Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip
Andrew PieterickPaolo Ferrari
Fabrication
• Laser Induced Backside Wet Etching
• Components
• Materials
• Controls
Features
• Pros:– Varied aspect-ratios– Variable cross-section– Rapid prototyping– Crack/debris free
• Cons:– Roughness– CNC instability
Example Device
• Microreactor (A + B)
• Microconcentrator (A + B + C)
• Concentration mode (port E)
• Extraction mode (port D)
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