XT-3 Image Rerport Part 1

8/13/2019 XT-3 Image Rerport Part 1

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kV Control Settings :75

mA Contr ol Settings :0.050

Part Descri ption :XB1C0116B

Comments :Close-up of lower righ

corner of the BGA shows

smooth edges and consistentsize and shape.


mA Contr ol Settings :.040


Comments :Overview of BGA

component. No shorts or

bridges of solder joints are

visible.

X-Ray Inspection Application Report November 15, 2013

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Comments :Overview of smaller

BGA component shows no

gross defects such as missingor shorts.




Comments :Opposite corner show

similar results with solder ba

joints. There is consistent ba

size and shape throughout.


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Comments :High magnification

picture shows a small void in

the center of the ball joint.




Comments :This high magnificatio

image shows good solder bal

shape and smooth edges.


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Comments :Using x-ray inspection

give the user the ability to

visualize under aluminumcovers. This picture shows th

various components located

under the cover.




Comments :This picture shows the

small bond wires of the BGA

component.


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center solder ball joints whic

are similar in size and shape the outer rows.




Comments :This is an angled view

of the large BGA. There is

consistent size and shape

throughout.


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Comments :Angled view of oppos

corner shows similar ball size

and shape.




Comments :Close-up angled view

the small BGA component.

Again there is good shape an

size consistency which isindicative of proper reflow.


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Comments :This image shows

voiding within the center

solder attachment.




Comments :Close-up view of the

various components under th

aluminum cap.


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Comments :Overview of QFN

component. The outer solder

joints and center ground planattachment is clearly visible.




Comments :This image shows

various passive components

with voiding in the solder

joints.


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Part Descri ption :XB3A007Y

Comments :This close-up view

image shows the upper right

corner of the BGA componenNote that the rough edges an

non circular ball shape is an

indication of cold or partially

reflowed solder paste.




Comments :Overview of large BG

component. All the solder ba

joints can be checked for

missing or shorts.


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middle edge solder joints of t

BGA. Once can tell that thesmoothness of the ball edges

are better than the previous

images. Note that the pad

outline in the middle of the b

joint can be seen and is offse

or not centered to the ball.




Comments :The opposite corner

shows similar defects. These

solder balls with non smooth

edges and odd shapes are allpartially reflowed joints.


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Comments :Close-up image of the

angled ball joints with voidin




Comments :This angled corner vie

of the BGA shows large void

within the ball joints.


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Comments :Close-up view shows

voiding within the ball joints




Comments :Overview of small BG

show no gross defects such a

missing or shorts.


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Comments :Angled view of BGA

shows consistent ball size an

shape.




Comments :More voids can be see

throughout the small BGA

package.


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Part Descri ption :XB3A0072

Comments :Corner solder joint

image shows small voids

within the ball joints. The paoutline through the ball can b

seen and is centered.




Comments :Overview of BGA

component.


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mA Contr ol Settings :.075


Comments :Angled view of BGA.




Comments :Adjacent corner of

BGA shows more voiding.


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Comments :Overview of small

BGA.




Comments :Angled view showing

the corner and center ball

joints. No issues can be seen


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Comments :Close-up of small sold

ball joints shows voiding

within the attachments.




Comments :Overview of small

BGA.


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XT-3 Image Rerport Part 1

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Transcript of XT-3 Image Rerport Part 1