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xmega.Dip
Manual
xmega.Dip
xmega.Dip: ManualCopyright © 2012 Ledato GmbH
All rights to this documentation and to the product(s) described herein are reserved by Ledato GmbH.
This document was written with care, but errors cannot be excluded. Neither the company named above nor the seller assumes legal liabilityfor mistakes, resulting operational errors or the consequences thereof. Trademarks, company names and product names may be protectedby law. This document may not be reproduced, edited, copied or distributed in part or in whole without written permission.
This document was generated on 2012-11-26T16:08:35+01:00.
xmega.Dip
iii
Table of Contents1. Introduction ................................................................................................................. 12. Scope ........................................................................................................................... 23. Key Features ............................................................................................................... 34. Board Description ....................................................................................................... 5
4.1. Overview ............................................................................................................ 54.2. Pinout / Schematics ........................................................................................... 54.3. Power supply voltage selection ......................................................................... 74.4. Operating temperature ..................................................................................... 74.5. Dimensions ........................................................................................................ 7
5. Usage ........................................................................................................................... 85.1. Development ...................................................................................................... 85.2. Debugging ......................................................................................................... 85.3. Flashing ............................................................................................................. 85.4. Reinstallation of USB DFU bootloader ............................................................. 9
xmega.Dip
iv
List of Figures4.1. Overview ................................................................................................................... 54.2. xmega.Dip Schematics ............................................................................................. 64.3. Power supply voltage selection ................................................................................ 75.1. Debugging ................................................................................................................ 8
Introduction
1
1. IntroductionThe xmega.Dip is a breakout board for the ATxmega A4U Microcontroller with fully wiredMicro-USB connector which serves as power supply.
All available pins of the xmega microprocessor are accessible and the operating voltagecan be changed from 3.3V (default) to 1.8V for ultra low power mode.
The Atmel DFU bootloader is already installed so that you can easily flash your softwarevia USB.
Scope
2
2. ScopeThis document describes the characteristics of the taskit xmega.Dip board, lists themost important key features of the ATxmega microcontroller and gives some hints fordevelopment.
The ATxmega microcontroller with the AVR core itself is descriped in deep in the Atmeldocumentation which is available on the Atmel webpage: Atmel AVR XMEGA AU ManualManual [http://www.atmel.com/products/microcontrollers/avr/AVR_XMEGA.aspx].
Key Features
3
3. Key FeaturesFeatures of the xmega.Dip board
• All ATxmega pins brought out to clearly labelled headers
• All parts except the header pins are pre-soldered
• Fits in standard breadboards
• Micro USB connector with USB and power supply functionality
• Supply voltage regulator for 3.3V or 1.8V to support ultra low power mode
• Program (USB bootloader) and reset button
Key features of the ATxmega A4U microprocessor
• 0-32 MIPS
• up to 128KiB FLASH (bootloader on seperate 4KiB flash)
• up to 8KiB SRAM
• up to 2KiB EEPROM
• DMA Controller
• Event System
• 5 sleep Modes
• USB 2.0 full speed (up to 32 endpoints)
• Atmel Studio free of charge
• Sub $50 general debugger AVR Dragon available
• Programm and debug interface (PDI) (fully supported by Atmel (R) Studio 6)
• 100nA low leakage process technology
• AES and DES engine
• USART, SPI, TWI
• 12 bit ADC and DAC
• Analog Comperator
• CRC generator
• 16 bit timer/counter
Key Features
4
• 16 bit real time counter
• Watchdog timer
• Multi level interrupt controller
• 34 GPIO pins with pull settings and a-/synchronous interrupts (wake from each sleepmode)
Board Description
5
4. Board Description
4.1. Overview
Figure 4.1. Overview
4.2. Pinout / Schematics
The following circuit diagram is intended for reference only and does not dispense theuser from checking and applying the appropriate standards. No warranty can be grantedif parts of the circuit are used in customer applications.
Board Description
6
A-0
3
20.1
03.0
1
t.r.
xm
ega.D
ip
Revis
ion:
LP-N
r.:
Auto
r:
Datu
m:
Tel. +
49 (
0)3
0 6
11295-0
F
ax.
