© 2015

Yole Développement

More than Moore market

and technology trends

2©2015 | www.yole.fr | Yole Développement

OUTLINE OF THE PRESENTATION

• Presentation ofYOLE Développement

• Major trends in the industry

• Focus on MEMS

• Focus on Image Sensing

• Focus on Advanced Packaging

• Elements for a conclusion

3©2015 | www.yole.fr | Yole Développement

MEMS &

Sensors

LED

Compound

Semi.

Imaging Photonics

MedTech

Manufacturing

Advanced

PackagingPV

Power

Electronics

FIELDS OF EXPERTISE

Yole Développement’s 30 analysts operate in the following areas

4©2015 | www.yole.fr | Yole Développement

4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research, marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

www.yole.fr

o Reports

• Market & Technology reports

• Patent Investigation and patent infringement risk analysis

• Teardowns & Reverse Costing Analysis

• Cost Simulation Tool

www.i-Micronews.com/reports

o Financial services

• M&A (buying and selling)

• Due diligence

• Fundraising

• Maturation of companies

• IP portfolio management & optimization

www.yolefinance.com

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Technology magazines

• Communication & webcast services

• Events

www.i-Micronews.com

5©2015 | www.yole.fr | About Yole Développement

A GROUP OF COMPANIES

Market,

technology and

strategy

consulting

www.yole.fr

M&A operations

Due diligences

www.yolefinance.com

Fundraising

Maturation of companies

IP portfolio management & optimization

www.bmorpho.com

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr

6©2015 | www.yole.fr | About Yole Développement

OUR GLOBAL ACTIVITY

Yole JapanYole Inc.

Yole

Korea

40% of our business is in

EU countries30% of our business is in

North America

30% of our business is in

Asia

Blue Morpho

7©2015 | www.yole.fr | About Yole Développement

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plan along the entire

supply chain

Integrators and

end-users

Device

makers

Suppliers: material,

equipment, OSAT,

foundries…

Financial investors,

R&D centers

8©2015 | www.yole.fr | About Yole Développement

SERVING MULTIPLE INDUSTRIAL FIELDS

We are workingaccross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and consumer

electronics

Automotive

Medical

systemsIndustrial and

defense

Energy

© 2015

Major trends in the industry

10©2015 | www.yole.fr | Yole Développement

COMPUTING TRENDS

3 key drivers

Miniaturization

Functionality

Mobility

11©2015 | www.yole.fr | Yole Développement

THE DRIVING FORCES ARE CHANGING

Wireless is the trend!

12©2015 | www.yole.fr | Yole Développement

MARKET TRENDS AND DRIVERS

Information! Key driver for mobile

applications

http://ec.europa.eu/digital-agenda/en/about-mobility

http://www.tutorialspoint.com/shorttutorials/reasons-why-we-cant-develop-without-mobile-technology

There is a high need of being constantly:

connected to a high flow of information

being updated to information

update our mobile gadgets

to know everything that is going around us and around the world

to be informed at every second

the need to share – social networking just exploded

Mobile Globalization where information is the main currency

13©2015 | www.yole.fr | Yole Développement

MOBILITY FACTS

Mobile phones a continousgrowth!

http://mashable.com/2013/10/03/mobile-phones-2017/

2013

4.3 billionmobile phones users

Due to increased access to mobile devices and information, the use of mobiles will continue to increase

2017

> 5 billionmobile phones users

14©2015 | www.yole.fr | Yole Développement

WHAT OPTIONS DO WE HAVE?

Mainly two routes

Alternative solution

required to Moore’s law

Continue with development of advanced technology nodes (follow Moore’s Law)

Develop new alternative technologies/packages (More than Moore) in order to be able to meet the market requirements:

The CMOS transistors continue to shrink but at the increase of fab expenses.

Although performance is increasing, the same trend of reduced cost has reached its end

15©2015 | www.yole.fr | About Yole Développement

PACKAGING ADDEDVALUE:

More Moore and More than Moore

More thanMoore:

THE alternative to scaling

More Moore : miniaturization

130nm 90nm 65nm 45nm 32nm 22nm 14nm 10nm

Anal

og

+

RF

Pas

sive

sPow

er

Senso

rsEnerg

y

Sourc

es

Bio

chip

s

More

Than

Moore

: div

ers

ific

atio

n

SoC

SiP

IPD

RF CMOS

SMOS

Analog

Power

Low Power

CMOS

High Perf.

