,C11,C17,C29 1uF, 50V
5 4 C10,C14,C22,C30 0.22uF, 50V
6 4 C12,C13,C23,C31 1uF, 50V(NF)
7 1 C18 330UF/50V
8 2 C19,C20 4U7F/50V
9 1 C21 10UF/50V
10 1 C25 4.7uF, 12V
11 1 C26 600 pF 50V
12 2 C27,C28 10uF, 10V
13 11 C33,C34,C35,C36,C37,C38,C39,C40,C41,C42,C50 100nF
14 1 C43 4.7uF
15 2 C44,C48 3.9pF
16 2 C45,C46 2.2uF
17 2 C47,C49 1.5pF
18 4 D1,D2,D3,D4 CDSOT23-SM712
19 1 F1 FUSE
20 1 J1 DB 9 Connector
21 1 J2 CON26A
22 1 J3 CON20A
23 1 J4 12VDC
24 1 J5 24VDC
25 1 J6 JUMPER1
26 4 L1,L2,L4,L6 10uH
27 1 L3 12UH
28 1 L5 470nH , 20%
29 1 P1 Connector
30 1 RV1 S14K35
31 4 R1,R3,R4,R6 10E
32 2 R2,R5 100K
33 17 R7,R8,R9,R11,R12,R13,R14,R15,R16,R17,R18,R19,R20,R21,R27,R3
1,R33
10K
34 1 R10 4.7K
35 3 R22,R23,R25 5K
36 2 R24,R26 13.3E, 1%
37 2 R28,R32 4E, 1%
38 1 R29 90K, 1%
39 1 R30 20K, 1%
40 1 SW1 SW PUSHBUTTON-
SPST-2/SM
41 1 U1 SN65HVD33MDRE
P
42 1 U2 MAX3221-EPDB16
43 1 U3 TCA8418RTWR
44 1 U4 LP5912-3P3DRVT
45 4 U5,U6,U8,U10 LT3465AES6TRMP
BF
46 1 U7 PUZ3-D12-S24-D
47 1 U9 TPS62823DLCR
48 2 U11,U12 STM32H743ZIT6
49 1 Y1 25MHZ
50 1 Y2 32.768KHZ
2.1-Block Diagram (Main Power Supply
Figure-2: Block diagram of
Main Power Supply Module)
2: Block diagram of Main Power Supply Module
2.2- BOM of Main Power Supply Module
Table 2: BoM of Main Power Supply Module
S.
No. Reference Qty Description Package
1 C1,C2,C7,C10 4 0.1uF,100V,10%,X7R E0603
2 C3 1 DNP E0603
3 C4 1 0.56uF,25V,10% E0805
4 C5 1 1uF E0603
5 C6 1 10uF E0603
6 C8 1 1nF E0603
7 C9,C11,C12 3 10uF/50V E1210, X5R
8 C13 1 1uF/100V E1206, X7R
9 C14,C15,C16,C17 4 47uF,100V,20% SMD Electrolyte
10 C18,C19,C20,C21,C35,C36,C37,C38 8 4700pF,2kV,10%,X7R E1210
11 C22,C42 2 0.2uF E2220
12 C23,C24,C25,C26,C27,C28,C29,C43,C44,C
45,C46,C47,C48,C49 14 4.7uF,100V,20%,X7R E2220
13 C30,C50 2 4700uF,100V,20% SMD Electrolyte
14 C31,C32,C33,C34,C51,C52,C53,C54 8 4.7uF,100V,10%,X7R E1206
15 C39,C40,C41 3 C E0603
16 C55 1 0.1uF,16V,10%,X7R E0603
17 D1,D5 2 DIODE DO214AB
