Download - Security Code Lock Project Report

Transcript
Page 1: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 1

1 INTRODUCTION Today everybody is very conscious about the security of their assets and home appliance So home security system is very popular nowadays but it also have some drawbacks In case conventional home security system anyone can operate it that means any one can switch it on or off without permission of the owner Introduction of code lock home security system can greatly solve this problem By using this system only user can operate home security system In this system when correct code is entered the controller senses it and triggers motor and whenever faulty code is entered the microcontroller senses it and alarm turns on Hence user can change the code and can keep it secret This project is very useful for door security applications It operates a relay( for example to open a door) for a few seconds when a valid code is entered The secret code can be changed any time after entering the current code The kit includes the relay for door lock Now a dayrsquos security must require for our home as well as office Here the micro controlled based digital code lock an access control system that allow only authorized person to access a restricted area When an authorized person enters the predetermined number via keypad the relay operates for a limited time ( itrsquos about 6 seconds) or jumper setting J1 show on the circuit board sets continuous It shows relay can be used up to operate solenoid solenoid is an electronic lock which can be used to openclose door When the code has been enters in corrected five times in row keypad will be locked for few minutes and it will be switched on the alarm

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 2

2 BLOCK DIAGRAM

KEY PAD

MICROCONTROLLER

RELAY CIRCUIT

ALARM OR MOTOR

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 3

3 CIRCUIY DIAGRAM

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 4

4 PROJECT DESCRIPTION

MICRO CONTROLLER A Micro controller is used for controlling entire circuits and to maintain timings Here a micro controller named AT89c51 from Atmel Corporation is used for that purpose AT89c51 is an bit micro controller has 40 pins arranged in 4 IO ports that ports are used here for connecting to interface with the load Micro controllerrsquos RESET pin is connected to an RC circuit as shown in above figure This will give a high pulse to the RESET pin at time of starting This will reset the micro controller means start execution from 0000h It is essential for a micro controller circuit When the power is switched ON charge in capacitor will be zero then the reset pin will get high voltage capacitor starts charging then the voltage across the RST pin will decrease micro controller starts execution

KEY PAD

In code lock circuit keypad is made using 12paces of micro switches sw1 to sw9 is used for enter 0to 9 numbers Sw10 is used for code change sw11 is used for enter the code

OPERATION First enter your right password by using number key 0 to 9 If your password is right LED L2 glows and relay is energized For code change enter your old password and push code change key sw10 LED L3 will glows now enter new code

LED INDICATOR L1 - LED used for power indicator L2 - relay status indicator L3 - this LED will glow when you want to change code L4 - this LED will glow when wrong password is entering for five times serially

TECHANICAL FEATURE Up to 32 digits password can be accepted Battery backup facility is provided Password can be changed at any time MasterSlave password facility Wrong password indication

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 5

5 PART LIST FOR CODE LOCK

Resistors R1 to R4 R8 330 Ω orange brown golden R5 8K2 Ω grey red red golden R6R7R9R10 1kΩ brown black red golden RN1 RN2 10K resistor network 9 pin Capacitors CD1CD2 33PF ceramic disc C3 10 uF 25v electrolyte capacitor C4C6 100KPF -104-01 uF ceramic disc C5 1000uF16v25v electrolyte capacitor C7 100uF 16v electrolyte capacitor Semiconductor U1 AT89c5152 micro controller U2U3 SN74LS 373 U4 LM7805 +5v regulator IC Q1Q3 BC547 NPN transistor Q2Q4 BC 548 NPN transistor L1L4L5 red LED 5mm L3 green LED L2 yellow LED D1 to D4 1N4007 rectifier diode Miscellaneous IC socket 40 pin 1 20 pin 2 X1 110592 crystal oscillator Switch 1 to13 3 leg tactile switch reset 2 leg switcj Relay 12 v 1CO PCB mount relay CN2 3 pin burgsstrip with jumper switch Buzzer continuous type Transformer 12v 500mA Two Pencil cell 15 v for dc motor Cell container Plywood Dc motor drive for door lock Main cord 2pin main cord for 230v ac power

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 6

RESISTORS

Example Circuit symbol

Function

Resistors restrict the flow of electric current for example a resistor is placed in series with a

light-emitting diode (LED) to limit the current passing through the LED

CAPACITORS The capacitors function is to store electricity or electrical energy The capacitor also functions

as a filter passing alternating current (AC) and blocking direct current (DC)

This symbol is used to indicate a capacitor in a circuit diagram The capacitor is

constructed with two electrode plates facing each other but separated by an insulator

When DC voltage is applied to the capacitor an electric charge is stored on each electrode While the capacitor is charging up current flows The current will stop flowing when the capacitor has fully charged

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 7

DIODES

Example Circuit symbol

Function

Diodes allow electricity to flow in only one direction The arrow of the circuit symbol shows the

direction in which the current can flow Diodes are the electrical version of a valve and early

diodes were actually called valves

Light Emitting Diodes (LEDs)

Example Circuit symbol

Function

LEDs emit light when an electric current passes through them

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 2: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 2

2 BLOCK DIAGRAM

KEY PAD

MICROCONTROLLER

RELAY CIRCUIT

ALARM OR MOTOR

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 3

3 CIRCUIY DIAGRAM

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 4

4 PROJECT DESCRIPTION

MICRO CONTROLLER A Micro controller is used for controlling entire circuits and to maintain timings Here a micro controller named AT89c51 from Atmel Corporation is used for that purpose AT89c51 is an bit micro controller has 40 pins arranged in 4 IO ports that ports are used here for connecting to interface with the load Micro controllerrsquos RESET pin is connected to an RC circuit as shown in above figure This will give a high pulse to the RESET pin at time of starting This will reset the micro controller means start execution from 0000h It is essential for a micro controller circuit When the power is switched ON charge in capacitor will be zero then the reset pin will get high voltage capacitor starts charging then the voltage across the RST pin will decrease micro controller starts execution

KEY PAD

In code lock circuit keypad is made using 12paces of micro switches sw1 to sw9 is used for enter 0to 9 numbers Sw10 is used for code change sw11 is used for enter the code

OPERATION First enter your right password by using number key 0 to 9 If your password is right LED L2 glows and relay is energized For code change enter your old password and push code change key sw10 LED L3 will glows now enter new code

LED INDICATOR L1 - LED used for power indicator L2 - relay status indicator L3 - this LED will glow when you want to change code L4 - this LED will glow when wrong password is entering for five times serially

TECHANICAL FEATURE Up to 32 digits password can be accepted Battery backup facility is provided Password can be changed at any time MasterSlave password facility Wrong password indication

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 5

5 PART LIST FOR CODE LOCK

Resistors R1 to R4 R8 330 Ω orange brown golden R5 8K2 Ω grey red red golden R6R7R9R10 1kΩ brown black red golden RN1 RN2 10K resistor network 9 pin Capacitors CD1CD2 33PF ceramic disc C3 10 uF 25v electrolyte capacitor C4C6 100KPF -104-01 uF ceramic disc C5 1000uF16v25v electrolyte capacitor C7 100uF 16v electrolyte capacitor Semiconductor U1 AT89c5152 micro controller U2U3 SN74LS 373 U4 LM7805 +5v regulator IC Q1Q3 BC547 NPN transistor Q2Q4 BC 548 NPN transistor L1L4L5 red LED 5mm L3 green LED L2 yellow LED D1 to D4 1N4007 rectifier diode Miscellaneous IC socket 40 pin 1 20 pin 2 X1 110592 crystal oscillator Switch 1 to13 3 leg tactile switch reset 2 leg switcj Relay 12 v 1CO PCB mount relay CN2 3 pin burgsstrip with jumper switch Buzzer continuous type Transformer 12v 500mA Two Pencil cell 15 v for dc motor Cell container Plywood Dc motor drive for door lock Main cord 2pin main cord for 230v ac power

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 6

RESISTORS

Example Circuit symbol

Function

Resistors restrict the flow of electric current for example a resistor is placed in series with a

light-emitting diode (LED) to limit the current passing through the LED

CAPACITORS The capacitors function is to store electricity or electrical energy The capacitor also functions

as a filter passing alternating current (AC) and blocking direct current (DC)

This symbol is used to indicate a capacitor in a circuit diagram The capacitor is

constructed with two electrode plates facing each other but separated by an insulator

