X-ray Inspection of Plated Throughhole Devices
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Transcript of X-ray Inspection of Plated Throughhole Devices
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X-Ray Inspection of Plated Throughhole Using X-ray
Bob Wettermann, MITNovember 2017
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X-Ray Inspection-Plated Throughholes IPC-A-
610 G CriteriaYou DO NOT HAVE to x-ray inspect BTCs
according to the IPC-A-610 G
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Plated Throughhole
Table 7-4 Plated-Through Holes with Component Leads - Minimum Acceptable Solder Conditions1
Criteria Class 1 Class 2 Class 3
A.
Vertical fill of solder for component with less than 14 leads2,3 (see 7.3.5.1)
Not Specified
75%
75%Vertical fill of solder for component with 14 leads or more2,3 (see 7.3.5.1)
50% or 1.2 mm [0.05 in],
whichever is lessNote 2. The 25% unfilled height includes both source and destination side depressions.Note 3: Less than 100% solder fill may not be acceptable in some applications, e.g., thermal shock, electrical performance. The user is responsible for identifying these situations to the manufacturer.
IPC–A-610 Rev G
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Plated Throughhole 50% Hole Fil l
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Plated Throughhole >75% Hole Fil l
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Plated ThroughholeNon-inspectable visually
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Plated Throughhole x-ray
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Plated Throughhole x-ray
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Improper Fil l
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QC and Measurement
Screening Criteria Using x-ray
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Voids in Throughhole
Courtesy of NPL