Progress in 3D Printed Multi-functionality Eric MacDonald, PhD PE
Friedman Chair for Manufacturing, Youngstown State University Associate Director, W. M. Keck Center for 3D Innovation, UTEP
Outline
London Museum of Science and Manchester Museum of Industry in exhibit 3D Printed Gun from University of Texas Law Student (confiscated) 3D Printed Satellite from UTEP / UNM COSMIAC
Intro: 3D Printing in International Spot Light
Intro: ASTM F42 Categories
■ Vat Photopolymerization
■ Material Extrusion
■ Powder Bed Fusion
■ Material Jetting
■ Binder Jetting
■ Sheet Lamination
■ Directed Energy Deposition
AM Technologies Available within the UTEP Keck Center
Major Research in Multifunctional 3D Processes and Applications Major research in Arcam EBM Investing in Lasers – SLM, Aconity Recent investment in Binder jetting ExOne – ceramics, metals, RF
Intro: ASTM F42 Categories
■ Vat Photopolymerization
■ Material Extrusion
■ Powder Bed Fusion
■ Material Jetting
■ Binder Jetting
■ Sheet Lamination
■ Directed Energy Deposition
AM at YSU and the America Makes Innovation Factory Youngstown, OH
Research focus on smart tooling, sand casting, computer vision for closed loop control, metal repair,. Starting 3D printed electronics.
Intro: Vat Photopolymerization
■ AM process with a vat of photocurable polymer cured selectively by laser or projector.
■ Benefits • Surface finish • Resolution (75 microns) • uSL (5 microns) • Ambient processing
■ Issues • Materials limitations • Post cleaning
Intro: Materials Extrusion
■ AM process that selectively extrudes a thermoplasitc ■ Based on Stratasys FDM patents (expired patent –> proliferation)
• Most popular
■ Benefits • Office friendly • DIY community • Large volume
■ Issues • Resolution • Surface finish • Z axis anisotropy
Intro: Powder Bed Fusion
■ AM process where thermal energy selectively melts/sinters the top surface of a powder bed.
■ SLS, SLM, DMLS, EBM
• Polymers, metals & ceramics
■ Benefits • Multiple materials (metals, nylon) • Strength • Fully dense
■ Issues • Wasted powder • Powders processing
Intro: Materials Jetting
■ AM process in which photocurable material is inkjetting and immediately cured with a UV lamp
• Wax or Photopolymers • Multiple nozzles • Single nozzles
■ Benefits • Multiple colored materials • Ink jet resolution
■ Issues • Materials limitations
Intro: Binder Jetting
■ AM process depositing binder with inkjetting onto a powder bed and thermally cured – often infiltrated for full density.
■ Zcorp (Dead) • ExOne • Voxeljet • HP Fusionjet ?
■ Benefits • Multiple colors per layer • Wide range of materials
■ Issues • Post furnace cycle • Strength (Z Corp)
Intro: Sheet Lamination
■ AM process in which laminate material is bonded and selectively removed
• Paper – glue • Plastic – glue / heat • Metal – UC welding
■ Benefits • Materials choices
– Aluminum (UC)
• Strength (UC)
■ Issues • Waste • Additional steps
Intro: Directed Energy Deposition
■ AM process in which material and energy are applied coincidently to the layer.
■ Benefits • Feature addition and repair • Wire & Powder Materials • Lasers & Electron Beams
■ Optomec LENS – – Good resolution but slower
■ Sciaky – Large build (19’x4’x4’) – Fast (20 Lbs / hour) – Lower resolution\
■ Ambit
UTEP closer to San Diego than Houston YSU < six hours from NYC, Chicago, Pitt, Cleveland, DC, Philly
Intro: Where are El Paso and Youngstown?