When DC voltage is applied to the capacitor an electric charge is stored on each electrode While the capacitor is charging up current flows The current will stop flowing when the capacitor has fully charged

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 7

DIODES

Example Circuit symbol

Function

Diodes allow electricity to flow in only one direction The arrow of the circuit symbol shows the

direction in which the current can flow Diodes are the electrical version of a valve and early

diodes were actually called valves

Light Emitting Diodes (LEDs)

Example Circuit symbol

Function

LEDs emit light when an electric current passes through them

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 3: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 3

3 CIRCUIY DIAGRAM

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 4

4 PROJECT DESCRIPTION

MICRO CONTROLLER A Micro controller is used for controlling entire circuits and to maintain timings Here a micro controller named AT89c51 from Atmel Corporation is used for that purpose AT89c51 is an bit micro controller has 40 pins arranged in 4 IO ports that ports are used here for connecting to interface with the load Micro controllerrsquos RESET pin is connected to an RC circuit as shown in above figure This will give a high pulse to the RESET pin at time of starting This will reset the micro controller means start execution from 0000h It is essential for a micro controller circuit When the power is switched ON charge in capacitor will be zero then the reset pin will get high voltage capacitor starts charging then the voltage across the RST pin will decrease micro controller starts execution

KEY PAD

In code lock circuit keypad is made using 12paces of micro switches sw1 to sw9 is used for enter 0to 9 numbers Sw10 is used for code change sw11 is used for enter the code

OPERATION First enter your right password by using number key 0 to 9 If your password is right LED L2 glows and relay is energized For code change enter your old password and push code change key sw10 LED L3 will glows now enter new code

LED INDICATOR L1 - LED used for power indicator L2 - relay status indicator L3 - this LED will glow when you want to change code L4 - this LED will glow when wrong password is entering for five times serially

TECHANICAL FEATURE Up to 32 digits password can be accepted Battery backup facility is provided Password can be changed at any time MasterSlave password facility Wrong password indication

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 5

5 PART LIST FOR CODE LOCK

Resistors R1 to R4 R8 330 Ω orange brown golden R5 8K2 Ω grey red red golden R6R7R9R10 1kΩ brown black red golden RN1 RN2 10K resistor network 9 pin Capacitors CD1CD2 33PF ceramic disc C3 10 uF 25v electrolyte capacitor C4C6 100KPF -104-01 uF ceramic disc C5 1000uF16v25v electrolyte capacitor C7 100uF 16v electrolyte capacitor Semiconductor U1 AT89c5152 micro controller U2U3 SN74LS 373 U4 LM7805 +5v regulator IC Q1Q3 BC547 NPN transistor Q2Q4 BC 548 NPN transistor L1L4L5 red LED 5mm L3 green LED L2 yellow LED D1 to D4 1N4007 rectifier diode Miscellaneous IC socket 40 pin 1 20 pin 2 X1 110592 crystal oscillator Switch 1 to13 3 leg tactile switch reset 2 leg switcj Relay 12 v 1CO PCB mount relay CN2 3 pin burgsstrip with jumper switch Buzzer continuous type Transformer 12v 500mA Two Pencil cell 15 v for dc motor Cell container Plywood Dc motor drive for door lock Main cord 2pin main cord for 230v ac power

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 6

RESISTORS

Example Circuit symbol

Function

Resistors restrict the flow of electric current for example a resistor is placed in series with a

light-emitting diode (LED) to limit the current passing through the LED

CAPACITORS The capacitors function is to store electricity or electrical energy The capacitor also functions

as a filter passing alternating current (AC) and blocking direct current (DC)

This symbol is used to indicate a capacitor in a circuit diagram The capacitor is

constructed with two electrode plates facing each other but separated by an insulator

When DC voltage is applied to the capacitor an electric charge is stored on each electrode While the capacitor is charging up current flows The current will stop flowing when the capacitor has fully charged

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 7

DIODES

Example Circuit symbol

Function

Diodes allow electricity to flow in only one direction The arrow of the circuit symbol shows the

direction in which the current can flow Diodes are the electrical version of a valve and early

diodes were actually called valves

Light Emitting Diodes (LEDs)

Example Circuit symbol

Function

LEDs emit light when an electric current passes through them

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 4: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 4

4 PROJECT DESCRIPTION

MICRO CONTROLLER A Micro controller is used for controlling entire circuits and to maintain timings Here a micro controller named AT89c51 from Atmel Corporation is used for that purpose AT89c51 is an bit micro controller has 40 pins arranged in 4 IO ports that ports are used here for connecting to interface with the load Micro controllerrsquos RESET pin is connected to an RC circuit as shown in above figure This will give a high pulse to the RESET pin at time of starting This will reset the micro controller means start execution from 0000h It is essential for a micro controller circuit When the power is switched ON charge in capacitor will be zero then the reset pin will get high voltage capacitor starts charging then the voltage across the RST pin will decrease micro controller starts execution

KEY PAD

In code lock circuit keypad is made using 12paces of micro switches sw1 to sw9 is used for enter 0to 9 numbers Sw10 is used for code change sw11 is used for enter the code

OPERATION First enter your right password by using number key 0 to 9 If your password is right LED L2 glows and relay is energized For code change enter your old password and push code change key sw10 LED L3 will glows now enter new code

LED INDICATOR L1 - LED used for power indicator L2 - relay status indicator L3 - this LED will glow when you want to change code L4 - this LED will glow when wrong password is entering for five times serially

TECHANICAL FEATURE Up to 32 digits password can be accepted Battery backup facility is provided Password can be changed at any time MasterSlave password facility Wrong password indication

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 5

5 PART LIST FOR CODE LOCK

Resistors R1 to R4 R8 330 Ω orange brown golden R5 8K2 Ω grey red red golden R6R7R9R10 1kΩ brown black red golden RN1 RN2 10K resistor network 9 pin Capacitors CD1CD2 33PF ceramic disc C3 10 uF 25v electrolyte capacitor C4C6 100KPF -104-01 uF ceramic disc C5 1000uF16v25v electrolyte capacitor C7 100uF 16v electrolyte capacitor Semiconductor U1 AT89c5152 micro controller U2U3 SN74LS 373 U4 LM7805 +5v regulator IC Q1Q3 BC547 NPN transistor Q2Q4 BC 548 NPN transistor L1L4L5 red LED 5mm L3 green LED L2 yellow LED D1 to D4 1N4007 rectifier diode Miscellaneous IC socket 40 pin 1 20 pin 2 X1 110592 crystal oscillator Switch 1 to13 3 leg tactile switch reset 2 leg switcj Relay 12 v 1CO PCB mount relay CN2 3 pin burgsstrip with jumper switch Buzzer continuous type Transformer 12v 500mA Two Pencil cell 15 v for dc motor Cell container Plywood Dc motor drive for door lock Main cord 2pin main cord for 230v ac power

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 6

RESISTORS

Example Circuit symbol

Function

Resistors restrict the flow of electric current for example a resistor is placed in series with a

light-emitting diode (LED) to limit the current passing through the LED

CAPACITORS The capacitors function is to store electricity or electrical energy The capacitor also functions

as a filter passing alternating current (AC) and blocking direct current (DC)

This symbol is used to indicate a capacitor in a circuit diagram The capacitor is

constructed with two electrode plates facing each other but separated by an insulator

When DC voltage is applied to the capacitor an electric charge is stored on each electrode While the capacitor is charging up current flows The current will stop flowing when the capacitor has fully charged

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 7

DIODES

Example Circuit symbol

Function

Diodes allow electricity to flow in only one direction The arrow of the circuit symbol shows the

direction in which the current can flow Diodes are the electrical version of a valve and early

diodes were actually called valves

Light Emitting Diodes (LEDs)

Example Circuit symbol

Function

LEDs emit light when an electric current passes through them

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 5: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 5

