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InvenSense: MEMS Start-Up to Market LeaderJoe Seeger

September 15, 2010

9/20/2010

InvenSense: MEMS Start Up to Market Leader

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Agenda

Introduction & History

i iMotion Processing

MEMS Startup Challenges

InvenSense Solutionse Se se So u o s

Summary & Conclusions

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BSAC Thrust Session Fall 2010 September 15, 2010

InvenSense Overview

• Funded in 2004, nearly 200 employees todayStatus

• Consumer ElectronicsMarket

• Major consumer electronic OEM and ODM companiesCustomer

• New generation of motion based interfacesSolution

• Nasiri‐Fabrication and MotionProcessing PlatformsTechnology

• Fabless CMOS & MEMS, nearly 100MU shippedManufacturing

• 56 filed and issued with many core IPPatents

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InvenSense Precursors, 2003

S. Bhave, J. Seeger, X. Jiang, B. Boser, R. Howe, J. Yasaitis, Transducers 2003 S. Nasiri,

Transparent Networks Inc.

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MEMS Gyroscope Market, 2003

• First demonstrated by Draper Labs in early 1990

• Bosch commercialized it for automotive VSC in 1997

• First demonstrated by Draper Labs in early 1990

• Bosch commercialized it for automotive VSC in 1997

Historical Perspective

• >10 MEMS gyro companies at various stages, all for automotive

• All single axis, mostly Z‐axis at around $15/axis

• Bulky, high current, and costly for consumer products

• >10 MEMS gyro companies at various stages, all for automotive

• All single axis, mostly Z‐axis at around $15/axis

• Bulky, high current, and costly for consumer products

Key Market Drivers in 2003 for MEMS Gyro

• Driven by DSC/DVC image quality, all Japanese companies

Si l i Pi $3 5/ i M NEC d F ji

• Driven by DSC/DVC image quality, all Japanese companies

Si l i Pi $3 5/ i M NEC d F ji

Opportunity: Low Cost Consumer Grade MEMS Gyros

• Single axis Piezo gyros ~$3.5/axis; Murata, NEC and Fujitsu

• Key issues: Performance, Bulky, Fragile and need for external electronics

• Single axis Piezo gyros ~$3.5/axis; Murata, NEC and Fujitsu

• Key issues: Performance, Bulky, Fragile and need for external electronics

• MEMS gyros were thought as unfeasible to get below $3/axis• MEMS gyros were thought as unfeasible to get below $3/axis

Consumer Grade MEMS Gyro

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InvenSense Prototype Gyroscope

MEMS Wafer

Integrated IC

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State‐of‐the‐Art Solutions2004

(inception)2006 2008 2009 2010 2011

1st generationX/Y gyro6x6x1.4mm

2nd generationX/Y Gyro4x5x1.2mm

X/Z Gyro 4x5x1.2mm

MPU-3000with X/Y/Z Gyro4x4x0.9mm

MotionProcessing

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Image Stabilization Gaming TV Remote

What is MotionProcessing?

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MotionProcessing: “Interface to Digital World”

5 6,71-4

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8,9

10

17

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121314

15,16

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Consumer Market Dynamics

• Need for product differentiation and new features

• Adoption by thought leaders and acceptance by customers

M l l d i i h

• Need for product differentiation and new features

• Adoption by thought leaders and acceptance by customers

M l l d i i h

Highly Competitive and Feature Driven

• Must solve a real need to get traction with customers• Must solve a real need to get traction with customers

• Constant and relentless drive to lower prices

• Unpredictable demands and shipment schedules

• Actively encourages multiple suppliers and fierce competition

• Need for complete solutions and thorough customer education

• Constant and relentless drive to lower prices

• Unpredictable demands and shipment schedules

• Actively encourages multiple suppliers and fierce competition

• Need for complete solutions and thorough customer education

Very Demanding for Size, Cost and Volume

Late Adopter of New Technologies• What are the real killer applications?

• Skeptical of consumer behavior and willingness to change

• Market is driven by only a few thought leaders

• Need for delivering total solution and lots of support

• What are the real killer applications?

• Skeptical of consumer behavior and willingness to change

• Market is driven by only a few thought leaders

• Need for delivering total solution and lots of support

Late Adopter of New Technologies

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MEMS Startup Challenges

• Understand market need and application

Market Knowledge

MEMS Production

• Address Fabrication, Packaging, Test, & Capacity challenges

• High‐volume MEMS production experience?

• Address MEMS simulation, IC design specific to MEMS

• MEMS is one component of total system

• Address cost, yield, performance and develop new products

MEMS d i k l d & i l d t i ?

Engineering & MEMS Development

• MEMS design knowledge & commercial product experience?

• Need some “unfair” advantage to compete against established companies

• Is it a Feature, Product, or Platform?