• Founded in 2000 – 13,000 sq. ft. facility with over 50 3D printers • R&D projects with over 100 industrial clients and ten federal agencies • More than 50 student researchers and seven full-time staff • Broad and expanding patent portfolio • Everything we do uses 3D printing technologies
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Intro: UTEP’s Keck Center
• Founded in 2000 – 13,000 sq. ft. facility with over 50 3D printers • R&D projects with over 100 industrial clients and ten federal agencies • More than 50 student researchers and seven full-time staff • Broad and expanding patent portfolio • Everything we do uses 3D printing technologies
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Intro: YSU’s CIAM Center
Intro: 3D Printing in International Spot Light
http://www.journals.elsevier.com/additive-manufacturing/
■ Ryan Wicker Editor in Chief ■ Eric MacDonald, Deputy Editor
■ Mireya Perez, Managing Editor
■ Introducing fast-publication, science-based, peer-reviewed journal for academia / industry
■ Inaugural issue in Summer 2014
■ Topics:
• Design and Modeling
• AM processes and process enhancement
• Multiple and novel materials
• Special applications with multi-functionality
Materials: Twin Screw Extruder Matrix
Material
Additives
Extruder Unit
Extruded Composites
3D Printed Structures
3D Printer
Extrude thermoplastic feedstock (3D printer specialty ink): • Increase Material Strength, Hardness, Flexibility, Stretchability • Optimize Permittivity / Permeability • Increase Thermal Conductivity • Improve Radiation Shielding
• Tungsten impregnation • High Density Polyethylene (HDPE)
Materials: Heavy Metal Composites
• Tungsten powder in Polycarbonate – Trade-off between:
• Weight • Strength • Thermal / electrical conductivity • Radiation attenuation
– 3D printed geometries for shielding – Optimize unused volume for protection
Radiation shielding
Additives Permittivity Extruded CaTiO3 165 Yes
SrTiO3 233 Yes
TiO2, anatase 48 Yes
TiO2, rutile 114 Yes
NaCl 5.9 Yes
Fe3O4 Permeability Yes
Tungsten Rad. Shield Yes
Zeonex Low Loss Yes
Extrusion of E&M Polycarbonate
Goals: Radiation Shielding Low Loss Antennas Electrically Large Antennas Electromechanical Devices
Materials: RF and Magnetic Materials
Materials: Flexibility / Stretchability
• UTEP Proprietary Polymer Blend – ABS/SEBS Blend – Tunable strain – Wires embed structurally
ABS Grade MG94 blended with Kraton SEBS-g-MA. Tunable strain from 3.32 ± 0.7 % to 1506.57 ± 90.1%
Complementary Manufacturing
3D Printing for Dielectric Structures
Enhanced thermoplastics
Technology: 3D Printed Electronics
In low Earth Orbit
Ceramics
Photo- polymers
wires dispensing
machining
lasers
motors
conformal
3d sensors
3d sensors
Satellites
Technology: Ultra sonic / thermal embedding
copper wire
3D printed thermoplastic substrate
Laser Micro-Welding
Technology: Replacing Conductive Inks
Replace inks with bulk copper: - High conductivity - Good density (80 micron wires) - Low cost relative to silver inks - Laser welding for connections
100 microns
anvil double-sided tape ABS substrate metal mesh polyimide film
vertically oscillating
horn
scanning direction
0 5
10 15 20 25 30 35 40 45
Aver
age
Yiel
d St
reng
th (M
Pa)
Theoretical
Actual
Technology: Serendipitous enhancements
Mechanical reinforcement: - Essentially a composite - Structurally integrated wires - Improving anisotropy
Technology: Milled Foils for Intricate Patterns
0.075”
0.080”
0.020” 0.125” 35 micron thick copper foil is
equivalent to PCB plating. Smooth surface is well-suited for RF apps at high frequency.
Technology: Original Multi3D Manufacturing
Technology: Independent Wire Embedding
• Lockheed Martin / Wolf Robotics Factory of the Future • Point wise Composition Control
• “Borrowing” UTEP Wire Embedding • Displayed at Defense Manufacturing Conference Exhibition
600 micron diameter copper wire
Technology: Next Gen Multi3D
Foil applica)on will milling
• Consolidated single gantry fabrica)on system. • Tool exchanger • Five degrees of freedom • 200 °C Build Chamber • Full opera)on on schedule for Oct 16
Pellet fed extrusion / tool exchange
Wire embedding
Technology: Big Area AM (BAAM) with Multi3D
Grant for Integra)ng hybrid wire embedding into Oak Ridge technology
Base fabrica)on born from Oak Ridge and LMC.