18 D2,D7 2 S1A SMA
19 D3,D8 2 TPSMC39A DO214AB
20 D4,D11 2 18V DO214AB
21 D6 1 35V DO214AB
22 D9,D10 2 LTST-C193KGKT E0603
23 D12 1 12V DO214AB
24 D13,D14 2 R-LED E0805
25 F1,F2 2 FUSE (30A, 125V) AXIAL
26 F3 1 FUSE (3A, 125V) AXIAL
27 F4 1 FUSE (8A, 125V) AXIAL
28 F5 1 FUSE (10A, 125V) AXIAL
29 J1 1 CON6 CON6
30 J2,J3 2 HEADER 2 HEADER2
31 L1 1 BLM31SN500SH1L SMD IND
32 L2 1 3.3uH SMD IND
33 L3,L4,L5,L6 4 0.33uH, 20%, 50A SMD IND
34 L7 1 FB, 33E, 6A E1206
35 P1 1 6450849-7 VPX Connector
36 P2 1
PETC-01-12-01-01-S-
RA-SD-L PETC
37 Q1,Q4 2 SUD50P06-15 TO252
38 Q2,Q3 2 FDN5630 SSOT-3
39 R1,R2,R3,R30,R31,R34,R35,R38 8 100K E0603
40 R4,R64,R65,R68,R70 5 1k, 1/10W, 5% E0603
41 R5,R6,R21,R22,R23 5 DNP E0603
42 R7,R9,R36 3 10K E0603
43
R8,R12,R13,R14,R15,R16,R18,R19,R29,R3
7,R39,R40,R41,R45,R46,R47,R54,R55,R56,
R60,R61,R62,R63 23 0E E0603
44 R10 1 200K E0603
45 R11 1 4.7K E0603
46 R17,R28 2 47K E0603
47 R20 1 100E E0603
48 R24,R27 2 330E E0603
49 R25,R33 2 2.2K E0603
50 R26 1 1.3M E0603
51 R32 1 15K E0603
52 R42,R51 2 10E, 1/4W E0805
53 R43,R52 2 1E, 1/4W, 5% E1206
54 R44,R53 2 250m, 1W E2512
55 R48,R49,R50,R58,R59 5 R E0603
56 R57 1 500k, 1/2W, 10% POT T/H POT
57 R66,R67 2 49.9k, 1/10W, 1% E0603
58 R69,R71 2 4.99k, 1/10W, 0.1% E0603
59 SW1,SW2 2 TL3301AF160QJ Tactile Switch
60
TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9,T
P10,TP11,TP12,TP13,TP14,TP15,TP16,TP1
7,TP18,TP19,TP20,TP21,TP22,TP23,TP24,
TP25,TP26,TP27,TP28,TP29,TP30 30 Test point Berg1.1
61 U1 1 LTC2955ITS8-1 8-Lead ThinSOT
62 U2 1
MSP430G2553IPW20
R 20-PIN TSSOP
63 U3 1 EC6AW-24S12 DIP-24
64 U4,U5 2 MQPI-18LP T/H EMI
65 U6 1 V28C3V3T50B
57.9 x 36.8 x 12.7
mm
66 U7 1 V28C5T50B
57.9 x 36.8 x 12.7
mm
67 U8,U9 2 CNY17-3 PDIP-6
3.1- Block Diagram ( Power Supply
Figure-3: Block diagram of
Power Supply Module)
: Block diagram of RF Power Supply Module
3.2- BOM of Power Supply Module
Table 3: BoM of Power Supply Module
S.