SOI

Non

Volatile

Memory

GaAS RF

MEMS

…

3D integration is seen today as a

new paradigm for the future of the

semiconductor industry, as it will

enable several more decades of

chip evolution at ever lower cost,

higher performance and smaller-

size features.

…

16©2015 | www.yole.fr | Yole Développement

EVOLUTION OF SELECTED MORE THAN MOORE APPLICATIONS

>$85B in 2020…

$0M

$10 000M

$20 000M

$30 000M

$40 000M

$50 000M

$60 000M

$70 000M

$80 000M

$90 000M

$100 000M

2012 2013 2014 2015 2016 2017 2018 2019 2020

Selected More than Moore applications

MEMS Market Image sensors LED market

Power devices market Microfluidic market Printed electronic Market

>$85B in 2020

>$50B in 2014

More than

Moore

Applications

keep growing!

17©2015 | www.yole.fr | Yole Développement

ADVANCED PACKAGING PLATFORMS

Broad range of Advanced Packaging Platforms!

Wafer-Level Electrical Redistribution

Flip-chip & Wafer-LevelStacking / Integration

WL CSP‘Fan-in’

FOWLP‘Fan-out’

2.5DInterposer

FC wafer bumping on

BGA

3D IC & TSV

Embedded die in PCB /

laminate

Wafer-Level Interface / Encapsulation

3D WLPFor MEMS & sensors(also called 3D SiP)

LED & SensorsWLOptics

RDL

Bumping

Wafer Bonding

TSV

Middle-End Process Steps

TSV

Wafer Bonding

Balling

© 2015

Focus on MEMS

19©2015 | www.yole.fr | Yole Développement

MEMS APPLICATIONS

Nothing standard

…

20©2015 | www.yole.fr | Yole Développement

MEMS MARKETS AND EXPECTED GROWTH

Consumer applications

are nowdriving the

growth.

21

FROM MICRO MACHINES TO NEMS

For chemical & inertial sensors, NEMS are already products.

2020+2010200019901960

Co

st(U

S$)

Siz

e (

mm

²)

FIRST INTEGRATED

SENSOREx: SA20 Sensonor for Airbag

systems.

CAPACITIVE COMB

DRIVE BECOMES

DOMINANTEx: ST, Bosch …

PACKAGING /

INTEGRATION AS

ENABLING

TECHNOLOGYEx: SiTime, ST, Bosch …

From micro machines to MEMS

MEMS to NEMS

NEMS

MIX MEMS (thick layer)

& NEMS (gauge) FOR

MIN AREA & IMPROVED

PERF.Ex: Tronics

DISRUPTIVE

APPROACHESEx: EPFL, CNRS, CEA Leti,

Caltech, Berkeley …

3

10

1

15

0.5

1

0.1

5

Smaller, smaller & smaller …

22

TSV IN MEMS

Packaging has been the workhorse of many MEMS players.

RF MEMS

mCube

3-Axis MEMS

Accelerometer

Bosch Sensortec

BMG160

3-Axis MEMS Gyro

MEMSFoundries

Accelerometers

GyroscopeOscillators

Silicon Labs Si504

MEMS Oscillator

Avago FBAR filter

ACMD-7612 UMTS

Band I Duplexer

2014/15 market status (courtesy of Yole Advanced Packaging team)

23©2015 | www.yole.fr | Yole Développement

3D IN MEMS - DIFFERENT TSV ARCHITECTURES

3-Axis Accelerometers

Evolution of MEMS

packaging towards

smaller formfactor

2012

Cu TSV in ASIC TSVs of 10:100 (AR=10:1)(temporary bonding)

W TSV-like with 3:30 (AR =10:1) connecting MEMS to IC metallayers (fusion bonding)

TSV Trench to connectwith wirebonding fromMEMS to ASIC

2013 2014

24©2015 | www.yole.fr | Yole Développement

PACKAGE SIZE COMPARISON

3-Axis Accelerometers

Up to 55% reduction in package size with 3D TSV technology!

