© 2006, D. C. Hopkins [email protected]
LAMINATED BUS BAR
Presented byDouglas C. Hopkins, Ph.D.
University at Buffalo332 Bonner Hall, Buffalo, NY 14620-1900
607-729-9949, fax: 607-729-7129www.DCHopkins.Com
The authors thank ELDRE CORPORATION
for supplying photos and descriptions
© 2006, D. C. Hopkins [email protected]
Laminated Bus-Bar
• A polymer, such as epoxy, glues together thick conductor bars while providing electrical isolation. The bars can be free-floating laminated interconnects or, if sufficiently thick, be the metal carrier. Vias between layers are metal posts or fasteners placed through drilled or stamped holes. These are used in high current systems and can accommodate very large components.
• Bus Bars are used in power engineering, laminated bus bars are used in power electronics.
© 2006, D. C. Hopkins [email protected]
Paradigm shift
Image a printed circuit board with multi-level interconnects. Imagine the the glass-epoxy is dissolved away and the conductors are enlarged with thin dielectric films separating conductors. Described is the capability of multi-level laminated bus bar systems.
© 2006, D. C. Hopkins [email protected]
Inductive Effects (Conductor Types)Design Aspects for Inverters
with IGBT High Power Modules
Dr.-Ing. Th. Schütze , eupecGmbH & Co KG, Warstein,
Germany
© 2006, D. C. Hopkins [email protected]
ABS brake component
3 conductor, 2 layer bus bar 5,000 / week production
Bus Bar - ABS Brake
With permission from Eldre Corporation
© 2006, D. C. Hopkins [email protected]
EUPEC Power Module
Design Aspects for Inverters with IGBT High Power
ModulesDr.-Ing. Th. Schütze , eupecGmbH & Co KG, Warstein,
Germany
© 2006, D. C. Hopkins [email protected]
Electric Vehicle Bus Bars
Coil for an inductive charging system
Mylar insulation with glass (FR-4) reinforced Hipot tested under water
Bus Bar - Electric Vehicle
With permission from Eldre Corporation
© 2006, D. C. Hopkins [email protected]
2nd generation inverter design
Laminated Construction
Bus Bar - Electric Vehicle
With permission from Eldre Corporation
© 2006, D. C. Hopkins [email protected]
Power Module Interconnect
Design Aspects for Inverters with IGBT High Power
ModulesDr.-Ing. Th. Schütze , eupecGmbH & Co KG, Warstein,
Germany
© 2006, D. C. Hopkins [email protected]
Electric boost for turbo
Open design - no outside insulation
Capacitors soldered directly to the bus
Designed for high volume production
Bus Bar - Electric Vehicle
With permission from Eldre Corporation
© 2006, D. C. Hopkins [email protected]
Electric Vehicle MOSFET motor drive using low inductance PC board mounted
bus bars.
Bus Bar - Electric Vehicle
With permission from Eldre Corporation
© 2006, D. C. Hopkins [email protected]
MOSFET inverter
28VDC to 3ph AC
1000 Amp peak
Designed for 1000/week production
Bus Bar - Electric Vehicle
With permission from Eldre Corporation
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