Download - 400µm 12mm Steps Towards Mass Production - Stackspx491tp4561/SJ Osterfeld...Layer A: PDMS Microfluidics Testing and Protocol Optimization Steps Towards Mass Production Sebastian J.

Transcript

Lay

er A

: PD

MS

Mic

roflu

idic

s

Test

ing

and

Prot

ocol

Opt

imiz

atio

nTe

stin

g an

d Pr

otoc

ol O

ptim

izat

ion

Step

s To

war

ds M

ass

Prod

uctio

nSt

eps

Tow

ards

Mas

s Pr

oduc

tion

Seba

stia

n J.

Ost

erfe

ldSe

bast

ian

J. O

ster

feld

11 , , Sh

uSh

u --Je

n H

anJe

n H

an11 ,

Stef

ano

Car

amut

a, S

tefa

no C

aram

uta22

, , Lia

ngL

iang

Xu

Xu11

, , Hen

gH

eng

Yu

Yu22

, Jin

Xie

, Jin

Xie

33

Shou

heng

Shou

heng

Sun

Sun33

, , Nad

erN

ader

Pour

man

dPo

urm

and22

, Sha

n X

. Wan

g, S

han

X. W

ang11

1. S

tanf

ord

Uni

vers

ity1.

Sta

nfor

d U

nive

rsity

2. S

tanf

ord

Gen

ome

Tec

hnol

ogy

Cen

ter

2. S

tanf

ord

Gen

ome

Tec

hnol

ogy

Cen

ter

3. B

row

n U

nive

rsity

3. B

row

n U

nive

rsity

(Pro

ject

fund

ed b

y D

AR

PA

)(P

roje

ct fu

nded

by

DA

RP

A)

Tes

ting

and

Fabr

icat

ion

of th

e M

agA

rray

Tes

ting

and

Fabr

icat

ion

of th

e M

agA

rray

®®B

ioch

ipB

ioch

ip

Our

aim

is

to r

epea

tedl

y te

st p

roto

type

chi

ps w

ith a

var

iety

of

Our

aim

is

to r

epea

tedl

y te

st p

roto

type

chi

ps w

ith a

var

iety

of

nano

part

icle

sna

nopa

rtic

les ,

bio

logi

cal

mol

ecul

es,

and

vario

us

, bi

olog

ical

mol

ecul

es,

and

vario

us

expe

rimen

tal

prot

ocol

s, t

o de

term

ine

and

impr

ove

the

perf

orm

ance

expe

rimen

tal

prot

ocol

s, t

o de

term

ine

and

impr

ove

the

perf

orm

ance

char

acte

ristic

s of

the

Mag

Arr

ay.

For

max

imum

ch

arac

teris

tics

of t

he M

agA

rray

. Fo

r m

axim

um

flexi

bilit

y, e

ach

chip

nee

ds t

o be

ind

ivid

ually

fun

ctio

naliz

ed w

flexi

bilit

y, e

ach

chip

nee

ds t

o be

ind

ivid

ually

fun

ctio

naliz

ed w

ith

ith b

iom

olec

ules

biom

olec

ules

. A

s a

resu

lt, t

he p

roto

type

chi

ps e

mpl

oy

. A

s a

resu

lt, t

he p

roto

type

chi

ps e

mpl

oy

sens

ors

on a

fre

ely

acce

ssib

le s

urfa

ce,

and

mac

rosc

opic

flu

idic

sse

nsor

s on

a f

reel

y ac

cess

ible

sur

face

, an

d m

acro

scop

ic f

luid

ics

are

empl

oyed

ins

tead

of

are

empl

oyed

ins

tead

of

mic

roflu

idic

sm

icro

fluid

ics

to d

eliv

er t

he

to d

eliv

er t

he

reag

ents

dur

ing

the

mea

sure

men

t.re

agen

ts d

urin

g th

e m

easu

rem

ent.

Left:

A p

roto

type

Mag

Arr

ay4

chip

, mad

e Le

ft: A

pro

toty

pe M

agA

rray

4 ch

ip, m

ade

at S

tanf

ord.

Ins

ide

the

wel

l are

two

free

ly

at S

tanf

ord.

