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Writing Engineering Abstracts(34)

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:(+)

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(1 of 2) (+) As an integral part of thecurrent mode dc to dc system, the current sensing blockinfluences the stability of a close loop and contributes tothe non-linearity of output voltage significantly. However,the conventionally adopted current sensing block varies

with process, temperature and power supply at a range of10-30%. Therefore, this work describes a novelsensing circuit that can ensure proportionality of the currentflowing through power mos and can also be modifiedaccording to the voltage value of the current. A high

speed and easily implemented sensing circuit is analyzedunder various loading currents and linear variations withthe loading current. The sensing value is then only slightlyaltered less than during simulation with varioustemperatures. Next, the value of variation in the sensingcircuit is considered acceptable during simulation with

various process models.

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(2 of 2)Analysis results indicate that, givenvarious process models and temperatures, the value ofvariation in the proposed sensing circuit is lower than 1%.Additionally, the sensing value is linear with the loadingcurrent. Importantly, the proposed

sensing circuit facilitates the precise measurement of thecurrent in various sizes of power mos. Moreover, thesensing circuit can be embedded in a chip without the needfor an outer resistor, as required by the conventionalmethod. Such features ensure that its reliable application

complies with consumer specifications.

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(1 of 2) (+) Process variation hassignificantly abated loss of product yield. However, giventhe instability and inaccuracy of production equipment, fabsare especially problematic in process control. Given theconstant role of process variation in manufacturing, a small

percentage of product yield loss occurs in manufacturingICs, ultimately increasing the retail costs of IC products. Therefore, this work presents an analysis method toclarify the variation of process parameters and productyield rate are related, e.g., resistors, using various resistor

widths on a circuit layout. Product yield rate isanalyzed by placing the product with various resistor widthson different wafers that were to be manufactured in a fab.The yield rate of these wafers is then monitored, with theoptimal resistor width obtained when the wafer yield rate isthe highest.

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(2 of 2) Simulation results indicate that theproposed analysis method allows the optimal resistor widthto reduce the influence on product yield rate when theresistors vary, thus increasing product yield rate. By varying the process parameters, the

proposed method can analyze the variation in product yieldrate, thus decreasing the overhead manufacturing costsand increasing market competitiveness.

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