+49 (
0)3
0 6
11295-1
0
Pro
jekt:
Seite:
Funktion:
ALL
23.0
3.2
012
1
1
/
(C)
taskit G
mbH
Gro
ß-B
erlin
er
Dam
m 3
7,
D-1
2487 B
erlin
DNP
DNP
VCC=
1.8
V
VCC=
3.3
V
DNP
DNP
DNP
DNP
DNP
DNP
40
PA0(A
DC0/A
C0/A
REF)
41
PA1(A
DC1/A
C1)
42
PA2(A
DC2/A
C2)
43
PA3(A
DC3/A
C3)
44
PA4(A
DC4/A
C4)
1
PA5(A
DC5/A
C5)
2
PA6(A
DC6/A
C6/A
C1O
UT)
3
PA7(A
DC7/A
C7/A
C0O
UT)
4
PB0(A
DC8/A
REF)
5
PB1(A
DC9)
6
PB2(A
DC10/D
AC0)
7
PB3(A
DC11/D
AC1)
10
PC0(O
C0A/O
C0ALS/S
DA)
11
PC1(O
C0B/O
C0AH
S/X
CK0/S
CL)
12
PC2(O
C0C/O
C0BLS/R
XD
0)
13
PC3(O
C0D
/OC0BH
S/T
XD
0)
14
PC4(O
C0CLS/O
C1A/S
S)
15
PC5(O
C0CH
S/O
C1B/X
CK1/M
OSI)
16
PC6(O
C0D
LS/R
XD
1/M
ISO
/CLKRTC)
17
PC7(O
C0D
HS/T
XD
1/S
CK/C
LKPER/E
VO
UT)
20
PD
0(O
C0A)
21
PD
1(O
C0B/X
CK0)
22
PD
2(O
C0C/R
XD
0)
23
PD
3(O
C0D
/TXD
0)
24
PD
4(O
C1A/S
S)
25
PD
5(O
C1B/X
CK1/M
OSI)
26
PD
6(D
-/RXD
1/M
ISO
)
27
PD
7(D
+/T
XD
1/S
CK/C
LKPER/E
VO
UT)
28
PE0(O
C0A/S
DA)
29
PE1(O
C0B/X
CK0/S
CL)
32
PE2(O
C0C/R
XD
0)
33
PE3(O
C0D
/TXD
0)
34
PD
I(PD
I_D
ATA)
35
RESET(P
DI_
CLO
CK)
36
PRO
(XTAL2/T
OSC2)
37
PR1(X
TAL1/T
OSC1)
39
AVCC
38
GN
D
9
VCC
8
GN
D
19
VCC
18
GN
D
31
VCC
30
GN
D
45
EXP
IC1
ATXM
EG
AXXA4U
-QFN
1
I/O1
2
GND
3
I/O2
6
I/O4
5
VCC
4
I/O3
D1
PRTR5V0U4D
1
3
2
4
Q1
12M
Hz
R1
220r
1
2
Q2
32.7
68 k
Hz, 7pF
FB
1
BL
M1
8P
G2
21
SN
1
1
VBUS
2
D-
3
D+
4
ID
5
GN
D
6
GND
7
GND
8
GND
9
GND
X1
USB_M
ICRO
-B
1
PA0(A
DC0/A
C0/A
REF)
2
PA1(A
DC1/A
C1)
3
PA2(A
DC2/A
C2)
4
PA3(A
DC3/A
C3)
5
PA4(A
DC4/A
C4)
6
PA5(A
DC5/A
C5)
7
PA6(A
DC6/A
C6/A
C1O
UT)
8
PA7(A
DC7/A
C7/A
C0O
UT)
9
PB0(A
DC8/A
REF)
10
PB1(A
DC9)
11
PB2(A
DC10/D
AC0)
12
PB3(A
DC11/D
AC1)
13
PC0(O
C0A/O
C0ALS/S
DA)
14
PC1(O
C0B/O
C0AH
S/X
CK0/S
CL)
15
PC2(O
C0C/O
C0BLS/R
XD
0)
16
PC3(O
C0D
/OC0BH
S/T
XD
0)
17
PC4(O
C0CLS/O
C1A/S
S)
18
PC5(O
C0CH
S/O
C1B/X
CK1/M
OSI)
19
PC6(O
C0D
LS/R
XD
1/M
ISO
/CLKRTC)
20
GN
D
40
VCC
39
GN
D
38
AVCC
35
(XTAL1/T
OSC1)P
R1
34
(XTAL2/T
OSC2)P
R0
37
(PD
I_CLO
CK)R
ESET
36
(PD
I_D
ATA)P
DI
33
(OC0D
/TXD
0)P
E3
32
(OC0C/R
XD
0)P
E2
31
(OC0B/X
CK0/S
CL)P
E1
30
(OC0A/S
DA)P
E0
29
(D+
/TXD
1/S
CK/C
LKPER/E
VO
UT)P
D7
28
(D-/
RXD
1/M
ISO
)PD
6
27
(OC1B/X
CK1/M
OSI)
PD
5
26
(OC1A/S
S)P
D4
25
(OC0D
/TXD
0)P
D3
24
(OC0C/R
XD
0)P
D2
23
(OC0B/X
CK0)P
D1
22
(OC0A)P
D0
21
(OC0D
HS/T
XD
1/S
CK/C
LKPER/E
VO
UT)P
C7
X3
XM
EG
A-D
IP40
7
IN
8
CTL3
1
CTL2
2
CTL1
3
CTL0
6
LX
4
OU
T
5
GN
D
IC2
SC195
C1
10uF/10V/X5R
L1
1.0
uH
1200m
A
C2
22uF/6V3/X5R
Q3
HC-4
9U
S
S1
TASTER-F
SM
SM
S2
TASTER-F
SM
SM
LED
1
RED
C7
4u7F/6
V3/X
5R
C8
18pF 5
0V C
0G
C9
18pF 5
0V C
0G
FB
2
BL
M1
8P
G2
21
SN
1
R2
0r
R3
0r
1
2
X12
1
2
X11
R4
10k
R5
10k
C3
100n/1
6V/X
7R
C4
100n/1
6V/X
7R
C5
100n/1
6V/X
7R
C6
100n/1
6V/X
7R
1
X2
HEADER1
VBU
S
VBU
S
PD6
PD7
PC3
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD0
PD1
PD
2
PD
3
PD
4
PD
5
PD
6
PD
7
PE0
PE1
PE2
PE3
PD
I
RES
PR0
PR1
VCC
AVCC
VCC
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD
7
PD
6
PD
5
PD
4
PD
3
PD
2
PD
1
PD
0
PE0
PE1
PE2
PE3
PD
I
RES
PR0
PR1
VCC
VCC
VCC
AVCC
PR0
PR1
VBU
S
VCC
VCC
VBUS
RES
PC3
VCC
VCC
VBUS
Figu
re 4
.2. x
meg
a.D
ip S
chem
atic
s
Board Description
7
4.3. Power supply voltage selection
The supply voltage of the ATxmega microprocessor can be changed in order to activatethe most efficient power saving modes. This is done by moving the 0-Ohm resistor.