Ins

ide

the

wel

l are

two

free

ly

acce

ssib

le

arra

ys,

each

co

ntai

ning

16

ac

cess

ible

ar

rays

, ea

ch

cont

aini

ng

16

indi

vidu

ally

add

ress

able

sen

sors

. A

t th

e in

divi

dual

ly a

ddre

ssab

le s

enso

rs.

At

the

Stan

ford

Gen

ome

Tech

nolo

gy C

ente

r, th

e St

anfo

rd G

enom

e Te

chno

logy

Cen

ter,

the

16

sens

ors

on

the

left

are

man

ually

16

se

nsor

s on

th

e le

ft ar

e m

anua

lly

func

tiona

lized

w

ith

a di

ffer

ent

func

tiona

lized

w

ith

a di

ffer

ent

bioc

hem

istry

tha

n th

e 16

sen

sors

on

the

bioc

hem

istry

tha

n th

e 16

sen

sors

on

the

right

. Add

ition

al s

enso

rs, i

n th

is c

ase

32,

right

. Add

ition

al s

enso

rs, i

n th

is c

ase

32,

are

cove

red

with

epo

xy a

nd s

erve

as

an

are

cove

red

with

epo

xy a

nd s

erve

as

an

abso

lute

con

trol.

abso

lute

con

trol.

25m

m

Rig

ht:

Afte

r fu

nctio

naliz

atio

n,

the

Rig

ht:

Afte

r fu

nctio

naliz

atio

n,

the

chip

is

re

turn

ed

to

Stan

ford

ch

ip

is

retu

rned

to

St

anfo

rd

Uni

vers

ity fo

r mea

sure

men

ts. D

urin

g U

nive

rsity

for m

easu

rem

ents

. Dur

ing

the

prot

otyp

e ex

perim

ents

, th

e pr

otot

ype

expe

rimen

ts,

mac

roflu

idic

sm

acro

fluid

ics

are

empl

oyed

to

ar

e em

ploy

ed

to

repe

ated

ly t

rans

port

the

reag

ents

to

repe

ated

ly t

rans

port

the

reag

ents

to

and

from

the

chip

. Not

sho

wn

are

the

and

from

the

chip

. Not

sho

wn

are

the

read

out

elec

troni

cs

and

mag

netic

re

adou

t el

ectro

nics

an

d m

agne

tic

field

gen

erat

ors f

or th

e ch

ip.

field

gen

erat

ors f

or th

e ch

ip.

Whi

le t

he p

roto

type

chi

ps r

each

mat

urity

, we

also

wor

k to

W

hile

the

pro

toty

pe c

hips

rea

ch m

atur

ity, w

e al

so w

ork

to t

otoen

sure

tha

t th

e fu

nctio

naliz

atio

n pr

otoc

ol a

nd e

xper

imen

tal

ensu

re t

hat

the

func

tiona

lizat

ion

prot

ocol

and

exp

erim

enta

l pr

oced

ure

can

be q

uick

ly m

igra

ted

to a

mas

spr

oced

ure

can

be q

uick

ly m

igra

ted

to a

mas

s --pr

oduc

ed v

ersi

on o

f th

e M

agA

rray

. Thi

s ef

fort

enc

ompa

sses

thr

ee

prod

uced

ver

sion

of

the

Mag

Arr

ay. T

his

effo

rt e

ncom

pass

es t

hree

crit

ical

cr

itica

l ar

eas:

Who

lear

eas:

Who

le-- w

afer

rob

otic

bio

func

tiona

lizat

ion,

alig

nmen

tw

afer

rob

otic

bio

func

tiona

lizat

ion,

alig

nmen

t --an

d to

pogr

aphy

tol

eran

t an

d to

pogr

aphy

tol

eran

t m

icro

fluid

ics

mic

roflu

idic

sfo

r re

agen

t tr

ansp

ort,

for

reag

ent

tran

spor

t, an

d m

ass

and

mas

s --pr

oduc

ible

pr

oduc

ible

mic

roflu

idic

mic

roflu

idic

inte

rcon

nect

s th

at d

o no

t req

uire

the

drill

ing

of h

oles

. All

thin

terc

onne

cts

that

do

not r

equi

re th

e dr

illin

g of

hol

es. A

ll th

ese

thre

e ar

eas

are

desi

gned

es

e th

ree

area

s ar

e de

sign

ed

to b

ecom

e in

tegr

al p

arts

of t

he m

anuf

actu

ring

proc

ess.

to b

ecom

e in

tegr

al p

arts

of t

he m

anuf

actu

ring

proc

ess.

