1

MPI Co. <6223TT>MPI Co. <6223TT>

Updated: Jan, 2010Updated: Jan, 2010

Goldman SachsGoldman Sachs““ Taiwan Corporate DayTaiwan Corporate Day””

2/30

CONTENTSCONTENTSA. Company Profile 03

B. Products 06

Appendix 29

3/30

A. Company Profilea1. Company at a Glance

a2. Business Portfolio

4/30

a1. Company at a Glancea1. Company at a GlanceAA

No. 7, Luke 1st Rd., Luzhu Shiang, Kaohsiung,

821 Taiwan, R.O.C.Southern Taiwan Branch

743No. of Employees

NTD$ 733MPaid-in Capital

July, 25, 1995Founded

No. 155, Chung-Ho St., Chu-Pei, Hsinchu,

302 Taiwan, R.O.C.Address

5/30

a2. Business Portfolio : 2009a2. Business Portfolio : 2009

Solar

15%

Leda

24% Probe Card

61%

AA

6/30

B. Products

b1. LED: Prober & Sorter01. LED Food Chain02. LED Trend03. Business Contents

b2. Semi-conductor: Probe Card01. Semi-conductor 02. Peer Group Analysis03. Business Contents

b3. Solar: Ingot Slicing01. Wafer Process in Solar02. Business Contents

7/30

01. LED EPI-Wafer Process01. LED EPI-Wafer ProcessB1B1

400um 100um

GrinderGrinderLaser ScriberLaser Scriber

ExpanderExpander

Wafer Wafer MounterMounter BreakerBreaker

ProberProber

Tape Tape MounterMounter

SorterSorterQC ProberQC Prober

CounterCounter

CCD

2560

Post Post InspectionInspection

•• MPI Co. (75%)MPI Co. (75%)

•• FittechFittech Co.Co.

•• ChromaChroma ATE Inc.ATE Inc.

•• MPI Co. (30%)MPI Co. (30%)

•• ASMP (HK)ASMP (HK)

111 777 777MOCVD MOCVD 42(P)/Run42(P)/Run

SorterSorterProberProberPCPCPCPC PCPCPCPC PCPCPCPC

8/30

02. LED Trend02. LED TrendB1B1

9/30

02. LED CAGR02. LED CAGRB1B1

10/30

86

0

20

40

60

80

100

Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

PC

Shipment

P.O.

03. Equipment Shipment 2008~200903. Equipment Shipment 2008~2009B1B1

11/30

China

41%

Korea

5%

Taiwan

54%

by Geographyby Geographyby Geography by Productby Productby Product

31

43 3989

12910

21

0%

20%

40%

60%

80%

100%

Q1 Q2 Q3 Q4 Season

%

Sorter

Prboer

PC

03. Shipment: Geography & Product Mix03. Shipment: Geography & Product MixB1B1

12/30

TaiwanTaiwan ChinaChinaKoreaKorea

03. 2009 Major Customers03. 2009 Major CustomersB1B1

13/30

Semi-Automatic Probe Station

LEDA-PT120 PROBER

03. Prober 03. Prober B1B1

14/30

LEDA-PNP

M7600 Fully-Auto Mapping Sorter

03. Sorter 03. Sorter B1B1

15/30

LED-Auto Taping Machines

PT-350 TAPING

03. Auto Taping Machine03. Auto Taping MachineB1B1

16/30

03. State-of-the-Art 2 in 1 Machine03. State-of-the-Art 2 in 1 MachineB1B1

17/30

01. Market Consensus: Semi-Conductor01. Market Consensus: Semi-ConductorB2B2

18/30

12,18410,164

4,824 4,1271,450

4,593

15,252

10,941

4,286 4,857

1,708

4,347

6,936

11,231

3,963 4,074

1,946

3,973

0

5,000

10,000

15,000

20,000

25,000

30,000

35,000

FFI MJC JEM TCL MPI SV

NT$ Million

2008

2007

2006

P1：：：：Exchange rate: 1 dollar = NT 33 ; 1 JPY = NT 0.3; 1SGD = NT 22

P2：：：： SV probe in 100% wholly own by Ellipsiz, an semi-conductor equipment maker, from 2006.

b2. Peer Group Analysisb2. Peer Group AnalysisB2B2

19/30

17%

21%20%

6%

36%

23%

-40%

-30%

-20%

-10%

0%

10%

20%

30%

40%

FFI MJC JEM TCL MPI SV

(%)

08Q4

09Q1

09Q2

09Q3

P1：：：：same quarter period in all company. Ex: Q1= 2008.01~2008.03.

P2：：：：Exchange rate: 1 dollar = NT 33 ; 1 JPY = NT 0.3; 1SGD = NT 22

P3：：：：SV probe in 100% wholly own by Ellipsiz, an semi-conductor equipment maker, from 2006.

b2. Peer Group Analysis (con.)b2. Peer Group Analysis (con.)B2B2

20/30

Logic P/C

LCD Driver IC 40μμμμm pitch for LCD Driver IC

03. Categories of Probe Card03. Categories of Probe CardB2B2

21/30

70%

66%

60%63%

32%33%

27%27%

5%7%7%

3%

0%

10%

20%

30%

40%

50%

60%

70%

80%

Q1'09 Q2'09 Q3'09 Q4'09

%

LCD

Logic

Memory

03. Product Mix in 2009B2B2

22/30

03. Monthly Shipment 2007~2009

0

50,000

100,000

150,000

200,000

250,000

300,000

Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Pin

2007

2008

2009

B2B2

23/30

03. 2009 Major Customers

Design HousesDesign Houses FoundriesFoundries Testing HousesTesting Houses

B2B2

24/30

03. B/B Ratio 2007~2009

1.25

0

0.3

0.6

0.9

1.2

1.5

Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

200920092009200920082008200820082007200720072007B2B2

25/30

B2B2 03. Product & Customers Mix (%)

LCD

64%Logic

30%

Memory

6%

by Productby Productby Product by Customerby Customerby Customer

Design

house

35%

Foundry

7%

Testing

house

58%

20092009

26/30

01. Wafer Process in Solar

Growing/Casting

Wafer cutting

Gluing

Cropping

Wafer cleaningWafer measuring

Edge grinding

Wafer separating

Squaring/Bricking

Wafering process

Mono Si

Poly Si

B3B3

27/30

02. Shipment 2009

0

100,000

200,000

300,000

400,000

500,000

600,000

700,000

800,000

900,000

Jan-09 Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Month

Pcs

B3B3

28/30

02. 2009 Shipment by Geography

Korea

5%US

25%

Taiwan

70%

B3B3

29/30

Appendix

30/30

Global LED SectorsGlobal LED SectorsGlobal LED Sectors