Global Supply Management Global Supply Management
Members: Samantha Caves, Nicole Clark, Michael Jones, Michael Keller, Hali MacMillan, Nicholas Schulte
Alternative Supply Line Design for Intel’s Assembly Test Factory Network
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Intel’s Mission
“Utilize the power of Moore’s Law to bring smart, connected devices to every person on Earth.”
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Executing Moore’s Law
“Enabling new devices with higher functionality and complexity while controlling power, cost,
and size”
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Introduction ● Computers and processors are vital to Intel and nearly
all of our daily lives o Keeping these in proper working order is critical
● What are heat spreaders? ● Sustainable options
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Problem Details ● Heat spreaders manufactured from C101 Copper Alloy ● Goal:
o Determine alternative material § Meets mechanical properties and cost effective
o Determine supplier selection and sourcing ● Necessary to understand the specs and manufacturing
process
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C101 Copper ● Electrically refined copper alloy
o Contains less than .001 % oxygen ● High thermal conductivity and coefficient of thermal
expansion (CTE) o 390 - 400 W/mK and 16 - 17 ppm/C
● Worldwide availability ● Stamping makes it cost effective to manufacture ● Commonly used in electronics
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Project Scope ● Separated the project into two parts:
o Material research and selection o Material sourcing, supplier selection, manufacturing process
● Focus on increasing heat efficiency of Integrated Heat Spreader (IHS) and lowering cost
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Material Specific Criteria ● Thermal conductivity (W/mK) ● Coefficient of thermal expansion, CTE (ppm/C) ● Dimensions (32mm x 34mm) ● Surface finish (nickel plating/alternative technique) ● Material manufacturing (conflict free)
o Conflict Minerals- Minerals that come from the Democratic Republic of Congo (DRC), where the profits of these minerals fund violence committed by the rebel groups
● Cost ● Availability of material
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Initial Material Research ● CuB-42MBD4(120/140)(70/80) ● CuMo ● Aluminum Nitride ● Copper-Tungsten Alloy ● Tungsten Carbide ● Al-Diamond ● CarbAl ● Cubic Boron Arsenide ● Silicon Carbide ● Dymalloy ● Silver Diamond ● Cubic Boron Arsenide
● Copper Graphite ● Natural Graphite ● Aluminum Graphite ● Aluminum Silicon Carbide
Thermal conductivity
and dimensions
Research Criteria:
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Short List ● CarbAl ● Copper Graphite ● Aluminum Graphite ● CuB - 42MBD4 (120/140)
(70/80) ● Silicon Carbide (C6H) ● Aluminum Diamond
Research Criteria:
Minimum dimensions,
surface finish, location and availability of material, cost
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Copper Graphite
Material Name
Thermal Conductivity
(W/mK)
CTE (ppm/C) Minimum Material
Dimensions (32 mm by 34
mm)
Surface Plating
Material Production (location)
Cost/Yield Notes:
C101 Copper
390-400 16-17 Yes Nickel Plated South East Asia
Cheap/High Yield
Current material for heat spreader
Copper Graphite (GR-CU)
265-300
4-7
No
Nickel Plated
North America
Expensive/Low Yield
Adding graphite makes the
manufacturing process more
intense
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CuB-42MBD4(120/140)(70/80) Material Name
Thermal Conductivity
(W/mK)
CTE (ppm/C) Minimum Material
Dimensions (32 mm by 34
mm)
Surface Plating
Material Production (location)
Cost/Yield
Notes:
C101 Copper
390-400 16-17 Yes Nickel Plated South East Asia
Cheap/High Yield
Current material for heat spreader
CuB- 42MBD4 (120/140)(70/80)
520-598 10.1/12.4 N/A N/A Dresden, Germany
Expensive/ Low Yield
Due to this material
containing synthetic
diamonds it is very expensive
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Aluminum Diamond
Material Name Thermal Conductivity
(W/mK)
CTE (ppm/C)
Minimum Material
Dimensions (32 mm by
34 mm)
Surface Plating
Material Production (location)
Cost/Yield
Notes:
C101 Copper
390-400 16-17 Yes Nickel Plated
South East Asia
Cheap/High Yield
Current material for heat spreader
Aluminum Diamond 500 6.1-7.9 Yes
Nickel Plated
Europe North
America
Expensive/ Low Yield
Diamond is very expensive and hard to
work with
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Top Three Materials ● CarbAl
o Applied Nanotech, Inc. ● Aluminum Graphite
o Mersen
o Schunk Hoffman
o MMCC
o Bracalente
● Silicon Carbide (C6H) o Genesic o BayCarbon o Stanford Advanced Materials o II-VI Incorporated o Dow Corning o Nitride Crystals Group o SiCrystal AG o TanKeBlue Ltd.