Who

leW

hole

-- Waf

er R

obot

ic B

iofu

nctio

naliz

atio

nW

afer

Rob

otic

Bio

func

tiona

lizat

ion

Mas

sM

ass --

Prod

ucib

le

Prod

ucib

le M

icro

fluid

icM

icro

fluid

icIn

terc

onne

cts

Inte

rcon

nect

s

Sens

ors 1

-16:

D

NA

or A

ntig

en1

Sens

ors 4

9-64

:B

are

or A

ntig

en2

The

Prot

otyp

e M

agA

rray

4 C

hip

The

Prot

otyp

e M

agA

rray

4 C

hip

Rep

rese

ntat

ive

Func

tiona

lizat

ion

and

Rep

rese

ntat

ive

Func

tiona

lizat

ion

and

Expe

rimen

tal P

roto

col

Expe

rimen

tal P

roto

col

Mag

netic

nan

opar

ticle

w/ S

trept

avid

inA

ntig

en 1

: Fer

ritin

Bio

tinA

ntib

ody

(Ant

i-Fer

ritin

)A

ntig

en 2

: BSA

Nan

opar

ticle

Solu

tion

Sens

ors 1

7-48

Sens

ors 4

9-64

Sens

ors 1

-16

Epox

y

Ant

ibod

y So

lutio

n

Sens

ors 1

7-48

Sens

ors 4

9-64

Sens

ors 1

-16

Epox

y

BSA

Sol

utio

nFe

rriti

nSo

lutio

n

Sens

ors 1

7-48

Sens

ors 4

9-64

Sens

ors 1

-16

Epox

y

Func

tiona

lizat

ion

1. T

he a

ntig

ens a

re a

pplie

d se

lect

ivel

y

Mea

sure

men

t Res

ults

Mea

sure

men

t Res

ults

Show

n on

the

rig

ht i

s a

mea

sure

men

t cu

rve

that

was

Sh

own

on t

he r

ight

is

a m

easu

rem

ent

curv

e th

at w

as

reco

rded

as

MA

CS

reco

rded

as

MA

CS

nano

parti

cles

nano

parti

cles

, coa

ted

with

, c

oate

d w

ith s

trept

avid

inst

rept

avid

in, ,

wer

e bi

ndin

g to

a M

agA

rray

4 ch

ip.

Som

e se

nsor

s on

the

w

ere

bind

ing

to a

Mag

Arr

ay4

chip

. So

me

sens

ors

on t

he

chip

wer

e ba

re.

Thes

e re

sulte

d in

the

yel

low

sig

nal

curv

e ch

ip w

ere

bare

. Th

ese

resu

lted

in t

he y

ello

w s

igna

l cu

rve

with

a fi

nal v

alue

of c

a. 1

w

ith a

fina

l val

ue o

f ca.

1 µµ

V.

V.

Oth

er s

enso

rs o

n th

e sa

me

chip

wer

e fu

nctio

naliz

ed w

ith

Oth

er s

enso

rs o

n th

e sa

me

chip

wer

e fu

nctio

naliz

ed w

ith

sing

le s

trand

ed

sing

le s

trand

ed b

iotin

ylat

edbi

otin

ylat

edD

NA

. Th

ese

sens

ors,

in r

ed,

DN

A.

Thes

e se

nsor

s, in

red

, sh

ow a

rapi

d in

crea

se in

sig

nal t

o ca

. 38

show

a ra

pid

incr

ease

in s

igna

l to

ca. 3

8 µµ V

as

soon

as

the

V a

s so

on a

s th

e na

nopa

rticl

esna

nopa

rticl

esar

e ap

plie

d ar

ound

t =

25 m

inut

es. T

hus,

the

are

appl

ied

arou

nd t

= 25

min

utes

. Thu

s, th

e na

nopa

rticl

esna

nopa

rticl

esar

e cl

early

reve

alin

g th

e pr

esen

ce o

f DN

A o

n ar

e cl

early

reve

alin

g th

e pr

esen

ce o

f DN

A o

n th

e ch

ip w

ith a

sig

nal t

o no

ise

ratio

of c

a. 3

1 dB

. The

sig

nal

the

chip

with

a s

igna

l to

nois

e ra

tio o

f ca.

