X-ray Inspectipn of BTCs
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Transcript of X-ray Inspectipn of BTCs
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X-Ray Inspection of Bottom Terminated
Components-QFNs, LGAs
Bob Wettermann, MITNovember 2017
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Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
X-Ray Inspection-BTCs 610 G Criteria
You DO NOT HAVE to x-ray inspect BTCs according to the IPC-A-610G
CHOICEA.Develop process. Validate process using x-ray. Sample plan inspection. Need to have objective
evidenceOR
B. Inspect via x-ray
Note: X-ray equipment not intended for electronic assemblies or not properly set up can damage sensitive assemblies
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Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
IPC-7093 Inspection Guidelines
x-ray should be used to establish process parameters
x-ray should be used when there is a high proportion of hidden solder joints like on BTCs
x-ray should be used when there are a significant number of untestable solder joints
x-ray should be used when there are numerous fanout vias which are inaccessible or there are mirror BTCs
THESE ARE GUIDELINES (SUGGESTIONS) AND NOT INSPECTION
CRITERIA
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RECOMMEND – Discussing void criteria with customer else use BGA criteria of max 30% in inspection area
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![Page 6: X-ray Inspectipn of BTCs](https://reader031.fdocuments.in/reader031/viewer/2022021815/5a64b9777f8b9a76038b46f1/html5/thumbnails/6.jpg)
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Shorts
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Show Integrity of Bond Wires
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Solder balls
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Insuff icient Solder
![Page 10: X-ray Inspectipn of BTCs](https://reader031.fdocuments.in/reader031/viewer/2022021815/5a64b9777f8b9a76038b46f1/html5/thumbnails/10.jpg)
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More on Voiding
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Your BEST choice in PCB Test/ Rework/Repair and Solder Training & Tools www.solder.net
More on Voiding
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X-Ray Inspection of Bottom Terminated
Components-QFNs, LGAs
Bob Wettermann, MITNovember 2017