Rework and Repair of PCBs Solder/Assembly Training
Rework/Repair Soldering Tools
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BGA Rework
I.I. Why ReworkWhy Rework
II.II. Scope of Material CoveredScope of Material Covered
III.III. BGA Rework ProcessBGA Rework ProcessA.A. RemovalRemoval
B.B. Site DressingSite Dressing
C.C. PlacementPlacement
D.D. ReflowReflow
E.E. CleaningCleaning
F.F. InspectionInspection
IV.IV. MaterialsMaterials
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BGA Rework-Why Rework?
Misplaced part Part Upgrade Failed Part Do not know why
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BGA Rework-A PrimerSCOPE
Plastic packages attachment of new parts using hot air as the reflow source
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BGA Rework-A PrimerSCOPE
Reference DocumentsIPC-A-610IPC-7095
IPC 7711/21IPC J-STD-020IPC J-STD-033
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BGA Rework-the process
Removal-controlled heat sourceObjective is to get the device off as quickly as possible without damaging the device (may need to reball and use again) or neighboring devices or the laminate
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BGA Rework-the processRemoval-locating the right location
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BGA Rework-the processRemoval-controlled heat source-bottom side preheat
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BGA Rework-the processRemoval-bakeout if need to reball or salvage the component
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BGA Rework-the processRemoval-popcorning and wire bonding damage
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Removal-controlled heat source-bottom side preheat
BGA Rework-the process
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Removal-proper board holders
BGA Rework-the process
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Removal-controlled heat sourceShield the surrounding area
BGA Rework-the process
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Removal-controlled heat sourceShield the surrounding area
BGA Rework-the process
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Removal-controlled heat sourceProfile on, underneath and next to the device
BGA Rework-the process
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Removal-controlled heat sourceTypical Removal Profile-tin lead
BGA Rework-the process
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Removal-controlled heat sourceTypical Removal Profile- lead-free
BGA Rework-the process
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