31

dB. T

he s

igna

l ris

e tim

e of

the

red

cur

ve c

an a

lso

give

ins

ight

s in

to t

he

rise

time

of t

he r

ed c

urve

can

als

o gi

ve i

nsig

hts

into

the

bi

otin

biot

in-- s

trept

avid

inst

rept

avid

inbi

ndin

g ki

netic

s. bi

ndin

g ki

netic

s.

Not

e th

at th

e w

ashi

ng th

e ch

ip w

ith

Not

e th

at th

e w

ashi

ng th

e ch

ip w

ith d

eion

ized

deio

nize

dw

ater

(H2O

) w

ater

(H2O

) le

ads

to t

empo

rary

shi

fts i

n th

e si

gnal

, bu

t it

does

not

le

ads

to t

empo

rary

shi

fts i

n th

e si

gnal

, bu

t it

does

not

re

mov

e th

e re

mov

e th

e na

nopa

rticl

esna

nopa

rticl

es. T

he w

ash

at t

= 73

min

utes

onl

y . T

he w

ash

at t

= 73

min

utes

onl

y m

inim

ally

redu

ces t

he si

gnal

m

inim

ally

redu

ces t

he si

gnal

--M

AC

S ar

e bo

und

stro

ngly

.M

AC

S ar

e bo

und

stro

ngly

.

In th

e se

cond

fig

ure,

a d

iffer

ent f

unct

iona

lizat

ion

base

d on

In

the

seco

nd f

igur

e, a

diff

eren

t fun

ctio

naliz

atio

n ba

sed

on

antib

odie

s w

as u

sed.

The

red

cur

ve s

how

s th

e bi

ndin

g of

an

tibod

ies

was

use

d. T

he r

ed c

urve

sho

ws

the

bind

ing

of

nano

parti

cles

nano

parti

cles

to t

he

to t

he f

errit

infe

rriti

n --fu

nctio

naliz

ed s

ites.

The

larg

e fu

nctio

naliz

ed s

ites.

The

larg

e si

gnal

incr

ease

of t

hese

site

s re

veal

s th

e pr

esen

ce o

f an

anti

sign

al in

crea

se o

f the

se s

ites

reve

als

the

pres

ence

of a

n an

ti --fe

rriti

nfe

rriti

nan

tibod

y. O

n th

e ot

her

hand

, the

lac

k of

a d

istin

ct

antib

ody.

On

the

othe

r ha

nd, t

he l

ack

of a

dis

tinct

si

gnal

inc

reas

e of

the

BSA

sign

al i

ncre

ase

of t

he B

SA-- f

unct

iona

lized

sen

sors

rev

eals

fu

nctio

naliz

ed s

enso

rs r

evea

ls

that

no

anti

that

no

anti --

BSA

ant

ibod

ies w

ere

pres

ent.

BSA

ant

ibod

ies w

ere

pres

ent.

The

rise

time

of th

e an

tiTh

e ris

e tim

e of

the

anti --

ferr

itin

ferr

itin

sign

al is

slo

wer

than

in th

e si

gnal

is s

low

er th

an in

the

expe

rimen

t usi

ng D

NA

, pos

sibl

y in

dica

ting

a lo

wer

den

sity

ex

perim

ent u

sing

DN

A, p

ossi

bly

indi

catin

g a

low

er d

ensi

ty

of a

vaila

ble

biot

in s

ites

on t

he c

hip

surf

ace.

The

exa

ct

of a

vaila

ble

biot

in s

ites

on t

he c

hip

surf

ace.

The

exa

ct

rela

tion

of s

igna

l and

bin

ding

kin

etic

s is

bei

ng in

vest

igat

ed

rela

tion

of s

igna

l and

bin

ding

kin

etic

s is

bei

ng in

vest

igat

ed

in m

ore

deta

il.in

mor

e de

tail.