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CarbAl
Material Name
Thermal Conductivity
(W/mK)
CTE (ppm/C) Minimum Material
Dimensions
Surface Plating
Material Production (location)
Cost/Yield
Notes:
C101 Copper
390-400 16-17 Yes Nickel Plated South East Asia
Cheap/High Yield
Current material for heat spreader
CarbAl 350 2 No Nickel Plated Austin, Texas
Applied Nanotech
Cheap/Low Yield
Can be inlayed and plated in copper and is currently being
looked at by NASA for heat
sink applications
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Aluminum Graphite
Material Name
Thermal Conductivity
(W/mK)
CTE (ppm/C) Minimum Material
Dimensions
Surface Plating
Material Production (location)
Cost/Yield
Notes:
C101 Copper
390-400 16-17 Yes Nickel Plated South East Asia
Cheap/High Yield
Current material for heat spreader
AlGrp (Range is 10-90% graphite)
324-783 Matched: Parallel
(16.9-2.5) Perpendicular
(15.2-10.1)
No Nickel Plated Worldwide
MMCC
Mersen
Expensive/Low Yield
Further research suggests that the
manufacturing process is not
readily available
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Final Material - Silicon Carbide
Material Name
Thermal Conductivity
(W/mK)
CTE (ppm/C) Minimum Material
Dimensions
Surface Plating
Material Production (location)
Cost/Yield
Notes:
C101 Copper
390-400 16-17 Yes Nickel Plated South East Asia
Cheap/High Yield
Current material for heat spreader
Silicon Carbide
360-490 1.2-7.9 Yes Nickel Plated Worldwide
Dow Corning
Stanford Advanced Materials
Cheap/High Yield
Available worldwide and
meets all requirements for
alternative material
Silicon Carbide Process Flow - Dow Corning Crystal Growth
Epi Polish
Stock Polish
Wafer Shaping
Wafer Slicing
Ingot Shaping Epi Growth
Clean/Package
Final Polish
Clean/Package
M
CMetrology Steps
Cleaning Steps
M
M
M
M
M
M
M
M
C
C
C
C
C
C
Seed Surface Prep
Seed Slicing
Seed Ingot Shaping
M
M
M
M C
C
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Cost
● Stanford quoted $11 per unit o Quantity of 50,000 pieces
● Dow Corning has no bid o Would need a secondary company
to diamond machine ● Alternate materials meeting
performance requirements are higher cost than stamped copper
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Major Challenges ● Finding suppliers of high grade SiC ● Working with manufacturers ● Complex manufacturing/machining process
o Competitive cost ● Issues with procuring a sample ● Integrated package performance due to CTE of IHS ● Meeting strict design criteria
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Conclusion ● Many materials with novel properties meeting requirement
o Continue monitoring CarbAl and AlGrp ● Silicon Carbide
o Viable option for large complex operations o More sustainable than Copper and Gold o Very strong, low density material o Uniform structure, most reliable in long run o High thermal conductivity capabilities o Can be Nickel plated
§ Same laser etching process
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A special thanks to our Intel sponsors, Sabina Houle and Mark Norwil!
Thank you Intel!
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