5 PART LIST FOR CODE LOCK

Resistors R1 to R4 R8 330 Ω orange brown golden R5 8K2 Ω grey red red golden R6R7R9R10 1kΩ brown black red golden RN1 RN2 10K resistor network 9 pin Capacitors CD1CD2 33PF ceramic disc C3 10 uF 25v electrolyte capacitor C4C6 100KPF -104-01 uF ceramic disc C5 1000uF16v25v electrolyte capacitor C7 100uF 16v electrolyte capacitor Semiconductor U1 AT89c5152 micro controller U2U3 SN74LS 373 U4 LM7805 +5v regulator IC Q1Q3 BC547 NPN transistor Q2Q4 BC 548 NPN transistor L1L4L5 red LED 5mm L3 green LED L2 yellow LED D1 to D4 1N4007 rectifier diode Miscellaneous IC socket 40 pin 1 20 pin 2 X1 110592 crystal oscillator Switch 1 to13 3 leg tactile switch reset 2 leg switcj Relay 12 v 1CO PCB mount relay CN2 3 pin burgsstrip with jumper switch Buzzer continuous type Transformer 12v 500mA Two Pencil cell 15 v for dc motor Cell container Plywood Dc motor drive for door lock Main cord 2pin main cord for 230v ac power

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 6

RESISTORS

Example Circuit symbol

Function

Resistors restrict the flow of electric current for example a resistor is placed in series with a

light-emitting diode (LED) to limit the current passing through the LED

CAPACITORS The capacitors function is to store electricity or electrical energy The capacitor also functions

as a filter passing alternating current (AC) and blocking direct current (DC)

This symbol is used to indicate a capacitor in a circuit diagram The capacitor is

constructed with two electrode plates facing each other but separated by an insulator

When DC voltage is applied to the capacitor an electric charge is stored on each electrode While the capacitor is charging up current flows The current will stop flowing when the capacitor has fully charged

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 7

DIODES

Example Circuit symbol

Function

Diodes allow electricity to flow in only one direction The arrow of the circuit symbol shows the

direction in which the current can flow Diodes are the electrical version of a valve and early

diodes were actually called valves

Light Emitting Diodes (LEDs)

Example Circuit symbol

Function

LEDs emit light when an electric current passes through them

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 6: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 6

RESISTORS

Example Circuit symbol

Function

Resistors restrict the flow of electric current for example a resistor is placed in series with a

light-emitting diode (LED) to limit the current passing through the LED

CAPACITORS The capacitors function is to store electricity or electrical energy The capacitor also functions

as a filter passing alternating current (AC) and blocking direct current (DC)

This symbol is used to indicate a capacitor in a circuit diagram The capacitor is

constructed with two electrode plates facing each other but separated by an insulator

When DC voltage is applied to the capacitor an electric charge is stored on each electrode While the capacitor is charging up current flows The current will stop flowing when the capacitor has fully charged

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 7

DIODES

Example Circuit symbol

Function

Diodes allow electricity to flow in only one direction The arrow of the circuit symbol shows the

direction in which the current can flow Diodes are the electrical version of a valve and early

diodes were actually called valves

Light Emitting Diodes (LEDs)

Example Circuit symbol

Function

LEDs emit light when an electric current passes through them

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 7: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 7

DIODES

Example Circuit symbol

Function

Diodes allow electricity to flow in only one direction The arrow of the circuit symbol shows the

direction in which the current can flow Diodes are the electrical version of a valve and early

diodes were actually called valves

Light Emitting Diodes (LEDs)

Example Circuit symbol

Function

LEDs emit light when an electric current passes through them

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 8: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 8

6 MAJOR COMPONENTS OF CODE LOCK

A Key pad

In access control system circuit keypad is made using 12 pcs Of micro switches sw1 to sw10 is

using for 0-9 numbersw10 is used for code changessw11 is usesd for enter the code When

this all this keys at logic high no key is pressed and when any of pin output goes low the two of

output is made logic high and even then if the input pin remains low then the key of the column

which is not made high is pressed In this way key board is sensed by the microcontroller

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 9: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 9

B REGULATOR IC 7805

It is a 3 terminal positive voltages regulator This is used to make the stable voltage of +5v for MCU the lm7805 is three terminal positive regulator are available in the TO220 $ T03 package and with several fixed output voltage making them useful in a wide range of applications Each type of employs internal current limiting thermal shutdown and save operating area protection making it essentially indestructible If adequate heat sinking is provided they can deliver over 1A output current Al through designed primarily as fixed voltage regulators For more information please refer data sheet of LM7805 PIN DIAGRAM

PIN DISCRIPTION

PIN NO FUNCTION NAME

1 Input voltage (5V-18V) input

2 Ground (0 V) ground

3 Regulated output 5V (48V-52V) output

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 10: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 10

C POWER SUPPLY-

Power supply is used to drive the circuit Inappropriate voltage will damage the entire circuitry therefore it constitutes a very important part of the circuit Every electronic circuit requires power for its operation Every function simple or complex is controlled by the power supply Even a little variation in voltage can damage all the circuitry So power supply is of prime importance in all the circuits The power supply which we get is ac operating at 220VoltsBut as our electronic circuits work only on dc therefore we cannot employ direct usage of supply which we get In order to overcome this we require various process namely transformation rectification smoothing or filtering and regulation These entire process using bridge rectifiers are illustrated below

Bridge rectifier is use to convert 12 AC into 12 DC voltage Two supply voltage are for the circuit A 12V AC from transformer is connected to bridge rectifier (D1-D4)All ICs are supplied with a regulator 5v from a LM7805 Fixed voltage regulator The unregulated voltage of approximately 12V is required for the relay driving circuit

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 11: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 11

TRANSFORMATION-

As already discussed the supply which we get is 220V AC supply In order to decrease the

magnitude of the voltage we make use of step down transformer This transformer has more

windings in the primary coil than in the secondary coil So the voltage output at the secondary

is an AC supply with magnitude less than 220V as shown below

RECTIFICATION-

As all the electronic circuits work on DC therefore this low voltage AC cannot be directly fed to

our circuit Thus a process of rectification is required In this process AC voltage is converted

into DC voltage using two semiconductor rectifying diodes as shown below

Now as the two diodes D1 and D2 are connected in the opposite manner Therefore one of the

diode gets forward biased during the positive half of the ac input and other gets forward

biased during the negative half of the ac input Thus during the positive half cycle rectification

takes place through diode D1(diode D2 being reverse biased cannot rectify) and during the

negative half cycle the rectification takes place through the diode D2(diode D1 being reverse

biased cannot rectify) But as at least one of the diode always remain in the conducting mode

therefore both the halves of the ac input gets rectified and hence the name full wave rectifier

SMOOTHINGFILTRATION

The output of the rectification process is a varying DC As the DC waveform cannot be varying

so it means that rectification is not 100 efficient due to which there is still some component of

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 12: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 12

the input AC present in the DC voltage which is responsible for the variation So in order to

remove this AC component we require filtration or smoothing of the signal This can be done

using an electrolytic capacitor of 2200uf As the capacitor offers infinite impedance to the DC

signal and Zero impedance to the AC signal therefore it allows the AC component to pass

through and blocks the DC component This means it will filter out the DC component from

the input signal Thus the output of the process will be a pure DC supply as shown below

Now there is still some variation indicating that output DC voltage is not having constant

magnitude This is due to the capacitor used for filtration Its time of charging and discharging

are not equal due to which the filtration is not up to the mark For making the output voltage

assume a constant value we need a voltage regulator

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 13: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 13

REGULATION-

Voltage regulator is used for this purpose mainly from the series of 78- - of the transistor For

getting the constant output of 5 volts we make use of 7805 voltage regulator This process

takes place as shown below

This completes all the processes Now we have a constant DC supply with us which can be fed

to any electronic circuit without any problem

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 14: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 14

D RELAY AND BUZZER CIRCUIT

RELAY-

A relay is an electrically operated switch Many relays use an electromagnet to operate a switching mechanism but other operating principles are also used Relays find applications where it is necessary to control a circuit by a low-power signal or where several circuits must be controlled by one signal The first relays were used in long distance telegraph circuits repeating the signal coming in from one circuit and re-transmitting it to another Relays found extensive use in telephone exchanges and early computers to perform logical operations A type of relay that can handle the high power required to directly drive an electric motor is called a contactor Solid-state relays control power circuits with no moving parts instead using a semiconductor device triggered by light to perform switching Relays with calibrated operating characteristics and sometimes multiple operating coils are used to protect electrical circuits from overload or faults in modern electric power systems these functions are performed by digital instruments still called protection relays

Relay Symbol

A relay is an electrically operated switch Current flowing through the coil of the relay creates a

magnetic field which attracts a lever and changes the switch contacts The coil current can be

on or off so relays have two switch positions and most have double throw (changeover) switch

contacts as shown in the diagram

Relays allow one circuit to switch a second circuit which can be completely separate from the

first For example a low voltage battery circuit can use a relay to switch a 230V AC mains circuit