The

elec

tron

mic

rosc

ope

imag

es o

n th

e rig

ht, t

aken

afte

r the

Th

e el

ectro

n m

icro

scop

e im

ages

on

the

right

, tak

en a

fter t

he

expe

rimen

t, sh

ow c

lear

ly th

at s

igna

l diff

eren

ces

corr

espo

nd

expe

rimen

t, sh

ow c

lear

ly th

at s

igna

l diff

eren

ces

corr

espo

nd

to

to n

anop

artic

lena

nopa

rticl

eco

vera

ge d

iffer

ence

s.co

vera

ge d

iffer

ence

s.

Subs

trate

SVSi

O2

SiO

2

Au

Au

lead

Au

lead

Spot

ting

Nee

dle

Upp

er R

ight

:U

pper

Rig

ht:

Show

n he

re is

the

resu

lt of

a s

ampl

e Sh

own

here

is th

e re

sult

of a

sam

ple

run

of o

ur f

unct

iona

lizat

ion

robo

t. ru

n of

our

fun

ctio

naliz

atio

n ro

bot.

The

robo

t ha

s pl

aced

di

ffer

ent

The

robo

t ha

s pl

aced

di

ffer

ent

func

tiona

lizat

ions

func

tiona

lizat

ions

on

diff

eren

t on

di

ffer

ent

sens

ors

as p

rogr

amm

ed w

ith g

ood

sens

ors

as p

rogr

amm

ed w

ith g

ood

accu

racy

.ac

cura

cy.

Low

er R

ight

:Lo

wer

Rig

ht:

Show

n he

re is

a

Show

n he

re is

a m

icro

fluid

icm

icro

fluid

icM

agA

rray

4 ch

ip. I

nste

ad o

f the

ope

n M

agA

rray

4 ch

ip. I

nste

ad o

f the

ope

n w

ell t

hat t

he p

roto

type

has

, thi

s chi

p w

ell t

hat t

he p

roto

type

has

, thi

s chi

p fe

atur

es c

lose

d fe

atur

es c

lose

d m

icro

fluid

icm

icro

fluid

icst

ruct

ures

that

car

ry th

e re

agen

ts

stru

ctur

es th

at c

arry

the

reag

ents

ac

ross

the

chip

. Som

e of

the

larg

er

acro

ss th

e ch

ip. S

ome

of th

e la

rger

m

icro

fluid

icm

icro

fluid

icfe

atur

es a

re v

isib

le in

fe

atur

es a

re v

isib

le in

th

e ce

nter

of t

he c

hip.

Not

e al

so th

e th

e ce

nter

of t

he c

hip.

Not

e al

so th

e th

ree

thre

e ““ D

NA

Alig

nD

NA

Alig

n ””m

arks

that

aid

m

arks

that

aid

th

e ro

bot

the

robo

t -- toto

-- chi

p al

ignm

ent.

chip

alig

nmen

t.

The

robo

tic fu

nctio

naliz

atio

n is

Th

e ro

botic

func

tiona

lizat

ion

is

appl

ied

first

, and

then

enc

apsu

late

d ap

plie

d fir

st, a

nd th

en e

ncap

sula

ted

by th

e by

the

mic

roflu

idic

mic

roflu

idic

stru

ctur

es.

stru

ctur

es.

400µ

m

12m

m

Left:

Le

ft:

A

sche

mat

ic

repr

esen

tatio

n of

th

e A

sc

hem

atic

re

pres

enta

tion

of

the

chip

and

the

rob

otic

ally

con

trolle

d ch

ip a

nd t

he r

obot

ical

ly c

ontro

lled

spot

ting

need

le

used

fo

r th

e sp

ottin

g ne

edle

us

ed

for

the

func

tiona

lizat

ion.

func

tiona

lizat

ion.

