© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
Amphenol M.2(NGFF) Connector Brochure
M.2
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2(NGFF) Introduction
The M.2 form factor is used for Mobile Add-In cards. It is a natural transition from the Mini Card and Half Mini Card to a smaller form factor both in size and volume.
M.2 (NGFF) supports multiple functions.
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2 Connector Description:75 positions (67 active lines with 8 positions dedicated to mechanical keying)Single and Dual Mechanical keying allows for multiple standardsTwo rows of contacts @ 0.50mm pitch; bottom row staggered 0.25mm from top rowSupports multiple standard card widths (12mm, 16mm, 22mm and 30mm)Supports multiple standard card lengths (16mm, 26mm, 30mm, 38mm, 42mm, 60mm, 80mm and 110mm)
M.2 Module Description:M.2 specification standardizes multiple module sizes
• Allows for Single- or Dual-sided Components on modules• Allows for Connectorized or Soldered-Down modules
Will support multiple function add-in cards/modules• SATA or PCIe x2 fits “B” key for SSD, WWAN, other non-storage devices• PCIe x4 up to 4GB/s fitting “M” key modules for high performance SSD
M.2(NGFF) Introduction
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M.2(NGFF) Application Fields
Smart TV
Server
Smart Networking
Tablet
PC/Ultrabook
Mobile Phone
GNNS/BT
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M.2 Modular Card Overview
What type of Cards & applications use key A, E, B, M?Key Module Card Type Application
A 1630, 2230, 3030 Wireless: Wi-Fi,BT, NFC, & or WiGig
E 1630, 2230, 3030, Wireless: Wi-Fi,BT, NFC, & or GNSS
B 3042, 2230, 2242, 2260, 2280, 22110 WWAN+GNSS or SSD
M 2242, 2260, 2280, 22110 SSD, PCIe or SATA
Key G is designed for Non-M.2 compliant devices and future Memory interface.
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2 Modular Card Overview
NOTE: KEY OPTION IS A REPRESENTATION ONLYAND DOES NOT PROHIBIT ADDITION OPTIONS
GENERAL TOLERANCE IS ± 0.15
TYPE 1630-xx-E
TOP SIDECOMPONENT
AREA
16.5
30
TYPE 3026-X
TOP SIDECOMPONENT
AREA
30
26
TYPE 2226-X
TOP SIDECOMPONENT
AREA
22
26
TYPE 1216-X
TOP SIDECOMPONENTAREA
12
16
TYPE 2230-xx-E
TOP SIDECOMPONENT
AREA
22
30
TYPE 3030-xx-A
TOP SIDECOMPONENT
AREA
30
30
TYPE 2242-xx-B-M
TOP SIDECOMPONENT
AREA
TOP SIDECOMPONENT
AREA
22
42
TYPE 3042-xx-B
TOP SIDECOMPONENT
AREA
30
42
TYPE 2260-xx-M
TOP SIDECOMPONENT
AREA
22
60
TYPE 2280-xx-B-M
TOP SIDECOMPONENT
AREA
22
80
22
110
TOP SIDECOMPONENT
AREA
TYPE 22110-xx-B-M
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2 (NGFF) – Keying Configurations
MechanicalKey Assignment
Preferred & Optional Module Configurations
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2(NGFF) Connector/ Module Supported Matrix
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M.2 Module Card / Connector Height Recommendation
Mid Line Connector Height
Mid Line Single Sided Module
Mid Line Double Sided Module
4.2/ 3.2 / 2.8 H
Top Side Connector Height
Single Sided Module
2.5 / 2.3 H
Unit: mm
Double Sided ModuleTop Side
Bottom Side
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2(NGFF) Connector Parametric Specifications
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2(NGFF) Connector Parametric Specifications
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2(NGFF) Connector Parametric Specifications
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2(NGFF) Connector Triple Insertion Module Method
Step 1: Move the module against the housing's chamber
Step 2: Rotate the module to 20 degrees and insert it until the bottom of the connector
Step 3: Rotate the module to horizontal position by hand
Step 4: Fix the module with a PCB screw to secure the module
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
M.2(NGFF) Connector Module Fix
Stand-off
Screw
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Amphenol M.2(NGFF) Connector P/N System
M D T XXX X XX XXX
XXX
Connector height
420 H=4.20 mm
275 H=2.75 mm
180 H=1.80 mm
…
X Connector key ID
A: key A
B: key B
E: key E
M: key M
…
XxPlating Spec
01 0.76 um Au
02 0.38 um Au
03 Gold flash
XXX
Sequence number
001
002
…
Series Code
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M.2(NGFF) Connector Signal Integrity Measurement Results
1: Introduction This technical bulletin presents measured electrical performance data on
67pin M.2 PCIe connector using frequency domain vector network analyzer (VNA) and time domain reflectometer (TDR) test equipment. Measured parameters include calibrated S-parameters and TDR reflections due to impedance mismatch.
Measurement SetupFreq domain test equipment: Agilent N5230C 4-port VNAFreq domain test frequency range: 10MHz—20GHz (2000 points).Time domain test equipment: Tektronix DSA8200 with 80E04 module.Time domain test rise time: 50ps(20-80%).