There is no electrical connection inside the relay between the two circuits the link is magnetic

and mechanical

The coil of a relay passes a relatively large current typically 30mA for a 12V relay but it can be as much as 100mA for relays designed to operate from lower voltages Most ICs (chips) cannot

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 15: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 15

provide this current and a transistor is usually used to amplify the small IC current to the larger value required for the relay coil The maximum output current for the popular 555 timer IC is 200mA so these devices can supply relay coils directly without amplification Relays are usually SPDT or DPDT but they can have many more sets of switch contacts for example relays with 4 sets of changeover contacts are readily available For further information about switch contacts and the terms used to describe them please see the page on switches

Relay inner view of coil and switch contacts

Most relays are designed for PCB mounting but you can solder wires directly to the pins

providing you take care to avoid melting the plastic case of the relay The suppliers catalogue

should show you the relays connections The coil will be obvious and it may be connected

either way round Relay coils produce brief high voltage spikes when they are switched off and

this can destroy transistors and ICs in the circuit To prevent damage you must connect a

protection diode across the relay coil The animated picture shows a working relay with its coil

and switch contacts You can see a lever on the left being attracted by magnetism when the coil

is switched on This lever moves the switch contacts There is one set of contacts (SPDT) in the

foreground and another behind them making the relay DPDT

The relays switch connections are usually labeled COM NC and NO

COM = Common always connect to this it is the moving part of the switch

NC = Normally Closed COM is connected to this when the relay coil is off

NO = Normally Open COM is connected to this when the relay coil is on

Connect to COM and NO if you want the switched circuit to be on when the relay coil is

on

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 16: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 16

Connect to COM and NC if you want the switched circuit to be on when the relay coil is off

RELAY AND BUZZER DRIVER CIRCUIT

A SPDT relay is connected to pin 22 of the microcontroller through a driver transistor and

buffer IC The relay required 12volt at a current of the around 50mA which cannot provide by

the micro controller so the driver transistors are added the relay is used to operate the

external siren or for operating any other electrical device Normally the relay remains off As

soon as pin 22 of the micro controller goes high the transistors turn on and the relay operates

FIGURE FROM XEROX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 17: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 17

E AT89C5152 MICRO CONTROLLER

Features

bull Compatible with MCS-51trade Products

bull 4K Bytes of In-System Reprogrammable Flash Memory

ndash Endurance 1000 WriteErase Cycles

bull Fully Static Operation 0 Hz to 24 MHz

bull Three-Level Program Memory Lock

bull 128 x 8-Bit Internal RAM

bull 32 Programmable IO Lines

bull Two 16-Bit TimerCounters

bull Six Interrupt Sources

bull Programmable Serial Channel

bull Low Power Idle and Power Down Modes

Description

The AT89C51 is a low-power high-performance CMOS 8-bit microcomputer with 4K bytes of

Flash Programmable and Erasable Read Only Memory (PEROM) The device is manufactured

using Atmelrsquos high density nonvolatile memory technology and is compatible with the industry

standard MCS-51trade instruction set and pin out The on-chip Flash allows the program memory

to be reprogrammed in-system or by a conventional nonvolatile memory programmer By

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 18: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 18

combining a versatile 8-bit CPU with Flash on a monolithic chip the Atmel AT89C51 is a

powerful microcomputer which provides a highly flexible and cost effective solution to many

embedded control applications

PIN CONFIGURATION

FIGURE FROM XEREX

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 19: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 19

BLOCK DIAGRAM

The AT89C51 provides the following standard features 4K bytes of Flash 128 bytes of RAM 32

IO lines two 16-bit timercounters a five vector two-level interrupt architecture a full duplex

serial port on-chip oscillator and clock circuitry In addition the AT89C51 is designed with static

logic for operation down to zero frequency and supports two software selectable power saving

modes The Idle Mode stops the CPU while allowing the RAM timercounters serial port and

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 20: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 20

interrupt system to continue functioning The Power Down Mode saves the RAM contents but

freezes the oscillator disabling all other chip functions until the next hardware reset

PIN DESCRIPTION

VCC

Supply voltage

GND

Ground

Port 0

Port 0 is an 8-bit open drain bidirectional IO port As an output port each pin can sink eight TTL

inputs When 1s are written to port 0 pins the pins can be used as high impedance inputs Port

0 may also be configured to be the multiplexed loworder addressdata bus during accesses to

external program and data memory In this mode P0 has internal pullups Port 0 also receives

the code bytes during Flash programming and outputs the code bytes during program

verification External pullups are required during program verification

Port 1

Port 1 is an 8-bit bidirectional IO port with internal pull ups The Port 1 output buffers can

sinksource four TTL inputs When 1s are written to Port 1 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 1 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 1 also receives the low-

order address bytes during Flash programming and verification

Port 2

Port 2 is an 8-bit bidirectional IO port with internal pull ups The Port 2 output buffers can

sinksource four TTL inputs When 1s are written to Port 2 pins they are pulled high by the

internal pull ups and can be used as inputs As inputs Port 2 pins that are externally being

pulled low will source current (IIL) because of the internal pull ups Port 2 emits the high-order

address byte during fetches from external program memory and during accesses to external

data memory that use 16-bit addresses (MOVX DPTR) In this application it uses strong

internal pull ups when emitting 1s During accesses to external data memory that use 8-bit

addresses (MOVX RI) Port 2 emits the contents of the P2 Special Function Register Port 2

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 21: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 21

also receives the high-order address bits and some control signals during Flash programming

and verification

Port 3

Port 3 is an 8-bit bidirectional IO port with internal pullups The Port 3 output buffers can

sinksource four TTL inputs When 1s are written to Port 3 pins they are pulled high by the

internal pullups and can be used as inputs As inputs Port 3 pins that are externally being

pulled low will source current (IIL) because of the pullups

Port 3 also serves the functions of various special features of the AT89C51 as listed below

RST

Reset input A high on this pin for two machine cycles while the oscillator is running resets the

device

ALEPROG

Address Latch Enable output pulse for latching the low byte of the address during accesses to

external memory This pin is also the program pulse input (PROG) during Flash programming In

normal operation ALE is emitted at a constant rate of 16 the oscillator frequency and may be

used for external timing or clocking purposes Note however that one ALE pulse is skipped

during each access to external Data Memory If desired ALE operation can be disabled by

setting bit 0 of SFR location 8EH With the bit set ALE is active only during a MOVX or MOVC

instruction Otherwise the pin is weakly pulled high Setting the ALE-disable bit has no effect if

the microcontroller is in external execution mode

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 22: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 22

PSEN

Program Store Enable is the read strobe to external program memory When the AT89C51 is

executing code from external program memory PSEN is activated twice each machine cycle

except that two PSEN activations are skipped during each access to external data memory

EAVPP

External Access Enable EA must be strapped to GND in order to enable the device to fetch code

from external program memory locations starting at 0000H up to FFFFH Note however that if

lock bit 1 is programmed EA will be internally latched on reset EA should be strapped to VCC

for internal program executions This pin also receives the 12-volt programming enable voltage

(VPP) during Flash programming for parts that require 12-volt VPP

XTAL1

Input to the inverting oscillator amplifier and input to the internal clock operating circuit

XTAL2

Output from the inverting oscillator amplifier

Oscillator Characteristics

XTAL1 and XTAL2 are the input and output respectively of an inverting amplifier which can be

configured for use as an on-chip oscillator as shown in Figure 1 Either a quartz crystal or

ceramic resonator may be used To drive the device from an external clock source XTAL2

should be left unconnected while XTAL1 is driven as shown in Figure 2 There are no

requirements on the duty cycle of the external clock signal since the input to the internal

clocking circuitry is through a divide-by-two flip flop but minimum and maximum voltage high

and low time specifications must be observed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 23: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 23

Idle Mode

In idle mode the CPU puts itself to sleep while all the on chip peripherals remain active The

mode is invoked by software The content of the on-chip RAM and all the special functions

registers remain unchanged during this mode The idle mode can be terminated by any enabled

interrupt or by a hardware reset It should be noted that when idle is terminated by a hard

ware reset the device normally resumes program execution from where it left off up to two

machine cycles before the internal reset algorithm takes control On-chip hardware inhibits

access to internal RAM in this event but access to the port pins is not inhibited To eliminate

the possibility of an unexpected write to a port pin when Idle is terminated by

Reset the instruction following the one that invokes Idle should not be one that writes to a

port pin or to external memory

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 24: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 24