Surface: SST= 4mm²

Package thickness: TST= 1mm

Surface: SmCube= 4mm²

Package thickness: TmCube=

0.9mm

Surface: SBosch= 1.8mm²

Package thickness: TBosch=

0.8mmBosch achieved 55% in

package reduction and has

the thinner package (0.8mm)

SST = SmCube > SBosch

TST > TmCube > TBosch

25

WEARABLE ELECTRONIC & IOT

Requiring sensor fusion / processing

Wearable electronics is a new big opportunity for sensors

• Fitness / activity monitoring, healthcare, sports applications

• In many cases the sensor acts as a hub

Apple watch (2015)

Integrates accelerometer + gyro +

magnetometer + pressure

Pebble Watch (0,4 MUnits sold in 2013)

Features STMicroelectronics accelerometer

Moto 360 by Motorola (End 2014)

© 2015

Focus on image sensing

27©2015 | www.yole.fr | About Yole Développement

IMAGE SENSORS : TRIPLE DISRUPTION HISTORY

Technologies & markets have changed dramatically over the years

CIS is now the

undisputed image sensor technology

1865 1945 1985 2005 2015 2020

First color

pictures from

emulsion

plates in

1860’sTube

technology

Never took

over Film

Technology x Market Penetration

CCD

technology

Took over

Film in the

2000’s

CMOS

technology

Took over

CCD in 2010

Acceleration : The speed in technology changes doubles every technology shift

Era of Digital

PhotographyEra of Film

Photography

Era of Mobile

Photography

5 years10 years20 years40 years80 years

28©2015 | www.yole.fr | Yole Développement

MARKET SEGMENTATION

We have defined 7 market

segments relevant to CIS

Segment Application

Industry / defense /

space

Machine vision (FA), barecode readers,

defense, professional & broadcast

Security Security & surveillance cameras

Medical Medical endoscopes, X-Ray, camera pills

Automotive Front side, rear side, inside view, ADAS

Computing Computer mice, notebooks, PC, tablet

Consumer

DSLR, DSC, camcorders, wearables, game

stations, smart TV

Mobile Smartphones, feature phones

29©2015 | www.yole.fr | Yole Développement

CMOS IMAGE SENSOR APPLICATIONS

2014 CIS market landscape by application

Today smartphone main camera

and DSLR are the 2 main CIS

applications

$3.0B

$1.0B

$0.2B

Today

Consumer

High End

Mobile

Yole Développement © January 2015

• Mobile is currently driving CIS markets

• Smartphone secondary camera adoption made Mobile sub-segment very significant. Its future importance should increase as ASP rises.

• Tablets appear to be part of computing, even though the technology came from Mobile

30©2015 | www.yole.fr | Yole Développement

Backside

illumination will

enable ~ 100% fill-

factor!

Front-Side

illuminated (FSI)

MAIN TECHNOLOGY TRENDS IN CIS

From FSI to BSI to 3D stacked BSI – pixel level

3D stacked technology is

the logical next step in respect to

BSI

3D Stacked

BSI

Silicon Bulk Silicon Bulk

Backside

illuminated (BSI)

Bonding

Interface

Silicon Bulk

Upper

Wafer

Lower

Wafer

• Conventional BSI is adding a silicon wafer essentially as a mechanical support.

• 3D stacked technology is using a processed wafer with digital circuits supplementing the upper CIS array.

31©2015 | www.yole.fr | Yole Développement

Backside

illumination will

enable ~ 100% fill-

factor!

MAIN TECHNOLOGY TRENDS IN CIS

3D Stacked BSI should use hybrid bonding in a short future

TSV is the current

interconnection technology

3D Stacked

BSI

Silicon Bulk

TSVTSV

Backside

illumination will

enable ~ 100% fill-

factor!

3D Hybrid

BSI

Silicon Bulk

Interco upper to

lower wafer

Interco upper

to lower wafer

Connection within pixels

become possible

• The key technology step for 3D stack is the interconnection of the upper and lower part of the circuit.

• Currently TSV is the main technology to connect 3D stacked wafers.

• Cu-Cu hybrid bonding should be the next step

• Hybrid bonding could open the way to in pixel connections

32©2015 | www.yole.fr | Yole Développement

IPHONE 5S TEARDOWN - CAMERA MODULE

8Mp 1.5µm Stacked BSI CIS

TSV technology

enablessmaller formfactor for BSI

CIS

BSI stacked CIS from SONY

33©2015 | www.yole.fr | Yole Développement

COMPARISON WITH PREVIOUS 8MP SENSORS

Significant improvement brought by Sony

Significantsize

reduction for CIS

application

SONY leader in that area

Phone Ref. (Year)CIS

Manufacturer

Resolution

/TechnoPixel size

Pixel Array

AreaCIS Area

Dies per wafer

(12-inch)