Measurement Calibrationmethod: TRL calibration to the end of PCB Microstrip(De-embedding).
The calibration helps to remove the test fixture effects.Test results only included 67pin M.2 PCIe Connector with thefootprint and few PCB trace(0.7mm).
All S-parameter test results Re-normalized to 85ohm reference impedance.
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2. High Speed Signal Assignment
Top layerpins row(pin1~67)
Bottom layerpins row(pin2~66)
Pin33GND
Pin35&37Diff Pair
Pin39GND
Pin41&43Diff Pair
Pin45GND
Pin32GND
Pin34&36Diff Pair
Pin38GND
Pin40&42Diff Pair
Pin44GND
Top layer pins row
Bottom layer pins row
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
3. Test Fixture PCB Layout
Notes:Microstrip length each is 40mm onboth motherboard and daughtercard.Microstrip substrate material is FR4,the DK is 4.2 and DF is 0.02.
Motherboard Daughtercard
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
4. DUT
Calibration Board for De-embeddingM.2 PCIe connector SI test fixture
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
5. Differential Return Loss
0 2 4 6 8 10 12 14 16 18 20-40
-35
-30
-25
-20
-15
-10
-5
0
frequency GHz
Mag
nitu
de in
dB
Differential Reflection
Top Layer Pins Row: MB SideTop Layer Pins Row: DC SideBottom Layer Pins Row: MB SideBottom Layer Pins Row: DC SideSignal Integrity Spec Rev1.0
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
6. Differential Insertion Loss
0 2 4 6 8 10 12 14 16 18 20-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
frequency GHz
Mag
nitu
de in
dB
Differential Transmission
Top Layer Pins RowBottom Layer Pins RowSignal Integrity Spec Rev1.0
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
7. Differential NEXT
0 2 4 6 8 10 12 14 16 18 20-60
-50
-40
-30
-20
-10
0
frequency GHz
Mag
nitu
de in
dB
Differential Near end Crosstalk
In Top Layer Pins Row: MB SideIn Top Layer Pins Row: DC SideIn Bottom Layer Pins Row: MB SideIn Bottom Layer Pins Row: DC SideTop Layer to Bottom Layer: MB SideTop Layer to Bottom Layer: DC SideSignal Integrity Spec Rev1.0
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
8. Differential FEXT
0 2 4 6 8 10 12 14 16 18 20-60
-50
-40
-30
-20
-10
0
frequency GHz
Mag
nitu
de in
dB
Differential Far end Crosstalk
In Top Layer Pins Row: MB Side VictimIn Top Layer Pins Row: DC Side VictimIn Bottom Layer Pins Row: MB Side VictimIn Bottom Layer Pins Row: DC Side VictimTop Layer to Bottom Layer: MB Side VictimTop Layer to Bottom Layer: DC Side VictimSignal Integrity Spec Rev1.0
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
9. Differential Impedance
45.4 45.6 45.8 46 46.2 46.4 46.6 46.870
75
80
85
90
95
100
105Top Layer Pin35&37 Differential TDR @ Rise Time=50ps(20-80%)
Time (ns)
ohm
MotherBoard to DaughterCardDaughterCard to MotherBoard
Coaxial cable
SMA
PCB Trace
M.2 Connector
PCB Trace
Load
45.4 45.6 45.8 46 46.2 46.4 46.6 46.870
75
80
85
90
95
100
105Bottom Layer Pin34&36 Differential TDR @ Rise Time=50ps(20-80%)
Time (ns)
ohm
MotherBoard to DaughterCardDaughterCard to MotherBoard
Coaxial cable
SMA
PCB Trace
PCB Trace
M.2 Connector
Load
Impedance results met requirement of 85ohm connection system.
M.2(NGFF) Connector Signal Integrity Measurement Results
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
Amphenol M.2(NGFF) Connectors
M1.8, H2.8, H4.2 key ID A, B, E, M have been tooled up, drawings please refer to right side pdfs:
H2.8
H4.2
M1.8
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M.2(NGFF) Connectors in board
© 2014 Amphenol Corporation • Company Confidential • All Rights Reserved
• M.2 key A connector is suitable for applications that use wireless connectivity including Wi-Fi,
Bluetooth, NFC, and WiGig. Module card types include 1630, 2230 and 3030.
• M.2 key B connector is suitable for applications that use WWAN+GNSS or Solid State Storage
Devices (SSD). Module card types include 3042, 2230, 2242, 2260, 2280 and 22110.
• M.2 key E connector is suitable for applications that use wireless connectivity including Wi-Fi,
Bluetooth, NFC of GNSS. Module card types include 1630, 2230 and 3030.
• M.2 key M connector is suitable for applications that use Host I/Fs supported by either PCIe or
SATA, or Solid State Storage Devices (SSD). Module card types include 2242, 2260, 2280
Amphenol M.2(NGFF) Connectors - Key applications
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SSD Storage Interface Roadmap
M.2 is the future!
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