No. Reference Qty Description Package
1 C1,C2,C3,C4 4 47uF, 100V, 20% SMD Electrolyte
(øD = 10mm)
2 C5 1 0.1uF, 16V, 10%, X7R E0603
3 C6,C7,C8,C9,C26,C27,C28,C29 8 4700pF, 2kV, 10%, X7R E1210
4 C10,C11,C12,C30,C31,C32 6 DNP E0603
5 C13,C14,C15,C16,C17,C18,C19,C33,C
34,C35,C36,C37,C38,C39 14 4.7uF, 100V, 20%, X7R E2220
6 C20, C40 2 680uF, 63V, 20% (ESR 21 mΩ) Radial -
Electrolyte
7 C21, C41 2 4700uF, 63V, 20% (ESR 21
mΩ)
Radial -
Electrolyte
8 C22,C23,C24,C25,C42,C43,C44,C45 8 4.7uF, 100V, 10%, X7R E1210
9 C46 1 1uF, 50V, 10% E0805
10 C47 1 470uF, 63V, 20% SMD Electrolyte
(øD = 16mm)
11 C48 1 100uF, 63V, 10% SMD Electrolyte
(øD = 10mm)
12 D1,D2,D3,D4 4 R-LED E0805
13 F1,F2 2 FUSE (30A, 125V) AXIAL
14 L1 1 FB, 33E, 6A E1206
15 L2,L3,L4,L5 4 0.33uH, 20%, 50A SMD IND
16 P1,P2 2 PETC-01-12-01-01-S-RA-SD-L PETC
17 Q1 1 P-MOSFET SOT23-3
18 R1,R2,R6,R7,R8,R9,R18,R19,R20,R27
,R28,R29 12 0E E0603
19 R3 1 500k, 1/2W, 10% POT T/H POT
20 R4,R5,R22,R23,R24,R30,R31,R32 8 DNP E0603
21 R10,R11,R14,R16 4 1k, 1/10W, 5% E0603
22 R12,R13 2 49.9k, 1/10W, 1% E0603
23 R15,R17 2 4.99k, 1/10W, 0.1% E0603
24 R21,R33 2 10E, 1/4W,1% E0805
25 R25,R34 2 1E, 1/4W, 5% E1206
26 R26,R35 2 250m, 1W, 1% E2512
27 R36 1 20k, 1/10W, 1% E0603
28 R37,R38 2 2k, 1/10W, 1% E0603
29 R39 1 174k, 1/10W, 1% E0603
30 SW1 1 SW_SPDT SMD Switch
31
TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,T
P9,TP10,TP11,TP12,TP13,TP14,TP15,
TP16,TP17,TP18,TP19,TP20,TP21,TP
22,TP23,TP24,TP25,TP26,TP27,TP28,
TP29,TP30
30 Test Point BERG1.1
32 U1,U2 2 QPI-5LZ Lidded SiP
33 U3,U4 2 CNY17-3 PDIP-6 Gull wing
34 U5,U6 2 DCM3623T50T31A6T00 3623 through-hole
ChiP package
35 U7 1 uRAM2TF1 Micro Package
(Quarter Brick)
4.1- Front Panel PCB with piggyback
Figure 4: Assembled
Figure 5 piggyback keypad
piggyback Keypad
ssembled Front Panel PCB with piggyback keypad
piggyback keypad PCB dimension
Figure 6
Note:
1. Silicone Rubber Keypads from Proto Tool
2. Glue to be fixed between the edges of k
3. Front panel with Keypad assembly
4.2- BOM for Front Panel PCB with Keypad
Table 4: BoM of
Item Quantity
1 4
2 24
6 : Front panel PCB dimension
Silicone Rubber Keypads from Proto Tool ( as per Figure-5)
ween the edges of keypad and metal mounting surface for IP 65
has to be IP65 qualified.
Front Panel PCB with Keypad
: BoM of Front Panel PCB with Keypad
Quantity Reference
D1
D2
D11
D20
Apem: Q
D3
D4
D5
D6
D7
D8
D9
D10
D12
D13
D14
D15
D16
D17 SML-
eypad and metal mounting surface for IP 65
Part
Apem: Q-6-P-3
-P11
D18
D19
D21
D22
D23
D24
D25
D26
D27
D28
3 3 J1
J4B1
J4A1
Samtec Make:
QMS-026-01-SL-
D-PC4
4 1
J2
MOLEX Make:
0512964594
5 2 J3
J4
Samtec make:
LSHM-120-3.0-F-
DV-A
6 1 P1 Samtec Make:
QMS-052-01-SL-
D-PC4
7 1 P2 SamtecMake::
QMS-052-01-SL-
D-PC4
8 24 SW1
SW2
SW3
SW4
SW5
SW6
SW7
SW8
SW9
SW10
SW11
SW12
SW13
SW14
SW15
SW16
SW17
SW18
SW19
SW20
SW21
SW22
SW23
SW24
C&K Make: KXT
321 LHS
9 1 4.3” TFT Graphical LCD Mitsubishi Make:
AC043NB0
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