Motorola Razor (2011) Omnivision 8Mp/BSI 1.4µm 16mm² 43mm² 1,500

Apple iPhone 4S (2011) Sony 8Mp/BSI 1.4µm 16mm² 35.4mm² 1,816

Samsung Galaxy SII (2011) Samsung 8Mp/BSI 1.4µm 16mm² 34.2mm² 1,884

Apple iPhone 5S (2013) Sony 8Mp/BSI 1.5µm 18mm² 28.5mm² 2,268

~50% ~60% ~60% ~90%Increase of pixel area

34©2015 | www.yole.fr | Yole Développement

CIS EVOLUTION USING TSV

TSV accrossthe evolution

of CIS –different size, different use

FSI BSI 3D Stacked BSI

20122008

TSV Hole to replace shellcase approach

Wafer Level PackagingInterconnection

Trench TSVBEOL Interconnection

TSV BEOL and DSP Interconnection

« Real 3D »

TSV

Cro

ss-s

ect

ion

SEM

TSV

Ne

ed

sIn

teg

rati

on

Sch

em

e

35©2015 | www.yole.fr | Yole Développement

WAFER PRODUCTION FORECAST 2009-2020

Wafer production trend & assumption

Currently ~20% of 3D stacked BSI

By 2020, 3D stacked BSI

should capture

above 50% market share

3%9%

15%22%

30%

9%

18%

27%

31%

33%

33%

32%

27%

2% 5%

16%

31%

33%

35%

32%

29%

25%

22%18%

16%

98% 95%

84%

69%

58%

47%41%

37%33% 30% 28% 27%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

2009 2010 2011 2012 2013 2014e 2015e 2016e 2017e 2018e 2019e 2020e

BSI technology penetration - revenue split

BSI Hybrid % BSI Stacked % BSI % FSI %Yole Développement © January 2015

Our assumption :

• All wafers are taken into account

o Some are CIS + Digital

o Some are pure processing (3D stacked BSI & 3D Hybrid BSI)

• Stacked BSI technologies will penetrate more than 50% of CIS production by 2020.

36©2015 | www.yole.fr | Yole Développement

IMAGE SENSORS : WHAT IS NEXT

A roadmap for the next 15 years

From “vision for imaging”

to “vision for sensing”

1900 1980 2020 2030 2040 2045

Technology x Market Penetration

Acceleration : The speed in technology change doubles every technology shift

Era of

Photography

5 years10 years20 years40 years80 years

Era of Machine

Sensing

Main

Players

will

change

Proximity

Sensor

Autofocus

Single

Photon

Imagers?

Multi

Wavelength

Imagers?

Next Era

Sensor

Fusion ?

Human Vision

Enhancement ?

3D Time

of Flight

By 2030 new

technologies serving

machine sensing could

become dominant

Holographic

imagers?

?

© 2015

Focus on advancedpackaging

38©2015 | www.yole.fr | Yole Développement

TSV IN A NUTSHELL

TSV - a key advanced packaging technology

Broad range of

applications for this

technologyPhotonics

Others(Power,

LED, RF…)

Memory

MEMS

Logic

CMOS Image

Sensors

ThroughSilicon

ViaTSV

39©2015 | www.yole.fr | Yole Développement

TSV WAFER START BY APPLICATION

High End needsrequires

performance

TSV technology is

key in that field

2014 2015 2016 2017 2018 2019

WSPY 300 eq

MEMS

Memory

Photonic

CIS

MEMS

HBM

HMC

Photonic interposer

FPGA

SK

Hynix

Micron

XilinxAltera

<2013

CIS

FPGA

Logic on Logic

HMCHBMWide I/ODDR4

40©2015 | www.yole.fr | Yole Développement

MEMORY USING TROUGH SILICON VIAS

A brief overview of announced products

Big Memory Players

moving to 3D

41©2015 | www.yole.fr | Yole Développement

2.5/3DIC COMMERCIAL ANNOUNCEMENTS!

2015 Key turning yearfor 3D TSV technology

2014

2013

2015

2017

2016

Nvidia Pascal

Graphics Module

EX-800

Blade Server using

HMC

New second generation Xenon Phi processor“Knights Landing” using HMC

Next Generation PRIMEHPC

POST FX10

CPU memory board using

HMC

DDR4 3DDual Inline Memory Modules(RDIMMs)

First Heterogeneous 3D FPGAVirtex-7 H580T

AMD R9 390X

Graphics product with HBM

built with 20nm technology

Whatelse?

© 2015

Elements for a conclusion

43©2015 | www.yole.fr | Yole Développement

4 DIFFERENT WAVES ARE IMPACTING THE SEMICONDUCTOR BUSINESS

The 4 waves of the

semiconductortrends

• The first wave:• More Moore trends

• The second wave:• Re-use of semiconductor process to make non IC devices is creating totally new

opportunities.