Disruptive Technology

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Challenges With Low Cost MEMS

Presented by Leading MEMS Company in 2005

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Nasiri‐Fabrication Platform

Si Cavity etch (M2)

Si Wafer 1

MEMS Substrate

Backside Marks (M1)Engineered SOI WaferSi Cavity etch (M2)

Fusion Bond Si Wafer 2

Grind and Polish

Hermetic seal ring and Interconnect (M3)

Structure layer etch (M5)

ProprietaryWafer Bond

Ge based coating (M4)

Tab Removal CMOS

CMOS Wafer

Cavity Etch (M6)

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Wafer‐Scale Integration

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Inherent Benefits of Nasiri Fabrication

• Most suitable for inertial sensors

• Using off‐the‐shelf equipment

• CMOS compatible process allows easy porting

• Most suitable for inertial sensors

• Using off‐the‐shelf equipment

• CMOS compatible process allows easy porting

Bulk Silicon Fabrication

• Enables wafer‐level integrations with CMOS

• Provides wafer level reliable hermetic vacuum seals

• Metallic eutectic bonding , no need for getter

• ~50% die size w/ small seal rings and interconnects,

• Enables wafer‐level integrations with CMOS

• Provides wafer level reliable hermetic vacuum seals

• Metallic eutectic bonding , no need for getter

• ~50% die size w/ small seal rings and interconnects,

Wafer Level Eutectic Bonding

Wafer Level Testing

• Lowest cost semiconductor level testing

• Timely feedback for process and quality monitors

• Lowest cost semiconductor level testing

• Timely feedback for process and quality monitors

• Easily ported to multiple MEMS or CMOS foundries

• Suitable for Gyro, Accel, Pressure, Resonators, more

• Easily ported to multiple MEMS or CMOS foundries

• Suitable for Gyro, Accel, Pressure, Resonators, more

Portable and Versatile

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Opportunity in Packaging

Costly pick and Costly ceramic Costly capping assy Costly integrationCostly pick and place

Costly ceramic package

Costly test and cal

Costly ceramic package

Costly vacuum seal

Costly test

Costly capping assy

Costly getter

Inefficient use of Si

Costly integration

Waste of Si for interconnect

Costly LGA packaing

Inherent Cost Benefit

CMOS‐MEMSWafer Sort

Testing

Low Cost QFN

Assy17

Semiconductor Like Process Flow

CMOS‐MEMS Wafer Sort Packaging FT & Ship

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Mixed‐signal

Nasiri‐Fabrication

MotionProcessing™ Technology

Motion Processor

Integrated

signal CMOS

Fabrication

Integrated MEMS Sensors

Firmware

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MEMS is one component in the system…

…but tightly coupled to CMOS design20


MEMS & IC layouts are coupled too

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MEMS Requires IC‐like Design FlowArchitecture

Mech Design

MEMS + IC Simulation

Si Validation

Mech Verification

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Development Achievements

2006X/Y-Axis gyro

Die Size 12.2mm2

CMOS 0.5um

Output Analog

Power 27mW

2008

2009

X/Y-Axis Gyro

Die Size 7.4mm2

CMOS 0.35um

Output Analog

Power 20mW

Die Size 7.4mm2

CMOS 0.35um

Output Analog

2010

X/Z-Axis Gyro

ITG/MPU-3000X/Y/Z-Axis Gyro

Die Size 6.7mm2

CMOS 0.18um

Output Digital

Power 14mW

p g

Power 20mW

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Lessons Learned…

• Must have some real competitive edge to succeed

Ai t h l t th i ti l ti (2X t 3X)

• Must have some real competitive edge to succeed

Ai t h l t th i ti l ti (2X t 3X)

Go for Breakthrough Solutions

• Aim at much lower cost than existing solutions (2X to 3X)• Aim at much lower cost than existing solutions (2X to 3X)

• Develop proprietary process fabrication IP that can scale

• Consider 2nd source foundries early on

• Develop proprietary process fabrication IP that can scale

• Consider 2nd source foundries early on

Develop Multiple Foundries

D i f L C t S l ti

• Stay with standard packages and test equipment

• Invest in your in‐house testing and calibration facilities

• Stay with standard packages and test equipment

• Invest in your in‐house testing and calibration facilities

Design for Low Cost Solution

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In Summary…

• Very large and rapidly growing market

• Requires complete solution to help customers with time to market

• Very large and rapidly growing market

• Requires complete solution to help customers with time to market

MEMS Motion Processing Market: High Growth Opportunity

• High performance at low cost with rapid production ramp

• Adoption is dependent on few thought leaders

• High performance at low cost with rapid production ramp

• Adoption is dependent on few thought leaders

Challenges with the Consumer Market

• Has taken nearly 20 years for MEMS gyro to meet consumer market needs

• Had to provide over 20X reduction in price, and size

• Has taken nearly 20 years for MEMS gyro to meet consumer market needs

• Had to provide over 20X reduction in price, and size

High Volume MEMS Commercialization

• Fabless MEMS is the only way for new start up to offer new MEMS products

• Must follow fabless semiconductor model as closely as possible

• CMOS‐MEMS and wafer level packaging and testing is the key

• Fabless MEMS is the only way for new start up to offer new MEMS products

• Must follow fabless semiconductor model as closely as possible

• CMOS‐MEMS and wafer level packaging and testing is the key

Development of Low Cost and High Volume MEMS Products

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Thank you

InvenSense Headquarters1197 Borregas Ave.Sunnyvale, California 94089408.988.7339 Main408.988.8104 [email protected]@invensense.com

InvenSense Taiwan1F, 9 Prosperity 1st RoadHsinchu Science Park30076, Taiwan+886.3.6686999 Main+866.3.6686777 Fax

InvenSense Japan G.K.Nisso Building No. 16, 2F3-8-8 Shin YokohamaKohoku-ku, Yokohama222-0033, Japan+81.045.308.9721 Main+81.045.534.3005 Fax

InvenSense Korea Ltd.#601, Jungle Bldg. 206-17Nonhyun-Dong, Gangnam-Gu,Seoul 135-833, Korea+82.2.541.2900 Main+82.2.541.2955 Fax

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