7 SN74LS373 IC

The SN74LS373 consists of eight latches with 3-state outputs for bus organized system applications The flip-flops appear transparent to the data (data changes asynchronously) when Latch Enable (LE) is HIGH When LE is LOW the data that meets the setup times is latched Data appears on the bus when the Output Enable (OE) is LOW When OE is HIGH the bus output is in the high impedance state The SN74LS374 is a high-speed low-power Octal D-type Flip-Flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus oriented applications A buffered Clock (CP) and Output Enable (OE) is common to all flip-flops The SN74LS374 is manufactured using advanced Low Power Schottky technology and is compatible with all ON Semiconductor TTL families

-State Outputs for Bus Interfacing

-Triggered D-Type Inputs

-Triggered Clock

igh Speed Termination Effects

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 25: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 25

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 26: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 26

8 FABRICATION OF PCB

The PCB must be fabricated first Then the components are soldered carefully to PCB We should keep in mind that the quality of soldering affects the quality of output The procedure for fabricating the PCB for setting up the circuit of any multi purpose project is described below PCB LAYOUT

PCB MAKING Making of Printed Circuits Boards (PCBs) is as much as art on a technique particularly so when they are to fabricated in very small numbers There are several ways of drawing PCB patterns and making the final boards The making of PCB patterns and making PCB essentially involves two steps

1 Preparing the PCB drawing and 2 Fabricating the PCB itself from the drawing

The traditional method of drawing with complete placement of parts taking a photographic negative of the drawing developing the image of negative formed on photo sensitized copper plate and dissolving the excess copper by itching is a standard practice being followed in large scale operations However for small-scale operations where large numbers of copies are not required the cost saving procedure presented here may be adopted

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 27: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 27

PCB DRAWING

Making of PCB drawing involves some preliminary considerations such as placement of components on a piece of paper Locating holes deciding the diameters of various holes the optimum area of each components should occupy the shape and location lands for connecting two or more components at a place full space utilization and prevention of over crowding of components at a particular place There is no other way to arrive at the conclusion than by trial and error For anchoring leads of component 1mm diameter holes and for fixing PCB holding screws to the 3mm diameter holes can be made Following these hints a sketch of PCB is made PCB FABRICATION The copper clad PCB laminate is now prepared by rubbing away the oxide grease etc With fine emery paper or sand paper on this the final PCB drawing may be traced by using a carbon paper Clips are used to prevent the carbon paper from slipping while PCB pattern is being traced on the laminate Only the connecting lines in PCBs slants and holes should be traced The components position can be marked on the PCBs reverse side if desired

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 28: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 28

The marked holes in PCB may be drilled using 1mm or 3mm drill bits and the traced PCB pattern created with black quick drilling enamel paint using a thin brush or a small metal case In case if there is any shorting of lines due to spilling of paint there may be removed by scrapping with a blade or knife after the paint has dried

After drying 20-30gms of Ferric chloride in 75ml of water may be heated to about 60deg and over the PCBs placed with its copper side upwards in a plastic tray Stirring the solution helps speedy etching The dissolution of unwanted copper would take about 45 minutes

If etching takes longer the solution may be heated again and the process is repeated The paint on the pattern can be removed by rubbing with a rag soaked in thinner turpentine or acetone The PCB may then be washed and dried

Depending on the wiring diagram the resistors are taken care at first and then the ICs are soldered

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 29: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 29

SOLDERING

Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal into the joint the filler metal having a relatively low melting point Soft soldering is characterized by the melting point of the filler metal which is below 400 degC (800 degF) The filler metal used in the process is called solder

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal it is distinguished from welding by the base metals not being melted during the joining process In a soldering process heat is applied to the parts to be joined causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action After the metal cools the resulting joints are not as strong as the base metal but have adequate strength electrical conductivity and water-tightness for many uses Soldering is an ancient technique mentioned in the Bible and there is evidence that it was employed up to 5000 years ago in Mesopotamia

Applications

One of the most frequent applications of soldering is assembling electronic components to printed circuit boards (PCBs) Another common application is making permanent but reversible connections between copper pipes in plumbing systems Joints in sheet metal objects such as food cans roof flashing rain gutters and automobile radiators have also historically been

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 30: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 30

soldered and occasionally still are Jewelry components are assembled and repaired by soldering Small mechanical parts are often soldered as well Soldering is also used to join lead came and copper foil in stained glass work Soldering can also be used to affect a semi-permanent patch for a leak in a container cooking vessel

Solders

Soldering filler materials are available in many different alloys for differing applications In electronics assembly the eutectic alloy of 63 tin and 37 lead (or 6040 which is almost identical in performance to the eutectic) has been the alloy of choice Other alloys are used for plumbing mechanical assembly and other applications

A eutectic formulation has several advantages for soldering chief among these is the coincidence of the liquidus and solidus temperatures ie the absence of a plastic phase This allows for quicker wetting out as the solder heats up and quicker setup as the solder cools A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures Any differential movement during the plastic phase may result in cracks giving an unreliable joint Additionally a eutectic formulation has the lowest possible melting point which minimizes heat stress on electronic components during soldering

Lead-free solders are suggested anywhere children may come into contact (since children are likely to place things into their mouths) or for outdoor use where rain and other precipitation may wash the lead into the groundwater Common solder alloys are mixtures of tin and lead respectively

6337 melts at 183 degC (3614 degF) (eutectic the only mixture that melts at a point instead of over a range)

6040 melts between 183ndash190 degC (361ndash374 degF) 5050 melts between 185ndash215 degC (365ndash419 degF)

Lead-free solder alloys melt around 250 degC (482 degF) depending on their composition

For environmental reasons no-lead solders are becoming more widely used Unfortunately most no-lead solders are not eutectic formulations making it more difficult to create reliable joints with them See complete discussion below see also RoHS

Other common solders include low-temperature formulations (often containing bismuth) which are often used to join previously-soldered assemblies without un-soldering earlier connections and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations Specialty alloys are available with properties such as higher strength better electrical conductivity and higher corrosion resistance

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 31: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 31

Flux

In high-temperature metal joining processes (welding brazing and soldering) the primary purpose of flux is to prevent oxidation of the base and filler materials Tin-lead solder for example attaches very well to copper but poorly to the various oxides of copper which form quickly at soldering temperatures Flux is a substance which is nearly inert at room temperature but which becomes strongly reducing at elevated temperatures preventing the formation of metal oxides Secondarily flux acts as a wetting agent in the soldering process reducing the surface tension of the molten solder and causing it to better wet out the parts to be joined

Fluxes currently available include water-soluble fluxes (no VOCs required for removal) and no-clean fluxes which are mild enough to not require removal at all Performance of the flux needs to be carefully evaluated a very mild no-clean flux might be perfectly acceptable for production equipment but not give adequate performance for a poorly-controlled hand-soldering operation

Traditional rosin fluxes are available in non-activated (R) mildly activated (RMA) and activated (RA) formulations RA and RMA fluxes contain rosin combined with an activating agent typically an acid which increases the wettability of metals to which it is applied by removing existing oxides The residue resulting from the use of RA flux is corrosive and must be cleaned off the piece being soldered RMA flux is formulated to result in a residue which is not significantly corrosive with cleaning being preferred but optional

BASIC SOLDERING TECHNIQUES

Methods

Soldering operations can be performed with hand tools one joint at a time or en masse on a production line Hand soldering is typically performed with a soldering iron soldering gun or a torch or occasionally a hot-air pencil Sheetmetal work was traditionally done with soldering coppers directly heated by a flame with sufficient stored heat in the mass of the soldering copper to complete a joint torches or electrically-heated soldering irons are more convenient All soldered joints require the same elements of cleaning of the metal parts to be joined fitting up the joint heating the parts applying flux applying the filler removing heat and holding the assembly still until the filler metal has completely solidified Depending on the nature of flux material used cleaning of the joints may be required after they have cooled

The distinction between soldering and brazing is arbitrary based on the melting temperature of the filler material A temperature of 450 degC is usually used as a practical cut-off Different equipment andor fixturing is usually required since (for instance) a soldering iron generally cannot achieve high enough temperatures for brazing Practically speaking there is a significant difference between the two processesmdashbrazing fillers have far more structural strength than solders and are formulated for this as opposed to maximum electrical conductivity Brazed