• The third wave:• How module manufacturing is becoming the future of device makers.

• The fourth wave:• A supply chain evolution to maximize the added value and provide complete services

to customers.

44©2015 | www.yole.fr | Yole Développement

CONCLUSION

• Their is a growing importance of the devices outside the digital IC world, where analog, mixedsignal devices, sensors, power management, embedded memories… are becoming inceasinglyimportant and reaching big sales level

• We see more and more speciality foundries that are grabing a significant part of these morethan Moore applications, as the process to be mastered are totally different from the digital ICworld.

More thanMoore has

a brightfuture

© 2015

Annexe

46©2015 | www.yole.fr | Yole Développement

REPORTS COLLECTION

o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:

• MEMS & Sensors

• Imaging

• Medical technologies (MedTech)

• Advanced packaging

• Power electronics

• Compound semiconductors

• OLED, LED & Laser diode

• Semiconductor Manufacturing

• Photovoltaics

• Batteries

o Our reports are unmatched in quality and technology depth and typically include:

• Technology trends and evolution: costs, barriers, roadmaps, etc.

• Supply & value chain analysis: business models, relationships, value flows, etc.

• In-depth analysis of applications and market drivers: challenges, inflection points, etc.

• Market data ($, units, wafer starts, etc.)

o Every year, Yole Développement, System Plus Consulting and Knowmade publish +60 reports.

o Take the full benefit from our Bundle and Annual Subscription offers.

www.i-Micronews.com

47©2015 | www.yole.fr | Yole Développement

OUR 2015 REPORTS PLANNING

MARKET & TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Sensors and Data Management for Autonomous Vehicles

− AlN Thin Film Markets And Applications

− Sensors for Wearable Electronics And Mobile Healthcare

− Status of the MEMS Industry

− Uncooled IR Imagers

− IR Detectors

− High End Gyro, Accelerometers and IMU

− Non-Volatile Memory

o IMAGING & OPTOELECTRONICS

− Camera Module Packaging (Vol 1 : Market & Technology Trends / Vol 2 Teardowns &

Reverse Engineering)

− Uncooled IR Imagers

− Wafer Level Optics

− Status of the CMOS Image Sensors

− Machine Vision

o MEDTECH

− Microfluidic for Sample Preparation

− Microfluidic Applications

− Sensors for Wearable Electronics And Mobile Healthcare

o COMPOUND SEMICONDUCTORS

− High Purity Alumina (HPA)

− Sapphire

− Wide Bandgap Materials For Power Electronics: SiC, GaN (and also Ga2O3, AlN,

Diamond, Graphene… as a trend)

* Reports to be decided within 2015

o LED

− LED Module

− OLED for Lighting

− UV LED

− LED Phosphors Market

o POWER ELECTRONICS

− Power Packaging

− Thermal Management for LED and Power

− Power Electronics for Renewable Energy

− Energy Management For Smart Grid And Smart Cities

− Status of Chinese Power Electronics Industry

− New Technologies For Data Center

− Inverter Market Trends For 2013 – 2020 And Major Technology Changes*

− IGBT Markets And Application Trends

− Power Electronics for HEV/EV*

− Status of Power Electronics Industry

o ADVANCED PACKAGING

− Advanced Packaging in Emerging Markets in China

− Status of the Advanced Packaging Industry

− Supply Chain Readiness for Panel Manufacturing in Packaging

− WLCSP*

− Flip Chip Business Update

− 2.5D & 3DIC Business Update

− Fan-Out and Embedded Business Update

o MANUFACTURING

− Lithography for MEMS, Advanced Packaging and LED

− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS

Image Sensors

− Non-Volatile Memory

48©2015 | www.yole.fr | Yole Développement

OUR 2015 REPORTS PLANNING

PATENT ANALYSIS by Knowmadeo Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise)

− MEMS Microphone Applications

− Infrared Imaging

o Patent Investigation (crossed analysis based on Knowmade &Yole Développement expertise)

− Power GaN

− MEMS Gyroscope

− 6-axis & 9-axis Inertial MEMS IMUs

− Microbatteries

− Embedded Active & Passive Packages

− Interposer

− Phosphors for LED

TEARDOWN & REVERSE COSTING by System Plus ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2015.