In a

cus

tom

In a

cus

tom

-- bui

ld a

pplic

atio

n, th

e bu

ild a

pplic

atio

n, th

e fu

nctio

naliz

atio

n fo

r eac

h of

the

64

func

tiona

lizat

ion

for e

ach

of th

e 64

(o

r mor

e) se

nsor

s can

be

indi

vidu

ally

(o

r mor

e) se

nsor

s can

be

indi

vidu

ally

pr

ogra

mm

ed. A

vid

eo c

amer

a is

use

d pr

ogra

mm

ed. A

vid

eo c

amer

a is

use

d to

con

trol t

he fu

nctio

naliz

atio

n an

d to

to

con

trol t

he fu

nctio

naliz

atio

n an

d to

ai

d in

the

alig

nmen

t of t

he ro

botic

ai

d in

the

alig

nmen

t of t

he ro

botic

ap

plic

ator

to e

ither

a si

ngle

chi

p, o

r ap

plic

ator

to e

ither

a si

ngle

chi

p, o

r to

an

entir

e w

afer

. The

pro

gram

is

to a

n en

tire

waf

er. T

he p

rogr

am is

hi

ghly

flex

ible

and

ada

ptab

le to

a

high

ly fl

exib

le a

nd a

dapt

able

to a

va

riety

of c

hips

. It c

an a

pply

up

to

varie

ty o

f chi

ps. I

t can

app

ly u

p to

38

4 di

ffer

ent

384

diff

eren

t fun

ctio

naliz

atio

nsfu

nctio

naliz

atio

ns––

e.g.

e.

g.

antib

odie

s or g

enes

of i

nter

est

antib

odie

s or g

enes

of i

nter

est ––

to a

n to

an

arbi

traril

y si

zed

and

posi

tione

d ar

bitra

rily

size

d an

d po

sitio

ned

subs

trate

.su

bstra

te.

Show

n in

the

low

er im

age

is th

e Sh

own

in th

e lo

wer

imag

e is

the

robo

tic a

pplic

ator

and

vid

eo c

amer

a ro

botic

app

licat

or a

nd v

ideo

cam

era

durin

g a

test

run.

durin

g a

test

run.

Topo

grap

hyTo

pogr

aphy

-- and

Alig

nmen

tan

d A

lignm

ent --

Tole

rant

To

lera

nt M

icro

fluid

ics

Mic

roflu

idic

s

Opt

ical

mic

rosc

ope

and

elec

tron

mic

rosc

ope

imag

es o

f the

two

mic

roflu

idic

laye

rs

com

bine

d an

d se

para

ted.

The

rea

gent

s are

gui

ded

tow

ards

the

sens

or in

the

larg

e an

d,

sinc

e th

ey a

re o

n a

sepa

rate

waf

er, c

oars

ely

alig

ned

PDM

S ch

anne

ls. T

he r

eage

nts t

hen

trav

erse

the

actu

al se

nsor

in th

e m

uch

narr

ower

and

pre

cise

ly a

ligne

d Si

O2

chan

nel.

Lay

er B

: SiO

2 M

icro

fluid

ics

Flow 20

µm

To b

e su

itabl

e fo

r hi

ghTo

be

suita

ble

for

high

-- yie

ld m

ass

prod

uctio

n, it

is im

porta

nt th

at

yiel

d m

ass

prod

uctio

n, it

is im

porta

nt th

at

the

the

mic

roflu

idic

sm

icro

fluid

ics

are

som

ewha

t to

lera

nt t

o sm

all

alig

nmen

t an

d ar

e so

mew

hat

tole

rant

to

smal

l al

ignm

ent

and

proc

ess

varia

tions

. Thi

s is

ach

ieve

d w

ith a

2pr

oces

s va

riatio

ns. T

his

is a

chie

ved

with

a 2

-- laye

r pro

cess

. Lay

er A

la

yer p

roce

ss. L

ayer

A

carr

ies

larg

e ch

anne

ls a

nd i

s fa

bric

ated

on

a se

para

te w

afer

fro

carr

ies

larg

e ch

anne

ls a

nd i

s fa

bric

ated

on

a se

para

te w

afer

fro

m

m

poly

dim

ethy

lsilo

xane

poly

dim

ethy

lsilo

xane

(PD

MS)

. Lay

er B

is

fabr

icat

ed r

ight

on

the

(PD

MS)

. Lay

er B

is

fabr

icat

ed r

ight

on

the

Mag

Arr

ay4

subs

trate

waf

er f

rom

SiO

2 w

ith p

hoto

litho

grap

hic

Mag

Arr

ay4

subs

trate

waf

er f

rom

SiO

2 w

ith p

hoto

litho

grap

hic

prec

isio

n. L

ayer

B c

onta

ins

the

smal

l pr

ecis

ion.