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 32: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 32

connections are often as strong or nearly as strong as the parts they connect even at elevated temperatures

Hard soldering or silver soldering (performed with high-temperature solder containing up to 40 silver) is also often a form of brazing since it involves filler materials with melting points in the vicinity of or in excess of 450 degC Although the term silver soldering is used much more often than silver brazing it may be technically incorrect depending on the exact melting point of the filler in use In silver soldering (hard soldering) the goal is generally to give a beautiful structurally sound joint especially in the field of jewelry Thus the temperatures involved and the usual use of a torch rather than an iron would seem to indicate that the process should be referred to as brazing rather than soldering but the endurance of the soldering apellation serves to indicate the arbitrary nature of the distinction (and the level of confusion) between the two processes

Induction soldering is a process which is similar to brazing The source of heat in induction soldering is induction heating by high-frequency AC current Generally copper coils are used for the induction heating This induces currents in the part being soldered The coils are usually made of copper or a copper base alloy The copper rings can be made to fit the part needed to be soldered for precision in the work piece Induction soldering is a process in which a filler metal (solder) is placed between the faying surfaces of (to be joined) metals The filler metal in this process is melted at a fairly low temperature Fluxes are a common use in induction soldering This is a process which is particularly suitable for soldering continuously The process is usually done with coils that wrap around a cylinderpipe that needs to be soldered Some metals are easier to solder than others Copper silver and gold are easy Iron and nickel are found to be more difficult Because of their thin strong oxide films stainless steel and aluminum are a little more difficult Titanium magnesium cast irons steels ceramics and graphites can be soldered but it involves a process similar to joining carbides They are first plated with a suitable metallic element that induces interfacial bonding

DESOLDERING AND RESOLDERING

Used solder contains some of the dissolved base metals and is unsuitable for reuse in making new joints Once the solders capacity for the base metal has been achieved it will no longer properly bond with the base metal usually resulting in a brittle cold solder joint with a crystalline appearance

It is good practice to remove solder from a joint prior to resolderingmdashdesoldering braids or vacuum desoldering equipment (solder suckers) can be used Desoldering wicks contain plenty of flux that will lift the contamination from the copper trace and any device leads that are present This will leave a bright shiny clean junction to be resoldered

The lower melting point of solder means it can be melted away from the base metal leaving it mostly intact though the outer layer will be tinned with solder Flux will remain which can easily be removed by abrasive or chemical processes This tinned layer will allow solder to flow

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 33: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 33

into a new joint resulting in a new joint as well as making the new solder flow very quickly and easily

Common tools

Hand-soldering tools include the electric soldering iron which has a variety of tips available ranging from blunt to very fine to chisel heads for hot-cutting plastics and the soldering gun which typically provides more power giving faster heat-up and allowing larger parts to be soldered Hot-air guns and pencils allow rework of component packages which cannot easily be performed with irons and guns

Soldering torches are a type of soldering device that uses a flame rather than a soldering iron tip to heat solder Soldering torches are often powered by butane[3] and are available in sizes ranging from very small butaneoxygen units suitable for very fine but high-temperature jewelry work to full-size oxy-fuel torches suitable for much larger work such as copper piping

A soldering copper is a tool with a large copper head and a long handle which is heated in a blacksmiths forge fire and used to apply heat to sheet metal for soldering Soldering coppers are sometimes used in auto bodywork although body solder has been mostly superseded by non-metallic fillers

Toaster ovens and hand held infrared lights have been used to reproduce production processes on a much smaller scale

Bristle brushes are usually used to apply plumbing paste flux For electronic work flux-core solder is generally used but additional flux may be used from a flux pen or dispensed from a small bottle with a syringe-like needle

Wire brush wire wool and emery cloth are commonly used to prepare plumbing joints for connection Electronic joints rarely require mechanical cleaning

For PCB assembly and rework alcohol and acetone are commonly used with cotton swabs or bristle brushes to remove flux residue A heavy rag is usually used to remove flux from a plumbing joint before it cools and hardens A fiberglass brush can also be used

For electronic work solder wick and vacuum-operated solder sucker are used to undo solder connections

A heat sink such as a crocodile clips can also be used to prevent damaging heat-sensitive components while soldering

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 34: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 34

SOLDERING TOOLS

The only tools that are essential to solder are a soldering iron and some solder There are however lots of soldering accessories available (see soldering accessories for more information)

Different soldering jobs will need different tools and different temperatures too For circuit board work you will need a finer tip a lower temperature and finer grade solder You may also want to use a magnifying glass Audio connectors such as XLRs will require a larger tip higher temperature and thicker solder Clamps and holders are also handy when soldering audio cables

Soldering Irons

There are several things to consider when choosing a soldering iron

Wattage adjustable or fixed temperature power source (electric or gas) portable or bench use

I do not recommend soldering guns as these have no temperature control and can get too hot This can result in damage to circuit boards melt cable insulation and even damage connectors

Wattage

It is important to realise that higher wattage does not necessarily mean hotter soldering iron Higher wattage irons just have more power available to cope with bigger joints A low wattage iron may not keep its temperature on a big joint as it can loose heat faster than it can reheat itself Therefore smaller joints such as circuit boards require a lesser wattage iron - around 15-30 watts will be fine Audio connectors need something bigger - I recommend 40 watts at least

Temperature

There are a lot of cheap low watt irons with no temperature control available Most of these are fine for basic soldering but if you are going to be doing a lot you may want to consider a variable temperature soldering iron Some of these simply have a boost button on the handle which is useful with larger joints others have a thermostatic control so you can vary the heat of the tip

If you have a temperature controlled iron you should start at about 315-345degC (600-650degF) You may want to increase this however - I prefer about 700-750degF Use a temperature that will allow you to complete a joint in 1 to 3 seconds

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 35: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 35

Power

Most soldering irons are mains powered - either 110230v AC or benchtop soldering stations which transform down to low voltage DC Also available are battery and gas powered These are great for the toolbox but youll want a plug in one for your bench Gas soldering irons loose their heat in windy outside conditions more easily that a good high wattage mains powered iron

Portability

Most cheaper soldering irons will need to plug into the mains This is fine a lot of the time but if there is no mains socket around you will need another solution Gas and battery soldering irons are the answer here They are totally portable and can be taken and used almost anywhere They may not be as efficient at heating as a good high wattage iron but they can get you out of a lot of hassle at times If you have a bench setup you should consider using a soldering station These usually have a soldering iron and desoldering iron with heatproof stands variable heat and a place for a cleaning pad A good solder station will be reliable accurate with its temperature and with a range of tips handy it can perform any soldering task you attempt with it

Solder

The most commonly used type of solder is rosin core The rosin is flux which cleans as you solder The other type of solder is acid core and unless you are experienced at soldering you should stick to rosin core solder Acid core solder can be tricky and better avoided for the beginner Rosin core solder comes in three main types - 5050 6040 and 6337 These numbers represent the amount of tin and lead are present in the solderas shown below

Solder Type Tin Lead Melting Temp (degF)

5050 50 50 425

6040 60 40 371

6337 63 37 361

Any general purpose rosin core solder will be fine

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 36: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 36

SOLDERING ACCESSORIES

Soldering Iron Tips

Try to use the right size tip whenever you can Smaller wires and circuit boards require small fine tips and mic cable onto an XLR would need a larger tip You can get pointed tips or flat tipped ones (sometimes called spade tips) If you have a solder station with a desolderer you will also want a range of desoldering tips and cleaners

Soldering Iron Stands

These are handy to use if you are doing several or more joints It is a heat resistant cradle for your iron to sit in so you dont have to lie it down on the bench while it is hot It really is essential if you are planning to do a lot of bench soldering as it is only a matter of time before you burn something (probably your elbow resting on the hot tip) if you dont use one

Clamps

I strongly recommend clamps of some sort Trying to hold your soldering iron the solder and the wire is tricky enough but when you have to hold the connector as well it is almost impossible The are however adjustable clamps that can be manipulated to hold both the connector and the wire in place so you still have two free hands to apply the heat and the solder These are cheap items and I know mine have paid for themselves many times over

Magnifying glass

If you are doing work on PCBs (printed circuit boards) you may need to get a magnifying glass This will help you see the tracks on the PCB and unless you have exceptional sight small chip resistors are pretty difficult to solder on well without a magnifying glass Once again they are not expensive and some clamps come with one that can mount on the clamp stand

