Open Innovation and CollaborationDr. Erich RuetscheBusiness DevelopmentIBM Research - Zurich
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+ Smarter Planet
The Eras of IBM Research: “The World Is Now Our Lab”
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Evolution of IBM Research
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Government
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Milestones of a Partnership with ETH Zürich
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IBM Press Release
Intelligent use of heat emissions in data centers of the future
Hannover, Germany, Rüschlikon, Switzerland, 3 March 2008 — At the CeBIT 2008 tradefair scientists from IBM's (NYSE: IBM) Zurich
Research Laboratory will present for the first time a pioneering concept of a zero carbon emission data center achieved by the direct reuse
of waste heat. The first prototype is not only extremely energy-efficient, but allows three-quarters of the IT operating energy to be
redirected to such uses as to heat buildings. This is environmentally friendly and lowers overall operating costs. A powerful new kind of
water cooling system embedded on the chip is the basis of this innovation.
Challenges in the IT industry
Energy is an indispensable yet increasingly precious resource. At the same time, it poses a challenge to the IT industry. According to Gartner Group
analysts, the information and communications industry accounts for about 2% of global carbon dioxide emissions, which is equal to that generated
by air traffic the world over. The US-based Lawrence Berkeley National Laboratory confirms that the worldwide energy consumption of data
centers amounts to some 120 billion KWh, roughly equivalent to 14 typical power plants of 1000 megawatts each. This energy is used to operate the
data centers around the world that constitute the backbone of our service economy.
And the energy consumption of data centers is increasing. Companies currently spend between 25 and 50% of their total IT budget on data center
operations. Indeed, data centers have developed into oversized electrical heating systems. But until now, it has not been possible to channel this
energy to serve as a direct supply of heat. Instead, this waste heat is simply dissipated into the environment, meaning that huge potential savings are
not being realized.
Technological solution from IBM Research - Zurich
Scientists at the IBM Research Laboratory in Zurich now want to change this. At the CeBIT 2008 tradefair in Hannover, Germany, they will present
for the first time the pioneering concept of a highly energy-efficient data center that achieves a zero carbon footprint by directly reusing its waste
heat. The researchers have designed an innovative energy and cooling circuit, the basis of which is a new kind of water-cooling system that is
applied where cooling is needed the most — directly on the chip.
The goal of the zero-emission data center model is to reuse heat generated by the chip for heating buildings, swimming pools etc. or simply for
conducting the heat into a municipal heating network. However, the most important requirement for the direct use of heat is that the temperature of
the waste heat be above a certain threshold, which, for modern municipal heating networks, is about 50 °C.
To accomplish this, IBM researchers used water, which can conduct heat 4000 times better than air. This alone has an enormous energy-saving
potential. But integrating water cooling on the chip, researchers were able to improve the cooling efficiency by several orders of magnitude.
CeBIT 2008 Prototype
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IBM Press Release
IBM and ETH Zurich unveil plan to build new kind
of water-cooled supercomputer
Direct reuse of waste heat. Aims to cut energy consumption by 40% and carbon-dioxide emissions by up to 85%
Zurich, Switzerland, June 23, 2009—In an effort to achieve energy-aware computing, the Swiss Federal
Institute of Technology Zurich (ETH), and IBM (NYSE: IBM) today announced plans to build a first-of-a-
kind water-cooled supercomputer that will directly repurpose excess heat for the university buildings. The
innovative system, dubbed Aquasar, is expected to decrease the carbon footprint of the system by up to
85% and estimated to save up to 30 tons of CO2 per year, compared to a similar system using today’s
cooling technologies.1
Making computing systems and data centers energy-efficient is a staggering undertaking. In fact, up to 50%
percent of an average air-cooled data center’s carbon footprint or energy consumption today is not caused by
computing but by powering the necessary cooling systems to keep the processors from overheating—a situation
that is far from optimal when looking at energy efficiency from a holistic perspective.
“Energy is arguably the number one challenge humanity will be facing in the 21st century. We cannot afford
anymore to design computer systems based on the criterion of computational speed and performance alone,”
explains Prof. Dr. Poulikakos of ETH Zurich, head of the Laboratory of Thermodynamics in Emerging
Technologies and lead investigator of this interdisciplinary project. “The new target must be high performance
and low net power consumption supercomputers and data centers. This means liquid cooling.”
With an innovative water-cooling system and direct heat reuse, Aquasar—the new supercomputer, which will be
located at the ETH Zurich and is planned to start operation in 2010, will reduce overall energy consumption by
40%. The system is based on long-term joint research collaboration of ETH and IBM scientists in the field of
chip-level water-cooling, as well as on a concept for “water-cooled data centers with direct energy re-use”
advanced by scientists at IBM’s Zurich Lab.
The water-cooled supercomputer will consist of two IBM BladeCenter® servers in one rack and will have a peak
performance of about 10 Teraflops.2
Each of the blades will be equipped with a microscale high-performance liquid cooler per processor, as well as
input and output pipeline networks and connections, which allow each blade to be connected and disconnected
easily to the entire system (see image).
Water as a coolant has the ability to capture heat about 4,000 times more efficiently than air, and its heat-
transporting properties are also far superior. Chip-level cooling with a water temperature of approximately 60°C
is sufficient to keep the chip at operating temperatures well below the maximally allowed 85°C. The high input
temperature of the coolant results in an even higher-grade heat as an output, which in this case will be about
Collaboration with ETH in 2009 (FOAK)
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SuperMUC at Leibniz-Rechenzentrum 2012
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EKZ and Zurich University of Applied Sciences (ZHAW)One Click EV Charging
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University of Aberdeen Molecular structure determination using AFM
TOTAL SYNTHESISFour of a kind
OXYGEN REDUCTION REACTION Better through blocking
WATER-OXIDATION CATALYSISNanotubes provide stability
Single-molecule mug shot
OCTOBER 2010 VOL 2 NO 10www.nature.com/naturechemistry
nchem cover Oct 2010.indd 1 7/9/10 13:52:16
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EPFLEliminating Power Consumption in Standby Mode
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Cores: the cores are no longer side by side, but stacked vertically
Channels: as thin as a human hair, the channels fill with the coolant liquid and traverse the 3D chip to maintain an operating temperature
EPFL and ETH ZurichTomorrow’s 3D Microchips: Less Energy, Less Heat
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