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Page 1: The CMS Electromagnetic Calorimeter

The CMS Electromagnetic Calorimeter

Roger Rusack

The University of Minnesota

On behalf of the CMS ECAL collaboration

Page 2: The CMS Electromagnetic Calorimeter

                          

ICHEP Beijing 2004 – R. Rusack

Detector Overview

MUON BARREL

CALORIMETERS

Silicon MicrostripsPixels

ECAL Scintillating PbWO4 crystals

Cathode Strip Chambers ( )CSCResistive Plate Chambers ( )RPC

Drift Tube Chambers ( ) DT

Resistive Plate Chambers ( )RPC

SUPERCONDUCTINGCOIL

IRON YOKE

TRACKER

MUONENDCAPS

HCAL

Plastic scintillator/brasssandwich

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ICHEP Beijing 2004 – R. Rusack

Goals

High Resolution calorimetry:

– Stochastic term 2.7%, Constant term 0.5%, Noise term 150 – 220 MeV. Large volume:

– 75,848 crystals covering || < 2.6.

– 90.8 tons of crystals or 10.9 m3. Operated inside a 4T magnetic field. In a radiation environment with an integrated dose of:

– 1013 neutrons/cm2 and 1 kGy at = 0 to 2×1014 neutrons/cm2 and 50 kGy for 2.6.

40 MHz bunch crossing rate.

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ICHEP Beijing 2004 – R. Rusack

Lead Tungstate Crystals

Operate at 18o C – Temp dependence = -2.2%/OC.

•Radiation length – 0.83 cm•Molière radius – 2.2 cm.•Fast light output – 80% in 25 nsec.•Relative Light Yield – 1.3% NaI

No long-lived radiation damage.

But short-lived metastable color centers created by radiation – careful monitoring

Transmission

Emission

350 nm

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ICHEP Beijing 2004 – R. Rusack

Construction Overview

10 crystals

Submodule

Dee

138 Supercrystals

36 Supermodules

4 Dees

Module

Barrel61,200 PbWO4

crystalsReadout with 122,400 APD’s

Endcap14684 crystals

readout with VPT’s.

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ICHEP Beijing 2004 – R. Rusack

PreshowerTwo-layer silicon preshower detector placed in front of the endcap calorimeters

2 Xo absorber 1 Xo absorber

2mm silicon strips to separate ’s from ’s and for vertex identification.

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ICHEP Beijing 2004 – R. Rusack

Crystals and crystal production.

Transmission at 420nm Light Yield

All crystals are tested for:• Radiation Hardness,• Light Yield,• Physical Dimensions.• Light yield uniformity.

Projection is 3o off interaction point - 34 different crystal types.

Barrel Crystals are tapered – variation of reponse with origin of the shower.

Correct by roughening one surface of the crystal.

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ICHEP Beijing 2004 – R. Rusack

Photodetection4T B-field precludes use of PMT’s..

Avalanche photodiodes in barrel.

Vacuum Phototriodes in Endcap

Two 5× 5 mm2 APD’s/crystal.Gain – 50.QE – 80% @ 420 nm.Temp sensitivity – -2.4%/ OC.

Gain – 10.QE – 15% @ 420 nm.Rad tolerance - <10% at 20 kGy.Operates in high B – field.

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ICHEP Beijing 2004 – R. Rusack

Readout Overview• Each crystal has a low-noise, large dynamic range pre-amplifier with three gain outputs each coupled to a separate 40 MHz ADC, to cover the full 50 MeV to 1 TeV range.

• Level 1 trigger sums are sent every bunch crossing.

• Data from each crossing is stored until level 1 trigger accept.

•All data are sent on fiber optic links.