Solder Wick

Solder wick is a mesh the you lie on a joint and heat When it heats up it also melts the solder which is drawn out of the joint It is usually used for cleaning up solder from tracks on a circuit board but you will need a solder sucker to clean out the holes in the circuit board

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 37: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 37

Place the wick on the solder you want to remove then put your soldering iron on top of the wick The wick will heat up then the solder will melt and flow away from the joint and into wick

Solder Suckers

If you dont have a solder station with desolderer and you work on PCBs you are going to need one of these before too long They are spring loaded and suck the melted solder out of the joint They are a bit tricky to use as you have to melt the solder with your iron then quickly position the solder sucker over the melted solder and release the spring to suck up the solder I find solder wick to be easier to use and more effective

Fume Extractors

Solder fumes are poisonous A fume extractor will suck the fumes (smoke) into itself and filter it An absolute must for your health if you are setting up a soldering bench

PREPARATION

Step 1 Preparation

If you are preparing the cable for a connector I strongly suggest you put any connector parts on now (the screw on part of an XLR or casing of a 14 jack for example) Get into the habit of sliding these on before you start on the cable or else you can bet it wont be long before you finish soldering your connector only to discover you forgot to put the connector casing on and have to start all over again

Once you have all the connector parts on that you need you will need to strip your cable This means removing the insulation from the end of the wire and exposing the copper core You can either use a wire stripper side cutters or a knife to do this

The obvious tool to choose to strip a wire would bea wire stripper There are many types of wire stripper and most of them work the same You simply put the wire in and squeeze it and pull the end bit off It will cut to a preset depth and if you have chosen the right depth it will cut the insulation off perfectly It is possible to choose the wrong depth and cut too deeply or too shallow but they are very easy to use

On the other hand some people (myself included) prefer to use a knife or side cutters I use side cutters for small cable and a Stanley knife for bigger cablesand although I have a couple

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 38: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 38

of wire strippers I havent used them for years This may seem odd but Ive got my side cutters and knife with me anyway and they do the job fine

If you are using side cutters (as shown here) position them about 10mm (12 inch) from the end and gently squeeze the cutters into the insulation to pierce it but not far enough to cut the copper strands of the core Open the cutters slightly so you can turn the wire and pierce the rest of the insulation You may have to do this a few times to cut through all of the insulation but it is better to cut too shallow and have to turn and cut again rather than cut the core and have to start again Now you should be able to slide the insulation off with your cutters or pull it off with your fingers This may sound a tedious method but in no time at all you will be able to do it in two cuts and a flick of the cutters

I wont explain how I use a knife to do larger cable as Id hate someone to slice a finger or thumb open following my instructions Using a sharp blade like that certainly does have its risks so stick with wire cutters or side cutters if you are at all unsure

If your connector has been used before make sure you remove any remnants of wire and solder from the contacts Do this by putting the tip of your soldering iron into the hole and flicking the solder out when it has melted Common Sense Alert Please be careful when you flick melted solderflick it away from you

TINNING

Step 2 Tinning

Whatever it is you are soldering you should tin both contacts before you attempt to solder them This coats or fills the wires or connector contacts with solder so you can easily melt them together

To tin a wire apply the tip of your iron to the wire for a second or two then apply the solder to the wire The solder should flow freely onto the wire and coat it (if its stranded wire the solder should flow into it and fill the wire) You may need to snip the end off afterwards particularly if you have put a little too much solder on and it has formed a little ball at the end of the wire

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 39: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 39

Be careful not to overheat the wire as the insulation will start to melt On cheaper cable the insulation can shrink back if heated too much and expose more copper core that you intended You can cut the wire back after you have tinned it but its best simply not to over heat it

The larger the copper core the longer it will take to heat up enough to draw the solder in so use a higher temperature soldering iron for larger cables if you can

To tin a contact on an audio XLR connector hold the iron on the outside of the the contact for a second or two then apply the solder into the cavity of the contact Once again the solder should flow freely and fill the contact Connectors such as jacks have contacts that are just holes in a flat part of the connector To tin these you put your iron on it and apply the solder to where the iron is touching The solder should flow and cover the hole

Once you have tinned both parts you are ready to solder them together

SOLDERING

Step 3 Soldering

This step can often be the easiest when soldering audio cables

You simply need to place your soldering iron onto the contact to melt the solder

When the solder in the contact melts slide the wire into the contact

Remove the iron and hold the wire still while the solder solidifies again

You will see the solder set as it goes hard

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 40: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 40

This should all take around 1-3 seconds

A good solder joint will be smooth and shiny If the joint is dull and crinkly the wire probably moved

during soldering If you have taken too long it will have have solder spikes

If it does not go so well you may find the insulation has melted or there is too much stripped wire showing If this is the case you should desolder the joint and start again

CLEANING YOUR SOLDERING IRON

You should clean your tip after each use There are many cleaning solutions and the cheapest (and some say best) is a damp sponge Just rub the soldering iron tip on it after each solder

Another option is to use tip cleaner This comes in a little pot that you push the tip into This works well if your tip hasnt been cleaned for a while It does create a lot of smoke so it is better not to let the tip get so dirty that you need to use tip cleaner

Some solder stations come with a little pad at the base of the holder If you have one of these you should get into the habit of wiping the tip on the pad each time you apply solder with it

If you need to clean solder off a circuit board solder wick is what you need You place the wick on the joint or track you want to clean up and apply your soldering iron on top The solder melts and is drawn into the wick If there is a lot of solder the wick will fill up so gently pull the wick through the joint and your iron and the solder will flow into it as it passes

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 41: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 41

Tips and Tricks

1 Melted solder flows towards heat 2 Most beginning solderers tend to use too much solder and heat the joint for too long 3 Dont move the joint until the solder has cooled 4 Keep your iron tip clean 5 Use the proper type of iron and tip size

TROUBLESHOOTING

If either of the parts you are soldering is dirty or greasy the solder wont take (or stick) to it Desolder the joint and clean the parts before trying again

Another reason the solder wont take is that it may not be the right sort of metal For example you cannot solder aluminium with leadtin solder

If the joint has been moved during soldering it may look grainy or dull It may also look like this if the joint was not heated properly while soldering

If the joint was overheated the solder will have formed a spike and there will be burnt flux residue

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 42: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 42

9 PROGRAM

ASM CODE

LJMP labe1 _11

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

MOV R7A

RETI

Labe1_1

LCALL Labe1_2

SJMP FEh

Labe1_2

MOV 1Dh 01h

CLR A

MOV 1BhA

MOV 1AhA

MOV 1Ch00h

CLR A

MOV 1EhA

MOV 17hA

MOV 16hA

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 19hA

MOV 18hA

MOV 0Ch40h

MOV 0DhE2h

MOV 0Eh14h

MOV 0Fh0Ah

SETB A0h

SETB A1h

SETB A2h

SETB A3h

SETB A4h

SETB A5h

SETB A6h

SETB A7h

SETB B0h

SETB B2h

SETB B7h

Labe1_3

LCALL Labe1_4

JB B4h07h

CLR A

MOV 1BhA

MOV 1AhA

SJMP 06h

CLR A

MOV 1BhA

MOV 1Ah01h

JB B3h42h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 0Ah

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 10h

CLR A

MOV 0BhA

MOV 0AhA

LCALL Labe1_5

MOV DPTR07D0h

LCALL Labe1_7

SJMP 06h

CLR A

MOV 19hA

MOV 18h01h

JNB B3h21h

MOV A18h

CJNE

A01h04h

MOV A19h

JZ 02h

SJMP 16h

INC 1Dh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 43: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 43