Lay

er B

con

tain

s th

e sm

all m

icro

fluid

icm

icro

fluid

icfe

atur

es, s

uch

as

feat

ures

, suc

h as

su

bsu

b --m

icro

n ch

anne

ls o

ver t

he a

ctiv

e se

nsin

g el

emen

ts. T

he o

verla

p m

icro

n ch

anne

ls o

ver t

he a

ctiv

e se

nsin

g el

emen

ts. T

he o

verla

p of

the

laye

rs is

gen

erou

sly

size

d to

acc

omm

odat

e al

ignm

ent e

rror

of th

e la

yers

is g

ener

ousl

y si

zed

to a

ccom

mod

ate

alig

nmen

t err

ors s

(see

fini

shed

sam

ple

stru

ctur

e on

the

right

).(s

ee fi

nish

ed sa

mpl

e st

ruct

ure

on th

e rig

ht).

Afte

r th

e M

agA

rray

4 su

bstra

te

waf

er

has

been

ro

botic

ally

A

fter

the

Mag

Arr

ay4

subs

trate

w

afer

ha

s be

en

robo

tical

ly

func

tiona

lized

, the

sup

port

waf

er c

arry

ing

laye

r A is

col

d se

ale

func

tiona

lized

, the

sup

port

waf

er c

arry

ing

laye

r A is

col

d se

ale d

to

d to

th

e su

bstra

te w

afer

. Si

nce

PDM

S is

th

e su

bstra

te w

afer

. Si

nce

PDM

S is

ela

stom

eric

elas

tom

eric

, it

can

seal

ove

r ,

it ca

n se

al o

ver

unev

en to

pogr

aphy

and

eve

n ac

com

mod

ate

an o

ccas

iona

l par

ticle

un

even

topo

grap

hy a

nd e

ven

acco

mm

odat

e an

occ

asio

nal p

artic

le ––

this

wou

ld b

e im

poss

ible

with

the

sta

ndar

d pr

oced

ure

of a

nodi

c th

is w

ould

be

impo

ssib

le w

ith t

he s

tand

ard

proc

edur

e of

ano

dic

bond

ing.

bond

ing.

Sens

or

Elec

tric

lead

Con

nect

ing

the

Con

nect

ing

the

mic

roflu

idic

mic

roflu

idic

stru

ctur

es t

o th

e ou

tsid

e w

orld

is

one

of t

he e

ngin

eerin

g st

ruct

ures

to

the

outs

ide

wor

ld i

s on

e of

the

eng

inee

ring

chal

leng

es. W

e ha

ve d

evel

oped

an

auto

mat

able

app

roac

h w

hich

doe

sch

alle

nges

. We

have

dev

elop

ed a

n au

tom

atab

le a

ppro

ach

whi

ch d

oes

not r

equi

re th

e dr

illin

g no

t req

uire

the

drill

ing

of h

oles

into

any

of t

he w

afer

s, w

hich

wou

ld b

e la

borio

us a

nd u

nof

hol

es in

to a

ny o

f the

waf

ers,

whi

ch w

ould

be

labo

rious

and

un w

ante

d fo

r waf

er p

roce

ssin

g.

wan

ted

for w

afer

pro

cess

ing.

Th

e m

ain

feat

ure

cons

ists

of

clea

vabl

e ed

ges

that

, on

ce r

emov

ed,

The

mai

n fe

atur

e co

nsis

ts o

f cl

eava

ble

edge

s th

at,

once

rem

oved

,pr

ovid

e op

enin

gs t

o th

e pr

ovid

e op

enin

gs t

o th

e m

icro

fluid

ics

mic

roflu

idic

s . T

hese

ope

ning

s ca

n be

rob

otic

ally

sea

led

to a

com

plem

enta

ry, s

. The

se o

peni

ngs

can

be r

obot

ical

ly s

eale

d to

a c

ompl

emen

tary

, sel

fel

f --ce

nter

ing

cent

erin

g m

icro

fluid

icm

icro

fluid

icho

lder

, w

hich

can

be

a ch

eap

mas

sho

lder

, w

hich

can

be

a ch

eap

mas

s --pr

oduc

ible

pla

stic

par

t. O

n th

e rig

ht,

a pr

oduc

ible

pla

stic

par

t. O

n th

e rig

ht,

a M

agA

rray

pro

toty

pe w

ith w

orki

ng tw

oM

agA

rray

pro

toty

pe w

ith w

orki

ng tw

o --la

yer

laye

r mic

roflu

idic

sm

icro

fluid

ics

and

and

mic

roflu

idic

mic

roflu

idic

hold

ers i

s sho

wn.

hold

ers i

s sho

wn.

