MEDIA KIT 2010
EST. 1992
The Engineer’s Resource
rtcmagazine.com
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Tom Will iamsEditor- in-Chief(831) [email protected]
Marina TringaliManaging Editor/Ad Traff ic(949) [email protected]
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Lauren TrudeauWestern RegionalSales ManagerP (949) 226-2014C (949) [email protected]
Shandi RicciottiEastern RegionalSales ManagerP (949) 226-2000C (949) [email protected]
rtcmk10.indd 3 8/21/09 11:18:17 AM
EDITORIALTECHNOLOGY IN CONTEXTThis sect ion fol lows developments in the technology underly ing the development of embedded systems. I t includes the latest advances in processors, form factors, programmable logic devices and standards. I t a lso covers approaches l ike fault tolerance, system management techniques, hot-swap and thermal management, high avai labi l i ty and safety-cr it ical concerns. Technology in Context focuses on the foundations upon which embedded systems are bui l t .
TECHNOLOGY CONNECTEDToday, the vast majority of embedded devices are connected via some sort of serial l ink or network to other embedded devices, supervisory systems and ultimately to the Internet. The newer, faster serial interconnect technologies l ike PCI Express, USB and RapidIO, to name a few, as well as variations on industrial Ethernet, also interface with legacy technologies such as CAN and ProfiBus, serial interconnects and a host of wireless technologies. These include 802.11, Bluetooth, Wi-Fi and a variety of wireless sensor network technologies. These many technologies and protocols eventually flow into Ethernet and Internet, and the Technology Connected section focuses on keeping our readers informed on the latest developments in connectivity in the embedded world.
TECHNOLOGY IN SYSTEMSPutting together the three major components of any computer-based system—the CPU, the software and the I/O—is often a challenging task, especial ly since the I/O and the software must be specifically tai lored to the needs of the application in combination with the appropriate processor. In addition, there are often other components such as a storage subsystem and display. This activity requires the ful l ski l l of the developer—in evaluating and selecting the components, integrating them electrically and mechanically and in developing and optimizing the application code. This section wil l look at the issues, the techniques and the tools for system development and integration.
TECHNOLOGY DEPLOYEDEmbedded systems operate in an endless var iety of appl icat ions that make dif fer ing demands on their capabi l i t ies and how they are designed and conf igured. Despite that, many of the components, tools and design techniques are simi lar. This sect ion wi l l cover representat ive broad appl icat ion areas and look at the unique problems they pose and the solut ions they offer. Such things as data acquis it ion are integral to a wide range of specif ic appl icat ions as are motor control , machine-to-machine systems, medical devices and many more. Looking at some of the broader issues presented here, readers wi l l be able to get ideas that they can apply to their specif ic needs in bui ld ing that dedicated embedded solut ion.
EDITORIAL CALENDAREvery Issue of RTC magazine contains staff-written and contr ibuted art ic les from leading technology experts and design integrators. RTC ’s staff produces a truly superior product, one that serves a cr i t ical need in the embedded community. Changes in the technology, market and pol i t ical/ legal arenas provide a true opportunity for RTC ’s editors to make real and meaningful contr ibut ions to their community.
Technology in Context Technology Connected Technology in Systems Technology Deployed
JanuaryFPGAs—Is Bigger Always
Better?Wireless Data Acquis it ion
Programmable Automation Control lers
Machine Vis ion in Factory Automation
FebruaryCompactPCI in Control
and AutomationSecurity for Networked Devices—Is I t Possible?
Sleep Modes and Power-Downs: Managing Power
in Smal l Systems
Wireless Networks for Bui ld ing and Faci l i ty
Management
MarchEmbedded Memory
System Options
Supervisory Systems: Br inging the Network to
the Operator
Mechanical Design for Chassis Coding
Machine to Machine Systems Smooth
Transportat ion
AprilPC/104 Derivat ives—This Town Ain’t Big Enough.. .
USB and/or PCI Express?Marrying COMs and
Carr iers—Not Always Made in Heaven
Data Acquis it ion with Smal l Modules
MayDevelopments in
Mult icore ProcessorsEthernet: 40Gbit to
100Gbit to.. .?Integrat ing Touch Screen
and Input TechnologiesGreen Engineering:
Making the Most of Power
JuneLow-Power CPUs Bring Intel l igence into Smal l
Spaces
Using CompactPCI and PXI
Hypervisors and Operat ing Systems for
Mult icoreMotor and Motion Control
JulyMini-, Nano- and Pico-ITX
ModulesMicroTCA in Networks
Embedded Windows vs. L inux
Medical Devices Bui ld on Smal l Modules with Low
Power
AugustBatter ies, Fuel Cel ls and Photovoltaics in
Embedded Design
Sort ing Out GSM, Wi-Fi and Bluetooth
Rugged, Hot-Swappable and Rel iable—Tough
Systems for Tough Jobs
Making Factory Automation Systems
Flexible and Conf igurable
SeptemberVME—Wil l I ts Derivat ives
Prevai l?Options for Industr ia l
NetworksThermal Management in
Tight Spaces
Robotic Systems Combine Sensors, Computer Power
and Motion
OctoberAdvances in Sol id-State
StorageLatest Generat ion PCI
ExpressSystem Monitor ing and
ManagementEmbedded Technologies for the Smart Power Grid
NovemberARM and Power Modules Move in on Appl icat ions
Remote Management and Maintenance
Wearable and Handheld Computers Move into
Special ized Jobs
Box PCs Package Modular i ty, Connectiv ity and Appl icat ion Diversity
DecemberCOMs vs. SBCs—What to
Use and WhenPCI Express over Cable
MicroTCA in Control and Automation
Standards Update: Report on the Most Signif icant
Industry Standards
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Test &Measurement
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Other3%
0 5 10 15 20 25 30
Connectivity30%
Signal Processing14%
Blade Server Processing14%
Blade Server Switching10%
Control Functions25%
POS/Retail Terminal22%
Safety/Protection16%
Areas of Engineering Development
0 5 10 15 20 25 30 35
Engineering Manager/Program Manager30%
Hardware Engineer/Designer26%
Business Development2%
Design Team Leader17%
Executive Management19%
Other2%
Job Titles
rtcmk10.indd 3 8/21/09 11:18:17 AM
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