CLR C

MOV A05h

SUBB A1Dh

JNC 03h

LCALL Labe1_6

CLR A

MOV 19hH

MOV 18hA

CLR A

MOV 0BhA

MOV 0AhA

JB B1h6Bh

MOV A16h

JNZ 04h

MOV A17h

JZ 02h

SJMP 61h

MOV A0Ah

CLR C

SUBB A0Ch

MOV 10hA

MOV A0Bh

SUBB A0Dh

MOV 11hA

MOV A0Ah

CLR C

SUBB A0Eh

MOV 12hA

MOV A0Bh

SUBB A0Fh

MOV 13hA

MOV A10h

JNZ 04h

MOV A11h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h01h

CLR 91h

SJMP 29h

MOV A12h

JNZ 04h

MOV A13h

JZ 02h

SJMP 14h

CLR A

MOV 0BhA

MOV 0AhA

CLR A

MOV 15hA

MOV 14hA

CLR A

MOV 17hA

MOV 16h02h

CLR 91h

SJMP 0Bh

CLR A

MOV 0BhA

MOV 0AhA

MOV DPTP2710h

LCALL Labe1_7

JB B3h1Eh

MOV A16h

CJNE A01h04h

MOV A17h

JZ 02h

SJMP 13h

MOV 0Ch14h

MOV 0Dh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

JNB B3h03h

LJMP Labe1_3

MOV A16h

CJNE A02h04h

MOV A17h

JZ 03h

LJMP Labe1_3

MOV 0Eh14h

MOV 0Fh15h

SETB 91h

MOV DPTR7530h

LCALL Labe1_7

CLR A

MOV 17hA

MOV 16hA

LJMP Labe1_3

RET

Labe1_4

JB A0h09h

MOV 1Eh01h

MOV DPTR07D0h

LCALL Labe1_7

JNB A0h2Bh

MOV A1Eh

CJNE A01h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A01h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV14h0Ah

MOV15h0Bh

MOV1Eh00h

JB A1h09h

MOV 1Eh02h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE

A0226h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 44: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 44

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A02h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A2h09h

MOV 1Eh03h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A2h 2Bh

MOV A1Eh

CJNE

A03h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL

Labe1_10

MOV A82h

MOV F0h83h

ADD A03h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A3h09h

MOV 1Eh04h

MOV DPTR07D0h

LCALL Labe1_7

JNB A3h2Bh

MOV A1Eh

CJNE A04h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A04h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh05h

MOV DPTR07D0h

LCALL Labe1_7

JNB A1h2Bh

MOV A1Eh

CJNE A05h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A05h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A5h09h

MOV 1Eh06h

MOV DPTR07D0h

LCALL Labe1_7

JNB A5h2Bh

MOV A1Eh

CJNE A06h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A06h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A6h09h

MOV 1Eh07h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A6h2Bh

MOV A1Eh

CJNE A07h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A07h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB A7h09h

MOV 1Eh08h

MOV

DPTR07D0h

LCALL Labe1_7

JNB A7h2Bh

MOV A1Eh

CJNE A08h26h

CLR A

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 45: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 45

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B0h09h

MOV 1Eh09h

MOV DPTR07D0h

LCALL Labe1_7

JNB B0h2Bh

MOV A1Eh

CJNE A09h26h

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV A82h

MOV F0h83h

ADD A09h

MOV 0AhA

CLR A

ADDC AF0h

MOV 0BhA

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

JB B2h09h

MOV 1Eh0Ah

MOV DPTR07D0h

LCALL Labe1_7

JNB B2h23h

MOV A1Eh

CJNE A0Ah1Eh

CLR A

MOV 34hA

MOV 33h0Ah

MOV 82h0Ah

MOV 83h0Bh

LCALL Labe1_10

MOV 0Ah82h

MOV 0Bh83h

MOV 14h0Ah

MOV 15h0Bh

MOV 1Eh00h

RET

Labe1_5

INC 1Ch

MOV A1Ch

CJNE A01h06h

MOV DPTR7530h

LCALL Labe1_7

MOV A1Ah

JNZ 04h

MOV A1Bh

JZ 02h

SJMP 04h

CLR 90h

CLR B5h

MOV A1Ah

A01h04h

MOV A1Bh

JZ 02h

SJMP 3Dh

CLR 90h

CLR B5h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A06h

MOV A2Ch

SUBB A00h

MOV A2Eh

SUBB A00h

JNZ 1Ah

MOVPTR 7530h

LCALL lable-8

INC 2Bh

CLR A

A2BhE1h

INC 2Ch

A2ChDCh

INC 2Dh

CJNE

A2DhD7h

INC 2Eh

SJMP D3h

MOV 1Ch02h

MOV 1Dh01h

MOV A1Ch

CJNE

A02h0Dh

SETB 90h

SETB B5h

MOV

DPTR7530h

LCALL lable 7

MOV 1Ch00h

RET

Lable 6

CLR 92h

CLR B7h

MOV

DPTR61A8h

LCALL lable 7

MOV

DPTR3A98h

LCALL lable 8

MOV

DPTR61A8h

LCALL lable-7

MOV

DPTR3A98h

LCALL lable-8

Mov dptr61A8h

LCALL lable 7

MOV DPTR3A98h

LCALL lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 46: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 46

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

MOV DPTR3A98h

LCALL Lable 8

MOV DPTR61A8h

LCALL Lable 7

SETB B7h

CLR A

MOV 2EhA

MOV 2DhA

MOV 2ChA

MOV 2BhA

CLR C

MOV A2Bh

SUBB A02h

MOV A2Ch

SUBB A00h

MOV A2Dh

SUBB A00h

MOV A2Eh

SUBB A00h

JNC 4Ah

CLR A

MOV 32hA

MOV 31hA

MOV 30hA

MOV 2FhA

CLR C

MOV A2Fh

SUBB A3Ch

MOV A30h

SUBB A00h

MOV A31h

SUBB A32h

MOVA32h

SUBB A00h

JNC 1Ah

MOV DPTR7530h

LCALL Lable 8

INC 2Fh

CLR A

CJNE A2FhE1h

INC 30h

CJNE A30hDCh

INC 31h

A31hD7h

INC 32h

SJMP D3h

INC 2Bh

CLR A

A2Bh0ch

INC 2Ch

A2Ch07h

INC 2Dh

A2DhA7h

INC 2Eh

SJMP A3h

SETB 92h

MOV 1Dh01h

RET

Lable 7

CLR B6h

LCALL Lable 8

SETB B6h

RET

Lable 8

MOV R282h

MOV R383h

CLR A

MOV 22hA

MOV 21hA

MOV 20hA

MOV 1FhA

MOV 04hR2

MOV 05hR3

MOV AR3

RLC A

SUBB AE0h

MOV R6A

MOV R7A

CLR C

MOV A1Fh

SUBB AR4

MOV A20h

SUBB AR5

MOV A21h

SUBB AR6

MOV A22h

SUBB AR7

JNC 14h

INC 1Fh

CLR A

A1FhE1h

INC 20h

A20hDCh

INC 21h

A21hD7h

INC 22h

SJMP D3h

RET

Lable 9

MOV 32h00h

RET

Lable 10

MOV A82h

MOV F0h33h

MUL AB

XCH A82h

PUSH Fun

MOV F0h34h

MUL AB

POP F0h

XCH A83h

MOV F0h33h

MUL AB

ADD A83h

MOV 83hA

RET

Lable 11

MOV 81h34h

LCALL Lable 9

MOV A82h

JZ 03h

LJMP Lable 1

MOV R100h

MOV AR1

ORL A00h

JZ 1Bh

MOV R200h

MOV DPTR05D1h

MOV R000h

MOV A0h00h

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 47: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 47

CLR A

MOVC AA+DPTR

MOVX R0A

INC DPTR

INC R0

CJNE R000h02Hh

INC A0h

DJNZ R1F4h

DJNZ R2F2h

MOV A0h3FFh

MOV R000h

MOV AR0

ORL A00h

JZ 0Ch

MOV R100h

MOV DPTR0000h

CLR A

MOVX DPTRA

INC DPTR

DJNZ R0FCh

DJNZ R1FAh

MOV R0A

DJNZ R0FDh

LJMP Lable1-1

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 48: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 48

10 CONCLUSION

By making the project ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo in major project for final year I

conclude that In this project we put our greatest effort to understand amp explore more amp more

about the project

This project has many useful applications in industries and security systems for all types of

applications also we try our best to make this project successful

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom

Page 49: Security Code Lock Project Report

PROGRAMMABLE SECURITY CODE LOCK

MARUDHAR ENGINEERING COLLEGE BIKANER Page 49

11 BIBLIOGRAPHY

I developed my this project report of ldquoPROGRAMMABLE SECURITY CODE LOCKrdquo from following

books and web sites

Electronics and Circuits by Allen Mottershead

Basic Electronics by Miami AK

wwwelectronicsforucom

wwwwikipediacom

wwwatmelCom

wwwelectroschematicscom

wwwdatasheetarchivecom