Mic

roflu

idic

Hol

der

Mic

roflu

idic

Cha

nnel

IV T

ubin

g

Laye

r A

P

DM

S

1

0µm

thic

k

Supp

ort W

afer

(gla

ss)

Larg

e ch

anne

l,C

a. 1

0µm

dee

pC

a. 2

-100

µm w

ide

Subs

trate

Waf

er (s

ilico

n)

Sens

or

Shal

low

tren

ch,

Ca.

200

nm d

eep

Ca.

1-5

µm w

ide

Laye

r B

Si

O2,

200

nm th

ick

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Sub-

mic

ron

chan

nel,

Ca.

180

nm d

eep

Laye

r ALa

yer B

Laye

r A

P

DM

S

1

0µm

thic

k

Supp

ort W

afer

(gla

ss)

Larg

e ch

anne

l,C

a. 1

0µm

dee

pC

a. 2

-100

µm w

ide

Subs

trate

Waf

er (s

ilico

n)

Sens

or

Shal

low

tren

ch,

Ca.

200

nm d

eep

Ca.

1-5

µm w

ide

Laye

r B

Si

O2,

200

nm th

ick

PDM

S

Supp

ort W

afer

(gla

ss)

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Sub-

mic

ron

chan

nel,

Ca.

180

nm d

eep

Laye

r ALa

yer B

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Parti

al

Cut

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Inse

rt bl

ade

and

twis

t edg

e of

f

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Mic

roflu

idic

op

enin

g

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Parti

al

Cut

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Parti

al

Cut

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Inse

rt bl

ade

and

twis

t edg

e of

f

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Inse

rt bl

ade

and

twis

t edg

e of

f

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Mic

roflu

idic

op

enin

g

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Mic

roflu

idic

op

enin

gPD

MS

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Adh

esiv

eM

icro

fluid

ic H

olde

r Inle

t / O

utle

t

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Adh

esiv

eM

icro

fluid

ic H

olde

r Inle

t / O

utle

t

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Adh

esiv

eM

icro

fluid

ic H

olde

r Inle

t / O

utle

t

DN

A D

etec

tion

(ssD

NA

w/ B

iotin

) on

the

Mag

Arr

ay4

Waf

er R

B2,

Chi

p 2-

2, N

ov-2

9-20

05, u

sing

Str

epta

vidi

n N

anop

artic

les

(MA

CS)

-1001020304050

010

2030

4050

6070

Tim

elin

e, M

inut

es

Signal Amplitude, µV

ssD

NA

-Bio

tinB

are

Sens

or

H2O

H2O

H2O

H2O

Nan

opar

ticle

s

<-- SNR ~ 31 dB -->

Figu

re 1

: DN

A D

etec

tion Ant

ibod

y D

etec

tion

(Ant

i-Fer

ritin

w/ B

iotin

) on

the

Mag

Arr

ay4

Waf

er R

B2,

Chi

p X-

1, J

an-1

8-20

06, u

sing

Str

epta

vidi

n N

anop

artic

les

(MA

CS)

-1001020304050

010

2030

4050

6070

Tim

elin

e, M

inut

es

Signal Amplitude, µV

Ferr

itin

BSA

PBS

H2O

PBS

PBS

PBS

PBS

PBS PBS

PBS

PBS

H2O

H2O

Nan

opar

ticle

s

<-- SNR ~ 21dB -->Fi

gure

2: A

ntib

ody

Det

ectio

n

The

mea

sure

men

t is c

arrie

d ou

t whi

le th

e na

nopa

rticl

esbi

ndFu

nctio

naliz

atio

n 2.

The

bio

tinyl

ated

antib

ody

is a

pplie

d gl

obal

ly