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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-9150 1

21 rue La Nouë Bras de Fer – 44200 Nantes - France

Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr

November 2012- Version 2

Written by: Sylvain HALLEREAU

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.

http://www.systemplus.fr/




Table of Contents

• 1. Overview / Introduction 3

– Executive Summary

– Reverse Costing Methodology

• 2. Company Profile 5

• 3. Physical Analysis 13

– Synthesis of the Physical Analysis

– Physical Analysis methodology

– Package characteristics & markings

– Package opening

– Package Opening : Dies Bonding

– Package Cross Section

– Invensense ASIC Marking

– Invensense ASIC Dimensions

– Invensense ASIC minimal dimensions

– Invensense ASIC Cross section

– Invensense ASIC Process Characteristics

– Invensense MEMS marking

– Invensense MEMS Opening

– Invensense MEMS Sensing Area

– Invensense MEMS Cap

– Invensense MEMS Process Characteristics

– Magnetometer marking

– Magnetometer Dimensions

– Magnetometer Cross Section

– Magnetometer Process Characteristics

• 4. Manufacturing Process Flow 84

– Global view

– Process Flow Accelerometer ASIC

– Process Flow MEMS Accelerometer

– Process Flow Magnetometer

– Process Flow Packaging

– Description of the Wafer Fabrication Unit

• 5. Cost Analysis 102

– Synthesis of the cost analysis

– Methodology

– Hypothesis

– Yield Synthesis

– Invensense ASIC Wafer Cost

– Invensense ASIC Die Cost Data

– MEMS Accelerometer Wafer Cost

– MEMS Accelerometer cost per Steps

– MEMS Accelerometer Equipment cost

– MEMS Accelerometer Material cost

– MEMS Accelerometer Die Cost

– Magnetometer Wafer Cost

– Magnetometer cost per Steps

– Magnetometer Material cost

– Magnetometer Die Cost

– Back-End : Package Cost

– Back-End : Package Cost Per Steps

– Back-End : Package Material cost

– Back-End : Final Test

– MPU9150 Manufacturing Cost

– Cost Analysis Evolution over yield

• 6. Estimated Selling Price Analysis 148

– Supply Chain Analysis

– Estimated Selling Price

– Price Evolution according to the yield

• Glossary

• Contacts




Package Characteristics & Markings

• Package type : LGA-24pins

• Dimensions : 4.00mm x 4.00mm x 1.00mm

• Pin pitch : 0.5mm

Package Top view

Package Back view

4.00mm

1.00mm

0.50mm

Package Side view

4.00mm

4.00mm




Package Opening : Optical View

Package Opening :Main Parts

Package Opening : Optical view

Package opening reveals two chips bonded to

the package susbstrate by wire bonding

process.

ASIC

Magnetic concentrator

Magnetometer

Y-axis

magnetometer

MEMS Accelerometer + Gyroscope

Magnetometer

MEMS Accelerometer + Gyroscope

ASIC




Package Cross Section

Package cross-section : SEM view

LGA substrate : SEM view

xxµm

xxµm

xxµm

xxµm

xxµm

xxµm

xxµm

xxµm xxµm

ASIC

Magnetometer Cap

Sensor

Solder mask

LGA Substrate

Copper

Solder

xxµm




Capacitive

electrodes

Proof mass ASIC Cavity

X-Axis Gyro– Tilt View

Interdigitated electrodes SEM View

MEMS Sensor – X-Axis Gyro

Bar linkage

Bar

linkage

X Axis Gyroscope SEM view




Package Cross Section

ASIC

Magnetic

concentrator

Magnetometer

MEMS inertiel

Cap

Sensor

LGA24 substrate

2 layers

LGA 24 package

Package cross-section : Optical view




AA' Cross Section Overview

Cap

Sensor

ASIC

The ASIC wafer and

Sensor wafer are bonded

together using an

Aluminum/Germanium

Eutectic bonding process.

Germanium

The Cap wafer and Sensor

wafer are bonded together

using an a fusion bonding

process.

Oxide

Component Cross-Section AA’

Saw cut

sign

Germanium

Oxide




Bonding Cap & Sensor

Bonding ASIC & Sensor

Cross Section SEM View

Cap

Sensor

Oxide

Total oxide thickness ~ 2µm

Germanium thickness ~0.25µm

Germanium

Sensor

ASIC

Component Cross-Section AA’

Germanium connects electrically the MEMS

Sensor and ASIC Aluminum metallization.




AK8975 – Hall Sensors

AK8975 Overview

Hall captor details – Optical View

Hall captor – Optical View

Metal 1

Metal 2

Metal 3

Si

p-substrate

Hall sensor




Die Cost

• The final die cost ranges from $xxx to $xxx according to yield variations.

• The back-end 0 cost (probe test and dicing) represents 2% of the cost of the die.

• The yield losses costs due to probe and dicing represents 20% of the total manufacturing cost.

– The die cost includes the rejects at

probe test and dicing.

– The yield losses represents the

defective dies which are rejected.

Low Yield Medium Yield High Yield

Cost Breakdown Cost Breakdown Cost Breakdown

FE : ASIC Cost29%

FE : MEMS Cost14%

FE : ASIC/MEMS Assembly Cost

9%

Foundry Overhead Cost48%

Die Cost Breakdown (Medium Yields)

FE : ASIC Cost 19.4% 22.7% 26.2%

FE : MEMS Cost 10.7% 11.0% 11.2%

FE : ASIC/MEMS Assembly Cost 8.5% 7.1% 5.4%

Foundry Overhead Cost 35.7% 37.6% 39.5%

BE 0 : Probe Test + Dicing Cost 1.8% 2.1% 2.5%

BE 0 : Yield losses 23.8% 19.5% 15.2%

Die Cost 100% 100% 100%




• Reverse costing analysis represents the best cost/price evaluation given the publically

available data, completed with industry expert estimates.

• Given the hypothesis presented in this analysis the major sources of correction would lead to

a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

• IC +/- 8%

• MEMS +/- 5%

• Packaging +/- 10%

• Test +/- 20%

• These results are open for discussion. We can re-evaluate this component with your

information. Please contact us:

Conclusion