Figure 4.3. Power supply voltage selection
4.4. Operating temperature
-30 °C to +85 °C
4.5. Dimensions
Usage
8
5. UsageTo write, compile, debug and install applications for the xmega.Dip we recommend usingthe Atmel Studio 6 or higher together with the Atmel AVR Dragon board and the Windowsapplication FLIP from Atmel.
5.1. Development
The Atmel Studio 6 [http://www.atmel.com/microsite/atmel_studio6/default.aspx] is freeof charge (only registration required) and can be downloaded on the Atmel website. Itcontains the ASF to insert ready to use drivers (inclusive QuickStartGuide) for componentslike clock, timers, USB (HID, CDC, MSC).
ASF - Atmel Software Framework
ASF is only available after creating a project with an AtmelBoard or UserBoard.
5.2. Debugging
With the Atmel Studio 6 and the Atmel AVR Dragon board [http://www.atmel.com/tools/AVRDRAGON.aspx] it is possible to flash and debug the currently developed applicationon the xmega.Dip.
Connect the AVR Dragon board to the USB port and it will be recognized by the AtmelStudio and you should update it there first (Tools->AVR Firmware Tools Update).
Connect the xmega.Dip to USB (power supply) and to the ISP interface of the AVR Dragonboard. Then you can select interface PDI (Project->Project Properties->Tool)
Figure 5.1. Debugging
5.3. Flashing
The Atmel DFU bootlader FLIP [http://www.atmel.com/tools/FLIP.aspx] is already pre-installed so that the xmega.Dip can be programmed immediately via USB with the desiredapplication. To do that do the following:
1. Start Flip
2. Click on "Select->Device" and shooce the correct device from the list
3. Press the PGM button on the xmega.Dip or short circuit PC3 with GND
Usage
9
4. Press the Reset button or short circuit RST with GND and release it or remove powersupply for a second
5. Press CTRL+U and click on "Open" -> the signature bytes should be displayed in FLIP
6. Press CTRL+L and select the HEX file to programm
7. Click on the "Run" button (bottom left) and the device should be programmed withinseconds
Atmel FLIP
FLIP version 3.4.5 or higher is required in order to use FLIP with xmega boards.
When FLIP is installed, the installation folder contains the driver (.inf)for windows, which is requested when the board is started in DFU(Device Firmware Upgrade: Atmel AVR1916) mode (see section "Flashing")to install applications. [http://www.atmel.com/products/microcontrollers/avr/avr_xmega.aspx?tab=documents]
5.4. Reinstallation of USB DFU bootloader
During development with the Atmel Studio 6 the bootloader may be deleted. In this caseinstall it again when the development is finished again:
1. In the Atmel Studio select "Tools->"Device Programming"
2. Select the used board and interface ("AVR Dragon" and "PDI") and click Apply
3. Connect the xmega.Dip board via PDI and supply power to it
4. Click in "Device signature - Read" -> the device signature should be displayed
5. Click on Memories on the left
6. In the "Flash" panel select the Atmel DFU bootloader file (At least version 1.03:AVR1916.zip [http://www.atmel.com/products/microcontrollers/avr/avr_xmega.aspx?tab=documents])
7. Click on "Programm"