* Reports to be decided within 2015

49©2015 | www.yole.fr | Yole Développement

OUR 2014 PUBLISHED REPORTS LIST

MARKET & TECHNOLOGY REPORTS

by Yole Développement

o MEMS & SENSORS

− Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024

− MEMS Microphone: Market, Applications and Business Trends 2014

− Status of the MEMS industry

− MEMS & Sensors for Mobile Phones and Tablets

− High End Gyroscopes and Accelerometer Applications

− Inertial MEMS Manufacturing Technical Trends

− New Detection Principles & Technical Evolution for MEMS & NEMS

− 6/9 DOF Applications in Consumer Electronics

− MEMS for RF filters and Antena Switches - BAW / SAW

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry

− Uncooled Infrared Imaging Technology & Market Trends

− Silicon Photonics

o MEDTECH

− Point of Care Testing: Applications for Microfluidic Technologies

− Solid State Medical Imaging: X-ray and Endoscopy

o COMPOUND SEMICONDUCTORS

− RF GaN Technology & Market Analysis: Applications, Players, Devices & Substrates 2010-

2020

− SiC Modules, Devices and Substrates for Power Electronics Market

− GaN-on-Si Substrate Technology and Market for LED and Power Electronics

− Power GaN Market

− Graphene Materials for Opto & Electronic Applications

− Sapphire Applications and Market: from LED to Consumer Electronics

o LED

− LED Packaging

− LED Front-End Manufacturing Trends

− LED Front-End Equipment Market

o POWER ELECTRONICS

− Power Electronics for HEV/EV

− Inverters

− Gate Driver Unit Market for Power Transistors

o PHOTOVOLTAICS

− Emerging and Innovative Technology Approaches in the Solar Industry

o ADVANCED PACKAGING

− 3DIC Equipment and Materials

− 3DIC & 2.5D TSV Interconnect for Advanced Packaging - 2014 Business Update

o MANUFACTURING

− Market & Technology Trends in Materials & Equipment for Printed & Flexible Electronics

− Permanent Wafer Bonding for Semiconductor: Application Trends & Technology

PATENT ANALYSIS

by Knowmade− LED Based on Nano-wires Patent Investigation

− GaN on Si Patent Investigation (LED, Power devices and RF Devices)

− New MEMS Devices Patent Investigation

− Non Volatile Memory Patent Investigation

TEARDOWN & REVERSE COSTING

by System Plus ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2014.

50©2015 | www.yole.fr | About Yole Développement

MICRONEWS MEDIA

o About Micronews Media

Micronews Media, powered by Yole

Développement, ensures you the best visibility

in the disruptive semiconductor community.

With our services, we help you to reach your

customers worldwide with the media products

they prefer, including our website, e-newsletter,

webcasts, and magazines. Invest in a high added-

value editorial program and get access to Yole

Développement’s network (48 000+ contacts).

o Five supports and channels for your visibility

• A technology magazine to highlight

your visibility with advertisements,

company profiles, product descriptions and

white papers

• A webcast to highlight your expertise and

develop your business identifying

commercial leads

• Articles, advertisements & logo and

banners dedicated to your company, its

products and expertise in @Micronews e-

newsletter and on i-Micronews.com

Focused

community

Identified

contacts

Large

community

Mass contacts

51©2015 | www.yole.fr | About Yole Développement

COMMUNICATION SERVICES

All services listed below are available on–demand.

o i-Micronews.com, the website

Slider – Banners (on English or Japanese websites) – Articles –

Logo and profile as sponsor

o @Micronews, the e-newsletter

Headline article - Tiles

o Custom webcast

Develop your dedicated event with a high added-value program. A

turnkey event withYole support (logistics, promotion, data…)

o Technology Magazines: Custom – Co-produced

Increase your visibility through a dedicated technology magazine

with ads, company profile, product descriptions and white papers.

It can be a custom magazine: your company is the only one to

benefit from it – or a co-produced one: up to 2 companies.

Contacts:

Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr),

Media & Communication Coordinators.

52©2015 | www.yole.fr | Yole Développement

CONTACT INFORMATION

o Consulting and Specific Analysis

• North America: Steve LaFerriere

Email: laferriere@yole.fr

• Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.

Email: katano@yole.fr

• RoW: Jean-Christophe Eloy, President & CEO, Yole Développement

Email: eloy@yole.fr

o Report business

• North America: Steve LaFerriere

Email: laferriere@yole.fr

• Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service

Email: khamassi@yole.fr

• Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.

Email: onozawa@yole.fr

• Korea: Hailey Yang, Business Development Manager, Korean Office

Email: yang@yole.fr

o Financial services

• Jean-Christophe Eloy, CEO & President

Email: eloy@yole.fr

o General

• Email: info@yole.fr

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