Commercialized by Cincinna), Inc and car design and fabrica)on by Local Motors, Inc
Demonstrations: Conformal Electronics
Demonstrations: Satellite Electronics
To avoid this wiring clutter…
Wiring bus in structure
Bus connector
Solar panels in walls
Demonstrations: 3D Printed Propulsion
• Busek Pulsed Plasma Thrusters • requiring high voltage (1-10kV) • non-toxic Teflon propellant
• Dielectric strength and leakage testing • Propulsion (micro-newton) testing at
Glenn NASA.
Propulsion Test Plate
Demonstrations: 3D Printed Thermal Mgmt
Textured Radiator intended for space applications
3D Printed Graphite
34
1 2 3 4 5 6 7 8 9 1030−
20−
10−
0
Attached BalunMesh BalunEmbedded Balun
Spiral Iteration 2 Return Loss
Frequency [GHz]
S11
[dB
]
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90-18
-16
-14
-12
-10
-8
-6
-4
-2
0
Azimuth (degrees)
Norm
aliz
ed M
agni
tude
(dB)
Radiation PatternArchimedian Spiral - Embedded Balun (f = 2.3 GHz)
LHCPRHCP
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90-22
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
Azimuth (degrees)
Norm
aliz
ed M
agni
tude
(dB)
Radiation PatternArchimedian Spiral - Attached Balun (f = 2.3 GHz)
LHCPRHCP
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
-14
-12
-10
-8
-6
-4
-2
0
Azimuth (degrees)
Norm
aliz
ed M
agni
tude
(dB)
Radiation PatternArchimedian Spiral - Mesh Balun (f = 2.3 GHz)
LHCPRHCP
Demonstrations: Archimedes Antenna Results
Demonstrations: Conformal Patch Antennas
Again, Patch A was designed for 5.85 GHz, and Patch B for 5.65 GHz with no fringing factor. Measurement showed the actual resonances to occur at 6.27 GHz and 6.18 GHz although the S11 curve was much higher as compared to the foil patches.
A
B
5 5.2 5.4 5.6 5.8 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 8.2 8.4 8.6 8.8 930−
20−
10−
0
Mesh Patch AMesh Patch B
Conformal Mesh Patch Antennas
Frequency [GHz]
S11
[dB
]
Demonstrations: 3D Printed UAVs
Demonstrations: 3D Printed Motor
Computer Vision: Defects Easily Identified
Precise geometric data is captured from image for comparison against GCODE and CAD.
Computer Vision: Fourier Analysis
Frequency content describes roughness of surfaces or uniformity of powder.
Smooth Surfaces
Rough Surfaces
2D Freq Spectrum
Computer Vision: Video Feature Tracking
Tracking of heads, tips, salient process features.
Computer Vision: Electron Beam Tracking
Geographical data collected from real time in IR video of electron beam melting of one layer of a cylinder in an evacuated build chamber. Detecting difference from frame to frame. Fumes causing false detections but easily filtered.
Identical video with persistent dots. 4X speed.
Computer Vision: Thermographic Evaluation
Open Source computer vision, one image per layer.
Standard camera and $200 FLIR Lepton camera.
Tool path modified to hide “hot” extruder after each layer.
2D side profiling with high resolution geometry verification.
Computer Vision: Geometric Verification
Computer Vision: Debris Detection
Precise pixel-level measurement of existing layers during print. Virtual and dynamic calipers.
Three layers are monitored for width changes during subsequent layers
Computer Vision: Layer Width Measurement
Conclusion: Campus Architecture
Inspired by a 1916 National Geographic photo essay of the Kingdom of Bhutan Buddhist Himalayan Architecture
When YSU president Jim Tressel speaks, I instinctively want to deliver a open field tackle. GO PENGUINS!
UTEP
YSU
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