Supercrystal

Front-end board

Data

Trigger sums

Very Front End board

GOH

APD MGPA 3 ADC’s

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ICHEP Beijing 2004 – R. Rusack

Front-End Electronics

Barrel – Grouped into a 5 × 5 crystal array.Endcap – Grouped to match

Crystal APD

Amplifier*1

Amplifier*6

Amplifier*12

ADCChannel2 (12bit)

ADCChannel1 (12 bit)

ADCChannel0 (12 bit)

14 bitChannel

Data

Single channel architecture

FE Board

25Trigger Link

Data Link

Creation of trigger primitives.Storage of data to level 1 accept.

Signal from APD’s

~100 W per trigger tower.Total power on detector ~ 50kA, 300 kW.

All front-end electronics in 0.25process.

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ICHEP Beijing 2004 – R. Rusack

Optical Data Links

All data is sent off detector electronics via 1 GHz Optical links.

12Rx moduleRx module

12

1GOHGOH1212

1

96

DistributeDistributed Patch d Patch PanelPanel

Back-end Back-end Patch Patch PanelPanel

Off DetectorOff DetectorFront EndFront End Pigtail Pigtail

fiberfiber

RuggedizeRuggedized ribbond ribbon

Dense Dense multi-multi-ribbon ribbon cablecable

GOLGOL Laser Laser diodediode In-Line In-Line

Patch Patch PanelPanel

CMCMSS

PIN photo-PIN photo-diode diode arrayarray

Digital Digital amp. amp. ASICASIC

1212

10,500 links for whole calorimeter – Data flow: 10 Tb/sec.

Radiation hardOff detector

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ICHEP Beijing 2004 – R. Rusack

Cooling

All 0.25 electronics runs at 2.5V.

0.45 A/channel1 A/board

Radiation hard regulator has a drop out voltage of 1.5V

Total power in whole calorimeter ~300 kW

Crystal light yield decreases by 2.2%/oC & APD gain decreases by 2.3%/OC.

Removing all excess heat is critical for the stable operation of the detector.

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ICHEP Beijing 2004 – R. Rusack

Cooling

Trigger tower on the cooling bars

0.04°C

2 months

Approach: isolate crystals and APD’s from electronics.Remove heat from electronics by close coupling with water cooled bars.

Crystals and APD’s kept to 0.05oC & uniform to 0.2oC.

Temperature stability with a 100-channel system last year.

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ICHEP Beijing 2004 – R. Rusack

Test beam : precalibrationWe cannot test calibrate every crystal with an electron beam.

Obtain a first calibration point from component data: crystal light yield, APD & pre-amplifer gain.

In situ: In situ: Fast intercalibration based on Fast intercalibration based on symmetry in minimum bias events symmetry in minimum bias events 2%2% in few hours in few hours Energy/momentum of isolated electron from WEnergy/momentum of isolated electron from W→→ e ein 2 in 2

monthsmonthsAbsolute energy scale from Z Absolute energy scale from Z → ee+ee-

Test Beam LY

Lab

o L

Y c

orr

= 4.05%

Test Beam LY – Labo LY corr

Relative channel calibration can be obtained from lab with a precision of 4 %4 %

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ICHEP Beijing 2004 – R. Rusack

Monitor Laser SystemThree laser system. ND:YLF laser that pumps a Q-switched Ti-Saphire laser to monitor short term variations in the crystal transmission.

Pulse with same time structure as the scintillator at a frequency of 440 nm.

APD

F1 F2

PIN FE

LaserS

PWO

440 nm796 nm

Laser light injected at the front side of the crystals.

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ICHEP Beijing 2004 – R. Rusack

Monitoring

Resolution before and after an induced large change in light output.

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ICHEP Beijing 2004 – R. Rusack

Results from Test beam with final electronics.

% 0.44 MeV 142

% 2.4 )(

EEE

E430

5040)

Em(Y

Reso

luti

on

(mm

)

Energy (GeV)

1 mm

Energy (GeV)

Energy Position

0.6% at 50 GeV. 0.85 mm at 50 GeV.

Reso

luti

on

(%)